# US 2014/0192477 A1 · Storage system and printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0192477 A1 - Document ID: US20140192477A1 - Status: Published application - Kind: A1 - Application number: 14/111,690 - Filed: 2013-01-09 - Published: 2014-07-10 - Earliest claimed: 2013-01-09 - Assignees: Hitachi, Ltd. - Applicants: Hitachi, Ltd. - Inventors: Masatoshi Yoshihara - Web page: https://patentgrep.com/patent/US20140192477A1 ## CPC - H05K 1/0251: {related to vias or transitions between vias and transmission lines} - G11C 5/063: {Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay} - H05K 1/0245: {Lay-out of balanced signal pairs, e.g. differential lines or twisted lines} - H05K 1/0253: {Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K1/0251 takes precedence)} - H05K 3/366: {substantially perpendicularly to each other (H05K3/361 takes precedence)} - H05K 2201/09736: Varying thickness of a single conductor; Conductors in the same plane having different thicknesses - H05K 2201/10159: Memory - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G11C: STATIC STORES (semiconductor memory devices H10B) ## Abstract In the present invention, generation of occurrence of a wiring area is prevented, and a reflection by an inconsistency of a characteristic impedance of a high-speed signal line and a through hole connecting portion. By doing so, a conductor pattern of a raised shape is formed on each of front and back of a through hole, on a GND layer closest to the high-speed signal line in the vicinity of the connecting portion of the high-speed signal line and the through hole. Further, the conductor pattern is a trapezoidal shape, and is a shape which becomes wider as it becomes closer to the through hole. ## Claims ### Claim 1 A storage system, the storage system comprising: a first controller; a second controller; and a printed circuit board on which a signal line electrically connecting the first controller and the second controller is formed; wherein the printed circuit board comprises a signal layer on which the signal line is formed; a GND layer; an insulating layer which is layered on the GND layer; and a through hole which connects the signal lines together; and wherein a conductor pattern having a predetermined thickness is formed on the GND layer closest to the signal line, from before a connecting portion of the signal line and the through hole towards the connecting portion. ### Claim 2 (depends on 1) The storage system according to claim 1, wherein the signal line is a differential signal. ### Claim 3 (depends on 2) The storage system according to claim 2, the storage system comprising: a host communication control unit which provides a storage area constituted from a plurality of memory devices to a host system; a memory device control unit which controls the memory device; a control unit which controls the overall storage system; and a memory device communication control unit which performs communication between the memory device unit and the control unit. ### Claim 4 (depends on 3) The storage system according to claim 3, wherein the first controller is the control unit, and the second controller is the host communication control unit or the memory device communication control unit. ### Claim 5 (depends on 3) The storage system according to claim 3, wherein the first controller is the memory device communication control unit, and the second controller is the memory device control unit. ### Claim 6 (depends on 2) The storage system according to claim 2, wherein a shape of the conductor pattern is a trapezoidal shape with a width which becomes wider towards the connecting portion of the signal line and the through hole. ### Claim 7 (depends on 2) The storage system according to claim 2, wherein the conductor pattern is a stepwise shape with an identical width, which becomes thicker in a stepwise matter towards the connecting portion of the signal line and the through hole. ### Claim 8 (depends on 2) The storage system according to claim 2, wherein the conductor pattern is formed between the connection of the signal line and the through hole, and between a connection of the through hole and a signal line different from the signal line, so as to be symmetrical. ### Claim 9 A printed circuit board, the printed circuit board comprising: a signal layer on which the signal line is formed; a GND layer; an insulating layer which is laminated on the GNS layer; and a through hole which connects the signal lines together; wherein a conductor pattern having a predetermined thickness is formed on the GND layer closest to the signal line, from before a connecting portion of the signal line and the through hole towards the connecting portion. ### Claim 10 (depends on 9) The printed circuit board according to claim 9, wherein the signal line is a differential signal. ### Claim 11 (depends on 9) The printed circuit board according to claim 9, wherein a shape of the conductor pattern is a trapezoidal shape with a width which becomes wider towards the connecting portion of the signal line and the through hole. ### Claim 12 (depends on 9) The printed circuit board according to claim 9, wherein the conductor pattern is a stepwise shape with an identical width, which becomes thicker in a stepwise matter towards the connecting portion of the signal line and the through hole. ### Claim 13 (depends on 9) The printed circuit board according to claim 9, wherein the conductor pattern is formed between the connection of the signal line and the through hole, and between a connection of the through hole and a signal line different from the signal line, so as to be symmetrical. ### Claim 14 (depends on 13) The printed circuit board according to claim 13, wherein a shape in a horizontal direction of the conductor pattern is a trapezoidal shape with a width which becomes wider towards the connecting portion of the signal line and the through hole, and a shape in a perpendicular direction is a stepwise shape which becomes thicker in a stepwise manner towards the connecting portion of the signal line and the through hole. ### Claim 15 (depends on 13) The printed circuit board according to claim 13, wherein the signal line is a differential signal, and the conductor pattern is a stepwise shape with an identical width which becomes thicker in a stepwise manner towards the connecting portion of the signal line and the through hole, and is formed to each of a P-side and a N-side signal line of the differential signal.