# US 2014/0192499 A1 · Semiconductor device and printed circuit board

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- Number: US 2014/0192499 A1
- Document ID: US20140192499A1
- Status: Published application
- Kind: A1
- Application number: 14/237,420
- Filed: 2012-09-13
- Published: 2014-07-10
- Earliest claimed: 2011-09-14
- Assignees: Canon Kabushiki Kaisha
- Inventors: Naoki Yasuda
- Web page: https://patentgrep.com/patent/US20140192499A1

## CPC

- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 90/00: Package configurations
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/722: {between stacked chips}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Provided is a compact semiconductor device having high joint reliability of multiple first ball electrodes arrayed on one surface of a first interposer. On a surface (233a) of a second interposer (233) facing a first interposer (213), second ball electrodes (235) are arranged at grid points at which multiple first straight lines extending in one direction are intersected with multiple second straight lines extending in a direction different from the multiple first straight lines. Corner grid points closest to the corners of the second interposer (233) are set as non-joint grid points at which the first and second interposers (213, 233) are not joined to each other.

## Claims

### Claim 1

A semiconductor device, comprising:
a first interposer on which a first semiconductor element is mounted;
multiple first ball electrodes, which are arrayed at grid points of matrix on one surface of the first interposer;
a second interposer on which a second semiconductor element is mounted, the second interposer being stacked on the first interposer; and
multiple second ball electrodes, which are arrayed at grid points of matrix on a surface of the second interposer facing the first interposer, for joining the second interposer to the first interposer,
wherein, the first interposer and the second interposer are not joined to each other at a corner grid point closest to a corner of the second interposer.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, further comprising electrode pads, which are formed at the corner grid point closest to the corner of the second interposer and are formed on a surface of the first interposer facing the corner grid point.

### Claim 3

A semiconductor device, comprising:
a first interposer on which a first semiconductor element is mounted;
multiple first ball electrodes, which are arrayed at grid points of matrix on one surface of the first interposer;
a second interposer on which a second semiconductor element is mounted, the second interposer being stacked on the first interposer; and
multiple second ball electrodes, which are arrayed at grid points of matrix on a surface of the second interposer facing the first interposer, for joining the second interposer to the first interposer,
wherein, in a case where, among four grid points that form a minimum unit grid of one of the multiple first ball electrodes closest to a corner of the first interposer,
three grid points excluding a grid point closest to the corner of the first interposer are projected on the second interposer,
the first interposer and the second interposer positioned at a grid point in a region surrounded by two straight lines passing through a projection point farthest from a corner of the second interposer closest from the corner of the first interposer among three projection points and through remaining two projection points, respectively, and by two side edges which are intersected with each other at the corner of the second interposer are not connected to second ball electrodes joined to each other.

### Claim 4 (depends on 3)

The semiconductor device according to claim 3, further comprising electrode pads, which are formed at the corner grid point closest to the corner of the second interposer and are formed on a surface of the first interposer facing the corner grid point.

### Claim 5

A printed circuit board, comprising:
a printed wiring board;
a semiconductor device on which the semiconductor device is mounted;
a first interposer on which a first semiconductor element is mounted;
multiple first ball electrodes, which are arrayed at grid points of matrix on one surface of the first interposer and joined to the printed wiring board;
a second interposer on which a second semiconductor element is mounted, the second interposer being stacked on the first interposer; and
multiple second ball electrodes, which are arrayed at grid points of matrix on a surface of the second interposer facing the first interposer, for joining the second interposer to the first interposer,
wherein, the first interposer and the second interposer are not joined to each other at a corner grid point closest to a corner of the second interposer.

### Claim 6 (depends on 5)

The printed circuit board according to claim 5, further comprising electrode pads, which are formed at the corner grid point closest to the corner of the second interposer and are formed on a surface of the first interposer facing the corner grid point.

### Claim 7

A printed circuit board, comprising:
a printed wiring board;
a semiconductor device on which the semiconductor device is mounted;
a first interposer on which a first semiconductor element is mounted;
multiple first ball electrodes, which are arrayed at grid points of matrix on one surface of the first interposer and joined to the printed wiring board;
a second interposer on which a second semiconductor element is mounted, the second interposer being stacked on the first interposer; and
multiple second ball electrodes, which are arrayed at grid points of matrix on a surface of the second interposer facing the first interposer, for joining the second interposer to the first interposer,
wherein, in a case where, among four grid points that form a minimum unit grid of one of the multiple first ball electrodes closest to a corner of the first interposer, three grid points excluding a grid point closest to the corner of the first interposer are projected on the second interposer, the first interposer and the second interposer positioned at a grid point in a region surrounded by two straight lines passing through a projection point farthest from a corner of the second interposer closest from the corner of the first interposer among three projection points and through remaining two projection points, respectively, and by two side edges which are intersected with each other at the corner of the second interposer are not connected to second ball electrodes joined to each other.

### Claim 8 (depends on 7)

The printed circuit board according to claim 7, further comprising electrode pads, which are formed at the corner grid point closest to the corner of the second interposer and are formed on a surface of the first interposer facing the corner grid point.