# US 2014/0192474 A1 · Composite chassis for lowering surface temperature

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2014/0192474 A1
- Document ID: US20140192474A1
- Status: Published application
- Kind: A1
- Application number: 13/738,271
- Filed: 2013-01-10
- Published: 2014-07-10
- Earliest claimed: 2013-01-10
- Assignees: Dell Products L.P.
- Applicants: Dell Products L.P.
- Inventors: Travis C. North; Deeder M. Aurongzeb
- Web page: https://patentgrep.com/patent/US20140192474A1

## CPC

- G06F 1/203: {for portable computers, e.g. for laptops}
- G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]}
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An IHS chassis defines an IHS housing that houses a plurality of IHS components. The IHS chassis includes an outer surface located opposite the IHS chassis from the IHS housing. A first layer of the IHS chassis provides the outer surface of the IHS chassis. The first layer includes a first layer oxidized surface located opposite the first layer from the outer surface of the chassis base. A second layer of the chassis base is located immediately adjacent the IHS housing. The second layer includes a carbide-based composite material that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the IHS chassis.

## Claims

### Claim 1

An information handling system (IHS) chassis, comprising:
a chassis base defining an IHS housing that is operable to house a plurality of IHS components, wherein the chassis base includes an outer surface located opposite the chassis base from the IHS housing;
a first layer of the chassis base that provides the outer surface of the chassis base, wherein the first layer includes an first layer oxidized surface located opposite the first layer from the outer surface of the chassis base; and
a second layer of the chassis base that is located immediately adjacent the IHS housing, wherein the second layer includes a carbide-based composite material that is bonded with the first layer oxidized surface and that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the chassis base, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the chassis base.

### Claim 2 (depends on 1)

The IHS chassis of claim 1, wherein the carbide-based composite material includes a graphene material and a polymer material.

### Claim 3 (depends on 1)

The IHS chassis of claim 1, wherein the carbide-based composite material includes a graphene material, a polymer material, and an aerogel material.

### Claim 4 (depends on 1)

The IHS chassis of claim 1, wherein the second layer is less than 500 micrometers thick, and the first layer and the second layer have a combined thickness of 1 millimeter or less.

### Claim 5 (depends on 1)

The IHS chassis of claim 1, wherein the second layer includes a second layer oxidized surface that is bonded to the first layer oxidized surface.

### Claim 6 (depends on 5)

The IHS chassis of claim 5, wherein the second layer oxidized surface includes a graphene oxide material.

### Claim 7 (depends on 1)

The IHS chassis of claim 1, wherein the first layer includes one of an Aluminum material or a Magnesium material.

### Claim 8

An information handling system (IHS), comprising:
an IHS chassis including an outer surface and defining an IHS housing;
a processor located in the IHS housing;
a memory coupled to the processor and located in the IHS housing:
a first layer of the IHS chassis that provides the outer surface of the IHS chassis and includes a first layer oxidized surface located opposite the first layer from the outer surface of the IHS chassis; and
a second layer of the IHS chassis that is located immediately adjacent the IHS housing, wherein the second layer includes a carbide-based composite material and that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the chassis base.

### Claim 9 (depends on 8)

The IHS of claim 8, wherein the carbide-based composite material includes a graphene material and a polymer material.

### Claim 10 (depends on 8)

The IHS of claim 8, wherein the carbide-based composite material includes a graphene, a polymer material, and an aerogel material.

### Claim 11 (depends on 8)

The IHS of claim 8, wherein the second layer is less than 500 micrometers thick, and the first layer and the second layer have a combined thickness of 1 millimeter or less.

### Claim 12 (depends on 8)

The IHS of claim 8, wherein the second layer includes a second layer oxidized surfaced that is bonded to the first layer oxidized surface.

### Claim 13 (depends on 12)

The IHS of claim 12, wherein the second layer oxidized surface includes a graphene oxide material.

### Claim 14 (depends on 8)

The IHS of claim 8, wherein the first layer includes one of an Aluminum material or a Magnesium material.

### Claim 15

A method for providing an IHS chassis, comprising:
providing a first layer for a chassis base, wherein the first layer includes an outer surface of the chassis base;
oxidizing a first surface of the first layer that is located opposite the first layer from the outer surface of the chassis base to provide a first layer oxidized surface;
providing a second layer for the chassis base, wherein the second layer includes a carbide-based composite material that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the chassis base;
bonding the carbide-based composite material to the first layer oxidized surface such that the chassis base includes the outer surface provided by the first layer and the second layer located immediately adjacent the IHS housing.

### Claim 16 (depends on 15)

The method of claim 15, wherein the carbide-based composite material includes a graphene material and a polymer material.

### Claim 17 (depends on 15)

The method of claim 15, wherein the carbide-based composite material includes a graphene material, a polymer material, and an aerogel material.

### Claim 18 (depends on 15)

The method of claim 15, wherein the second layer is less than 500 micrometers thick, and the first layer and the second layer have a combined thickness of 1 millimeter or less.

### Claim 19 (depends on 15)

The method of claim 15, further comprising:
oxidizing a first surface of the second layer to provide a second layer oxidized surface, wherein the bonding the carbide-based composite material to the first layer oxidized surface includes bonding the second layer oxidized surface to the first layer oxidized surface.

### Claim 20 (depends on 19)

The method of claim 19, wherein the second layer oxidized surface includes a graphene oxide material.