# US 2014/0192476 A1 · Cooling apparatus with a resilient heat conducting member > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0192476 A1 - Document ID: US20140192476A1 - Status: Published application - Kind: A1 - Application number: 13/738,961 - Filed: 2013-01-10 - Published: 2014-07-10 - Earliest claimed: 2013-01-10 - Assignees: International Business Machines Corporation - Inventors: Timothy J. Chainer; Pritish R. Parida; Mark D. Schultz - Web page: https://patentgrep.com/patent/US20140192476A1 ## CPC - G06F 1/20: Cooling means - G06F 3/044: by capacitive means - H05K 7/20009: {using a gaseous coolant in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - H05K 7/20772: {within server blades for removing heat from heat source} - G06F 2203/04108: Touchless 2D- digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface without distance measurement in the Z direction - G06F 2203/04805: Virtual magnifying lens, i.e. window or frame movable on top of displayed information to enlarge it for better reading or selection - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path. ## Claims ### Claim 1 A cooling structure comprising: a thermally conducting central element having a channel formed therein, said channel being configured for flow of cooling fluid there through; a first pressure plate; and a first thermally conductive resilient member disposed between said thermally conducting central element and said first pressure plate, wherein said first pressure plate, said first thermally conductive resilient member, and said thermally conducting central element form a first heat transfer path. ### Claim 2 (depends on 1) The cooling structure of claim 1, further comprising: a second pressure plate; and a second thermally conductive resilient member disposed between said thermally conducting central element and said second pressure plate, wherein said second thermally conductive resilient member is disposed opposite said first thermally conductive resilient member with respect to said thermally conducting central element, and wherein said second pressure plate, said second thermally conductive resilient member, and said thermally conducting central element form a second heat transfer path. ### Claim 3 (depends on 1) The cooling structure of claim 1, wherein said first thermally conductive resilient member is formed by a folded metal sheet. ### Claim 4 (depends on 1) The cooling structure of claim 1, wherein said first thermally conductive resilient member applies a force creating contact between said first pressure plate and an external heat source. ### Claim 5 (depends on 1) The cooling structure of claim 1, wherein said first thermally conductive resilient member applies a force creating contact between said thermally conducting central element and said channel. ### Claim 6 (depends on 1) The cooling structure of claim 1, wherein said first thermally conductive resilient member is a separate component of said cooling structure and applies a force sufficient to maintain a disposition between said first pressure plate and said thermally conducting central element, wherein said first pressure plate is physically connected to an external heat source and said thermally conducting central element is physically connected to said channel. ### Claim 7 (depends on 1) The cooling structure of claim 1, wherein said first thermally conductive resilient member is formed by a stack of metal rings. ### Claim 8 (depends on 1) The cooling structure of claim 1, wherein said first thermally conductive resilient member comprises an elastomeric material layer. ### Claim 9 A computer memory system comprising: a substrate; a plurality of electronic modules connected to said substrate, wherein said plurality of electronic modules are disposed parallel relative to one another and vertically relative to said substrate; and a plurality of cooling structures, wherein each of said plurality of cooling structures is disposed between an adjacent pair of said plurality of electronic modules, each of said cooling structures comprising: a thermally conducting central element having a channel formed therein, said channel being configured for flow of cooling fluid there through; a first thermally conductive resilient member contacting said thermally conducting central element; a second thermally conductive resilient member contacting said thermally conducting central element, wherein said second thermally conductive resilient member is disposed opposite said first thermally conductive resilient member with respect to said thermally conducting central element; a first pressure plate contacting said first thermally conductive resilient member opposite said thermally conducting central element, wherein said first pressure plate, said first thermally conductive resilient member, and said thermally conducting central element form a first heat transfer path away from a first electronic module of said adjacent pair of said plurality of electronic modules; and a second pressure plate contacting said second thermally conductive resilient member opposite said thermally conducting central element, wherein said second pressure plate, said second thermally conductive resilient member, and said thermally conducting central element form a second heat transfer path away from a second electronic module of said adjacent pair of said plurality of electronic modules. ### Claim 10 (depends on 9) The computer memory system of claim 9, further comprising a pair of coolant plenums, wherein said plurality of cooling structures are connected between said pair of coolant plenums. ### Claim 11 (depends on 10) The computer memory system of claim 10, wherein a first coolant plenum of said pair of coolant plenums provides said cooling fluid to said plurality of cooling structures and a second coolant plenum of said pair of coolant plenums receives said cooling fluid from said plurality of cooling structures. ### Claim 12 (depends on 9) The computer memory system of claim 9, wherein said first thermally conductive resilient member applies a force creating contact between said first pressure plate and said first electronic module. ### Claim 13 (depends on 9) The computer memory system of claim 9, wherein said second thermally conductive resilient member applies a force creating contact between said second pressure plate and said second electronic module. ### Claim 14 (depends on 9) The computer memory system of claim 9, wherein said first thermally conductive resilient member and said second thermally conductive resilient member each comprise a respective folded metal sheet. ### Claim 15 (depends on 9) The computer memory system of claim 9, wherein said first thermally conductive resilient member and said second thermally conductive resilient member each comprise a respective stack of metal rings. ### Claim 16 (depends on 9) The computer memory system of claim 9, wherein said first thermally conductive resilient member and said second thermally conductive resilient member each comprise an elastomeric material layer. ### Claim 17 (depends on 9) The computer memory system of claim 9, wherein said plurality of electronic modules are each a Dual Inline Memory Module card. ### Claim 18 A method of cooling an electronic module comprising: providing a cooling structure disposed in contact with said electronic module; providing a cooling fluid flowing through a channel; and cooling said electronic module by conducting heat of said electronic module through said cooling structure and to said cooling fluid flowing through said channel, wherein said cooling structure comprises a thermally conductive resilient member forming a heat transfer path between said electronic module and said cooling fluid flowing through said channel. ### Claim 19 (depends on 18) The method of claim 18, wherein said cooling structure includes a thermally conducting central element having said channel formed therein, wherein said thermally conductive resilient member contacts said thermally conducting central element, and a pressure plate contacting said thermally conductive resilient member opposite said thermally conducting central element, wherein said pressure plate, said thermally conductive resilient member, and said thermally conducting central element form said heat transfer path conducting said heat of said electronic module to said cooling fluid flowing through said channel. ### Claim 20 (depends on 18) The method of claim 18, wherein said thermally conductive resilient member comprises a folded metal sheet conducting said heat of said electronic module. ### Claim 21 (depends on 18) The method of claim 18, wherein said thermally conductive resilient member comprises a stack of metal rings conducting said heat of said electronic module. ### Claim 22 (depends on 18) The method of claim 18, wherein said thermally conductive resilient member comprises an elastomeric material layer affecting a compliance of said thermally conductive resilient member.