# US 2014/0192464 A1 · Masking substrates for application of protective coatings > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0192464 A1 - Document ID: US20140192464A1 - Status: Published application - Kind: A1 - Application number: 14/157,684 - Filed: 2014-01-17 - Published: 2014-07-10 - Earliest claimed: 2013-01-08 - Assignees: HZO, Inc. - Applicants: HzO, Inc. - Inventors: David James Astle; Tyler Christensen Child; Vimal Kumar Kasagani; Cameron LaMar Loose; Blake LeRoy Stevens; Max Ernest Sorenson - Web page: https://patentgrep.com/patent/US20140192464A1 ## CPC - B23K 26/362: Laser etching - B05D 1/322: {Removable films used as masks} - B23K 26/0622: by shaping pulses - B23K 26/082: Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head - B23K 26/361: for deburring or mechanical trimming (B23K26/351 takes precedence) - B23K 26/402: involving non-metallic material, e.g. isolators - B24C 1/003: {using material which dissolves or changes phase after the treatment, e.g. ice, CO2} - B24C 3/322: {for electrical components} - C09J 9/00: Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence) - C23C 14/042: {using masks} - C23C 16/042: {using masks} - H05K 1/181: associated with surface mounted components - H05K 3/0079: {characterised by the method of application or removal of the mask (H05K3/0091 takes precedence)} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/288: {Removal of non-metallic coatings, e.g. for repairing} - H10P 72/04: {Apparatus for manufacture or treatment} - H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like} - H10W 74/01: Manufacture or treatment - H10W 74/014: {using batch processing} - B23K 2103/50: {Inorganic materials other than metals or composite materials} - C09J 2301/304: the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C - H05K 3/0073: {Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces} - H05K 3/285: {Permanent coating compositions} - H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] - H05K 2201/09872: Insulating conformal coating - H05K 2203/025: Abrading, e.g. grinding or sand blasting - H05K 2203/092: Particle beam, e.g. using an electron beam or an ion beam - H05K 2203/095: Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes - H05K 2203/107: Using laser light - H05K 2203/1105: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating - H05K 2203/163: Monitoring a manufacturing process - H10W 74/114: {by a substrate and the encapsulations} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02) - B24C: ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate. ## Claims ### Claim 1 A method for applying a protective coating to a substrate, comprising: preparing a mask material for application to a substrate; applying the mask material to at least one selected location of the substrate, the at least one selected location being a location to be exposed through a protective coating; and applying a force to the mask material to cause the mask material to substantially conform to a shape of the at least one selected location of the substrate; and applying the protective coating over the mask material. ### Claim 2 (depends on 1) The method of claim 1, wherein applying the mask material to at least one selected location of the substrate comprises applying the mask material to at least one selected location of an electronic assembly. ### Claim 3 (depends on 2) The method of claim 2, wherein applying the mask material comprises applying the mask material to a display, a lens, a button, a switch, a speaker or a receiver of the electronic assembly. ### Claim 4 (depends on 1) The method of claim 1, further comprising: applying a sealant to at least one of the mask material and the substrate to seal at least a peripheral portion of the mask material against the substrate. ### Claim 5 (depends on 4) The method of claim 4, wherein applying the sealant comprises applying an adhesive material to at least one of the mask material and the substrate. ### Claim 6 (depends on 5) The method of claim 5, wherein applying the adhesive material to at least one of the mask material and the substrate comprises applying a heated low temperature hot glue to at least one of the mask material and the substrate. ### Claim 7 (depends on 1) The method of claim 1, wherein applying the mask material comprises applying a preformed film to the at least one selected location of the substrate. ### Claim 8 (depends on 1) The method of claim 1, wherein applying the protective coating comprises applying a moisture-resistant coating to the substrate: ### Claim 9 (depends on 1) The method of claim 1, further comprising: removing at least a portion of the protective coating over the mask material. ### Claim 10 (depends on 9) The method of claim 9, wherein removing at least the portion of the protective coating comprises removing locations of the protective coating over or adjacent to a perimeter of the mask material. ### Claim 11 (depends on 10) The method of claim 10, further comprising: pulling at least the portion of the protective coating from the mask material or the substrate. ### Claim 12 (depends on 11) The method of claim 11, further comprising: pulling the mask material from the substrate, with a portion of the protective coating remaining on protected areas of the substrate. ### Claim 13 (depends on 1) The method of claim 1, further comprising: inserting a plug into at least one recess in the substrate before applying the protective coating. ### Claim 14 (depends on 13) The method of claim 13, further comprising: applying a seal around the plug to create a seal between the plug and the substrate at an opening of the at least one recess. ### Claim 15 (depends on 1) The method of claim 1, wherein preparing the mask material includes at least one of: stretching the mask material; heating the mask material; ### Claim 16 A method for protectively coating a substrate, comprising: applying a flowable mask material to at least one selected portion of a substrate to define a mask on the at least one selected portion of the substrate; applying a protective coating over the substrate and the mask; removing material from the protective coating over at least some locations of the mask; and removing at least a portion of the protective coating over the mask. ### Claim 17 (depends on 16) The method of claim 16, wherein applying the flowable mask material comprises applying the flowable mask material to an electronic assembly. ### Claim 18 (depends on 16) The method of claim 16, wherein applying the flowable mask material comprises applying a hot melt adhesive to at least one selected portion of the substrate. ### Claim 19 (depends on 16) The method of claim 16, wherein removing at least the portion of the protective coating comprises removing locations of the protective coating over or adjacent to a perimeter of the mask material. ### Claim 20 (depends on 19) The method of claim 19, further comprising: pulling at least the portion of the protective coating from the mask material or the substrate. ### Claim 21 (depends on 20) The method of claim 20, further comprising: pulling the mask material from the substrate, with a portion of the protective coating remaining on protected areas of the substrate. ### Claim 22 (depends on 16) The method of claim 16, further comprising: inserting a plug into at least one recess in the substrate before applying the protective coating. ### Claim 23 (depends on 22) The method of claim 22, further comprising: applying a seal around the plug to create a seal between the plug and the substrate at an opening of the at least one recess. ### Claim 24 An electronic assembly comprising: an electronic assembly; a mask over at least one selected portion of the electronic assembly, the mask conforming to a shape of the at least one selected portion; a protective coating over at least some portions of the electronic assembly not covered by the mask. ### Claim 25 (depends on 24) The electronic assembly of claim 24, wherein the protective coating comprises a moisture-resistant coating. ### Claim 26 (depends on 24) The electronic assembly of claim 24, wherein the protective coating also covers the mask. ### Claim 27 (depends on 24) The electronic assembly of claim 24, wherein the mask is exposed through the protective coating. ### Claim 28 A system for protectively coating a substrate, comprising: a masking component configured to apply a mask to at least one selected portion of a substrate; a coating component for applying a protective coating to at least a portion of the substrate, including the mask; and a material removal component for removing a portion of the protective coating over the mask. ### Claim 29 (depends on 28) The system of claim 28, wherein the masking component is configured to apply a preformed mask to the substrate. ### Claim 30 (depends on 28) The system of claim 28, wherein the masking component is configured to apply a flowable mask to the at least one selected portion of the substrate to define the mask on the at least one selected portion of the substrate.