# US 2014/0192487 A1 · Circuitry arrangement for reducing a tendency towards oscillations

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- Number: US 2014/0192487 A1
- Document ID: US20140192487A1
- Status: Published application
- Kind: A1
- Application number: 14/210,697
- Filed: 2014-03-14
- Published: 2014-07-10
- Earliest claimed: 2011-09-16
- Assignees: SMA Solar Technology AG
- Applicants: SMA Solar Technology AG
- Inventors: Regine Mallwitz
- Web page: https://patentgrep.com/patent/US20140192487A1

## CPC

- H05K 1/181: associated with surface mounted components
- H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections}
- H05K 1/0228: {Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245)}
- H05K 1/0234: {Resistors or by disposing resistive or lossy substances in or near power planes (H05K1/0246 takes precedence)}
- H05K 1/165: {incorporating printed inductors}
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H05K 1/0263: {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence)}
- H05K 2201/0723: provided by an inner layer of PCB
- H05K 2201/0792: Means against parasitic impedance; Means against eddy currents
- H05K 2201/083: Magnetic materials
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A circuitry arrangement includes several electronic parts mounted to a circuit board, at least one conductor section extending between the electronic parts within a first conductor layer, and a closed conductor loop comprising at least one loop section running in parallel to the at least one conductor section within a second conductor layer neighboring the first conductor layer. The closed conductor loop is configured to reduce a tendency towards oscillations of a current flowing through the conductor section in operation of the circuitry arrangement. The conductor loop is closed via at least one electronic component mounted to an outer surface of the circuit board.

## Claims

### Claim 1

A circuitry arrangement, comprising:
several electronic parts mounted to a circuit board;
at least one conductor section extending between the electronic parts within a first conductor layer, and configured to conduct a current tending towards oscillations flowing through the conductor section in operation of the circuitry arrangement; and
a closed conductor loop comprising at least one loop section extending in parallel to the at least one conductor section within a second conductor layer neighboring the first conductor layer;
wherein the at least one conductor section and the at least one loop section are facing each other across an isolation layer of the circuit board; and
wherein the closed conductor loop is closed via at least one electronic component mounted to an outer surface of the circuit board.

### Claim 2 (depends on 1)

The circuitry arrangement of claim 1, wherein the at least one electronic component is a Surface Mounted Device (SMD).

### Claim 3 (depends on 1)

The circuitry arrangement of claim 1, wherein the at least one electronic component is a passive electronic component.

### Claim 4 (depends on 3)

The circuitry arrangement of claim 3, wherein the at least one electronic component is a resistor.

### Claim 5 (depends on 1)

The circuitry arrangement of claim 1, wherein the second conductor layer extends below the outer surface of the circuit board.

### Claim 6 (depends on 1)

The circuitry arrangement of claim 1, wherein the electronic parts are mounted to the same outer surface of the circuit board to which the at least one electronic component closing the conductor loop is mounted.

### Claim 7 (depends on 1)

The circuitry arrangement of claim 1, wherein the conductor loop, at a region between terminals for the at least one electronic component, extends within the second conductor layer.

### Claim 8 (depends on 7)

The circuitry arrangement of claim 7, wherein the conductor loop is closed by means of exactly one electronic component mounted to the outer surface of the circuit board.

### Claim 9 (depends on 1)

The circuitry arrangement of claim 1, wherein an eigenfrequency of the conductor loop is tuned to a frequency of the oscillations of the current tending towards oscillations flowing through the at least one conductor section in operation of the circuitry arrangement by means of the electronic component mounted to the outer surface of the circuit board.

### Claim 10 (depends on 1)

The circuitry arrangement of claim 1, wherein the circuit board comprises a substrate selected from Direct Bonded Copper (DBC) substrates and Insulated Metal (ISM) substrates.

### Claim 11 (depends on 1)

The circuitry arrangement of claim 1, wherein the current tending towards oscillations flowing through the at least one conductor section in operation of the circuitry arrangement flows in opposite directions through a further conductor section of anti-parallel orientation, and wherein the conductor loop comprises loop sections of anti-parallel orientation each running in parallel to one of the conductor sections, respectively.

### Claim 12 (depends on 1)

The circuitry arrangement of claim 1, wherein the at least one conductor section and the at least one loop section together are at least partially shielded by a common electromagnetic shielding.

### Claim 13 (depends on 12)

The circuitry arrangement of claim 12, wherein the electromagnetic shielding comprises two-dimensional sections of a diamagnetic metallic material within further conductor layers of the circuit board.

### Claim 14 (depends on 1)

The circuitry arrangement of claim 1, wherein the at least one conductor section is part of a commutation circuit.

### Claim 15 (depends on 14)

The circuitry arrangement of claim 14, wherein the electronic parts include a semiconductor switch and wherein the commutation circuit is configured to support commutation of the semiconductor switch.

### Claim 16

A circuitry arrangement, comprising:
a circuit board having a first horizontal surface and as second, different horizontal surface;
first and second conductors extending longitudinally along the first horizontal surface of the circuit board, and electrically isolated from one another;
a plurality of electronic parts mounted across the first and second conductors, respectively, wherein during operation the plurality of electronic parts cause oscillating currents to conduct through the first and second conductors; and
a closed conductor loop formed on the second horizontal surface of the circuit board, wherein the closed conductor loop comprises at least one loop section, and wherein the closed conductor loop is closed via at least one electronic element mounted to one of the first and second horizontal surfaces of the circuit board.

### Claim 17 (depends on 16)

The circuitry arrangement of claim 16, wherein the first and second conductors and the closed conductor loop together are at least partially shielded by a common electromagnetic shielding.

### Claim 18 (depends on 16)

The circuitry arrangement of claim 16, wherein the electronic parts are mounted to the second horizontal surface of the circuit board.

### Claim 19

A circuitry arrangement, comprising:
a circuit board having a first horizontal surface, a second, different horizontal surface and first and second horizontal circuit planes, at least one of the circuit planes located between the first and second horizontal surfaces;
first and second conductors extending longitudinally along the first horizontal circuit plane of the circuit board, and electrically isolated from one another;
a plurality of electronic parts mounted across the first and second conductors, respectively, wherein during operation the plurality of electronic parts cause oscillating currents to conduct through the first and second conductors; and
a closed conductor loop formed in the second horizontal circuit plane of the circuit board, wherein the closed conductor loop comprises at least one loop section extending in parallel to one of the first and second conductors, and wherein the closed conductor loop is closed via at least one electronic element mounted to one of the first and second horizontal surfaces of the circuit board.

### Claim 20 (depends on 19)

The circuitry arrangement of claim 19, wherein the first and second conductors and the closed conductor loop together are at least partially shielded by a common electromagnetic shielding.