# US 2014/0192501 A1 · Modified siloxane compound having aromatic azomethine, thermosetting resin composition including thereof, prepreg, film having resin, laminate, multi-layer printed wiring board, and semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0192501 A1 - Document ID: US20140192501A1 - Status: Published application - Kind: A1 - Application number: 14/093,174 - Filed: 2013-11-29 - Published: 2014-07-10 - Earliest claimed: 2012-11-28 - Assignees: Hitachi Chemical Company, Ltd. - Applicants: Hitachi Chemical Company, Ltd. - Inventors: Tomohiko KOTAKE; Shunsuke NAGAI; Shintaro HASHIMOTO; Shinichiro ABE; Masato MIYATAKE; Shin TAKANEZAWA; Hikari MURAI - Web page: https://patentgrep.com/patent/US20140192501A1 ## CPC - C08G 73/106: {containing silicon} - C08G 12/08: aromatic - H05K 1/0326: {containing O} - H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)} - H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} - H05K 2201/0162: Silicon containing polymer, e.g. silicone - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein R1 and R2 independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; x and y independently represent an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein R3 and R4 independently represent an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100. ## Claims ### Claim 1 A siloxane compound containing structures represented by the following general formulae (1) and (2): wherein each of R1 and R2 independently represents a hydrogen atom, a halogen atom, an alkyl group having from 1 to 3 carbon atoms, a halogenated alkyl group, a thiol group, an acetyl group, a hydroxyl group, a sulfonic acid group, a sulfoalkoxyl group having from 1 to 3 carbon atoms, or an alkoxyl group having from 1 to 3 carbon atoms; each of x and y independently represents an integer of from 0 to 4; and A represents a single bond or an azomethine group, an ester group, an amide group, an azoxy group, an azo group, an ethylene group, or an acetylene group, and wherein each of R3 and R4 independently represents an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of from 1 to 100. ### Claim 2 (depends on 1) The siloxane compound according to claim 1, further containing an aromatic azomethine. ### Claim 3 (depends on 2) The siloxane compound according to claim 2, obtained by allowing an aromatic amine compound (A) having at least two primary amino groups in one molecule thereof, an aromatic aldehyde compound (B) having at least two aldehyde groups in one molecule thereof, and a siloxane compound (C) having at least two amino groups in a molecular terminal thereof to react with each other. ### Claim 4 (depends on 2) The siloxane compound according to claim 2, obtained by allowing an aromatic amine compound (A) having at least two primary amino groups in one molecule thereof and an aromatic aldehyde compound (B) having at least two aldehyde groups in one molecule thereof to react with each other, followed by reaction with a siloxane compound (C) having at least two amino groups in a molecular terminal thereof. ### Claim 5 (depends on 2) The siloxane compound according to claim 2, obtained by allowing an aromatic aldehyde compound (B) having at least two aldehyde groups in one molecule thereof and a siloxane compound (C) having at least two amino groups in a molecular terminal thereof to react with each other, followed by reaction with an aromatic amine compound (A) having at least two primary amino groups in one molecule thereof. ### Claim 6 (depends on 1) A modified imide resin having an aromatic azomethine, obtained by allowing the siloxane compound according to claim 1 and a maleimide compound (D) having at least two N-substituted maleimide groups in one molecule thereof to react with each other. ### Claim 7 (depends on 6) The modified imide resin according to claim 6, further having an acidic substituent, the acidic substituent being derived from an acidic substituent of an amine compound (E) represented by the following general formula (3): wherein each R5 independently represents a hydroxyl group, a carboxyl group, or a sulfonic acid group, each of which is an acidic substituent; each R6 independently represents a hydrogen atom, an aliphatic hydrocarbon group having from 1 to 5 carbon atoms, or a halogen atom; x represents an integer of from 1 to 5; and y represents an integer of from 0 to 4, provided that the sum of x and y is 5. ### Claim 8 (depends on 1) A thermosetting resin composition containing the siloxane compound according to claim 1 and a maleimide compound (D) having at least two N-substituted maleimide groups in one molecule thereof. ### Claim 9 (depends on 8) The thermosetting resin composition according to claim 8, further containing an amine compound (E) having an acidic substituent, which is represented by the following general formula (3): wherein each R5 independently represents a hydroxyl group, a carboxyl group, or a sulfonic acid group, each of which is an acidic substituent; each R6 independently represents a hydrogen atom, an aliphatic hydrocarbon group having from 1 to 5 carbon atoms, or a halogen atom; x represents an integer of from 1 to 5; and y represents an integer of from 0 to 4, provided that the sum of x and y is 5. ### Claim 10 (depends on 8) The thermosetting resin composition according to claim 8, further containing a thermoplastic elastomer (F). ### Claim 11 (depends on 8) The thermosetting resin composition according to claim 8, further containing at least one thermosetting resin (G) selected from an epoxy resin and a cyanate resin. ### Claim 12 (depends on 8) The thermosetting resin composition according to claim 8, further containing an inorganic filler (H). ### Claim 13 (depends on 8) The thermosetting resin composition according to claim 8, further containing a curing accelerator (I). ### Claim 14 (depends on 8) A prepreg comprising a base material impregnated with the thermosetting resin composition according to claim 8. ### Claim 15 (depends on 8) A film with resin comprising a support subjected to layer forming with the thermosetting resin composition according to claim 8. ### Claim 16 (depends on 14) A laminated plate, obtained by subjecting the prepreg according to claim 14 to laminate molding. ### Claim 17 (depends on 15) A laminated plate, obtained by subjecting the film with resin according to claim 15 to laminate molding. ### Claim 18 (depends on 16) A multilayer printed wiring board, prepared using the laminated plate according to claim 16. ### Claim 19 (depends on 18) A semiconductor package comprising a semiconductor device mounted on the multilayer printed wiring board according to claim 18.