# US 2014/0192500 A1 · Method of Electrophoretic Depositing (EPD) a Film on an Exposed Conductive Surface and an Electric Component Thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0192500 A1 - Document ID: US20140192500A1 - Status: Published application - Kind: A1 - Application number: 13/738,833 - Filed: 2013-01-10 - Published: 2014-07-10 - Earliest claimed: 2013-01-10 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Sung Hoe Yeong; Lay Yeap Lim; Tien Shyang Law - Web page: https://patentgrep.com/patent/US20140192500A1 ## CPC - C25D 13/12: characterised by the article coated - C09D 5/4411: {Homopolymers or copolymers of acrylates or methacrylates} - C09D 5/4457: {containing special additives, e.g. pigments, polymeric particles} - C09D 7/61: inorganic - H10W 74/01: Manufacture or treatment - H10W 74/40: characterised by their materials - C08K 2003/2227: {of aluminium} - C08K 2003/385: {Binary compounds of nitrogen with boron} - H10W 74/131: {the semiconductor body being only partially enclosed} - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component disposed on the component carrier and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K. ## Claims ### Claim 1 A system comprising: a component carrier; a component disposed on the component carrier; and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K. ### Claim 2 (depends on 1) The system according to claim 1, wherein the polymer comprises an epoxy resin and the inorganic material comprises boron nitride. ### Claim 3 (depends on 1) The system according to claim 1, wherein the polymer comprises an epoxy resin and the inorganic material comprises aluminum oxide. ### Claim 4 (depends on 1) The system according to claim 1, wherein the polymer comprises an acrylic resin and the inorganic material comprises boron nitride. ### Claim 5 (depends on 1) The system according to claim 1, wherein the polymer comprises an acrylic resin and the inorganic material comprises aluminum oxide. ### Claim 6 (depends on 1) The system according to claim 1, wherein the electrically conductive surface is a heat sink, and wherein the heat sink is a portion of the component carrier. ### Claim 7 (depends on 6) The system according to claim 6, wherein the insulating layer comprises a thickness of less than 35 μm. ### Claim 8 A method for manufacturing a packaged component, the method comprising: placing a component on a component carrier; encapsulating with an encapsulation body at least a portion of the component and the component carrier; and electrophoretic co-depositing organic molecules and inorganic elements thereby forming an insulating film on a conductive surface of the component, the component carrier or the encapsulation body. ### Claim 9 (depends on 8) The method according to claim 8, further comprising electrophoretic co-deposited organic molecules and the inorganic elements thereby forming the insulating film as a polymer film comprising the inorganic elements. ### Claim 10 (depends on 8) The method according to claim 8, wherein electrophoretic co-depositing comprises partially immersing the packaged component into a liquid medium of an electrophoretic deposition tool. ### Claim 11 (depends on 8) The method according to claim 8, wherein electrophoretic co-depositing comprises completely immersing the packaged component into a liquid medium of an electrophoretic deposition tool. ### Claim 12 (depends on 8) The method according to claim 8, wherein the organic molecules are an epoxy resin or an acrylic resin. ### Claim 13 (depends on 12) The method according to claim 12, wherein the inorganic elements comprise boron nitride or aluminum oxide. ### Claim 14 A packaged component comprising: a component carrier; a component disposed on the component carrier; an encapsulation body at least partially encapsulating the component carrier and the component; and an insulating layer disposed on a heat sink of the component carrier, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K. ### Claim 15 (depends on 14) The packaged component according to claim 14, wherein the polymer comprises an epoxy resin and the inorganic material comprises boron nitride. ### Claim 16 (depends on 14) The packaged component according to claim 14, wherein the polymer comprises an epoxy resin and the inorganic material comprises aluminum oxide. ### Claim 17 (depends on 14) The packaged component according to claim 14, wherein the polymer comprises an acrylic resin and the inorganic material comprises boron nitride. ### Claim 18 (depends on 14) The packaged component according to claim 14, wherein the polymer comprises an acrylic resin and the inorganic material comprises aluminum oxide. ### Claim 19 (depends on 14) The packaged component according to claim 14, wherein the component carrier is a leadframe and the component comprises a power semiconductor chip. ### Claim 20 (depends on 19) The packaged component according to claim 19, wherein the component further comprises a logic chip disposed on the power semiconductor chip.