# US 2014/0192453 A1 · Conductive resin composition, multilayer ceramic capacitor having the same, and method of manufacturing the multilayer ceramic capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0192453 A1 - Document ID: US20140192453A1 - Status: Published application - Kind: A1 - Application number: 13/793,448 - Filed: 2013-03-11 - Published: 2014-07-10 - Earliest claimed: 2013-01-09 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Kyung Pyo HONG; Hyun Hee GU; Byoung Jin CHUN; Jae Hwan HAN - Web page: https://patentgrep.com/patent/US20140192453A1 ## CPC - H01G 4/008: Selection of materials - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles. ## Claims ### Claim 1 A conductive resin composition, comprising: 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS); and 50 to 90 wt % of conductive metal powder particles. ### Claim 2 (depends on 1) The conductive resin composition of claim 1, wherein the conductive resin composition has viscosity of 8,000 to 50,000 cPs. ### Claim 3 (depends on 1) The conductive resin composition of claim 1, wherein the conductive metal powder particles include at least one of copper (Cu), silver (Ag), and copper coated with silver thereon. ### Claim 4 A multilayer ceramic capacitor, comprising: a ceramic body having a plurality of laminated dielectric layers therein; a plurality of first and second internal electrodes formed on at least one surfaces of the dielectric layers, and alternately exposed to both end surfaces of the ceramic body; first and second external electrodes formed on both end surfaces of the ceramic body, respectively, and electrically connected to the first and second internal electrodes, respectively; first and second conductive resin layers formed on surfaces of the first and second external electrodes, respectively, the first and second conductive resin layers being formed of a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS) and 50 to 90 wt % of conductive metal powder particles; and first and second plating layers formed on surfaces of the first and second conductive resin layers, respectively. ### Claim 5 (depends on 4) The multilayer ceramic capacitor of claim 4, wherein the conductive resin composition has viscosity of 8,000 to 50,000 cPs. ### Claim 6 (depends on 4) The multilayer ceramic capacitor of claim 4, wherein the conductive metal powder particles include at least one of copper (Cu), silver (Ag), and copper coated with silver thereon. ### Claim 7 (depends on 4) The multilayer ceramic capacitor of claim 4, wherein in the first and second conductive resin layers, a ratio of thickness of a part corresponding to a center portion of the ceramic body to thickness of a part corresponding to a corner portion of the ceramic body satisfies a range of 1˜5:1. ### Claim 8 (depends on 4) The multilayer ceramic capacitor of claim 4, wherein the first and second plating layers respectively include a nickel (Ni) plating layer formed on the surface of the first and second conductive resin layers, respectively, and a tin (Sn) plating layer formed on a surface of the nickel plating layer. ### Claim 9 A method of manufacturing a multilayer ceramic capacitor, the method comprising: preparing a plurality of ceramic sheets; forming first and second internal electrodes on at least one surfaces of the ceramic sheets, respectively; laminating the plurality of ceramic sheets having the first and second internal electrodes formed thereon to form a laminate; cutting the laminate such that one ends of the first and second internal electrodes are alternately exposed to both end surfaces of the laminate, respectively; firing the cut laminate to form a ceramic body having the plurality of first and second internal electrodes; forming first and second external electrodes of a conductive paste on both end surfaces of the ceramic body to thereby allow the first and second external electrodes to be electrically connected to exposed portions of the first and second internal electrodes, respectively; forming first and second conductive resin layers of a conductive resin paste on surfaces of the first and second external electrodes, the conductive resin paste including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS) and 50 to 90 wt % of conductive metal powder particles; and plating surfaces of the first and second conductive resin layers. ### Claim 10 (depends on 9) The method of claim 9, wherein in the forming of the first and second conductive resin layers, the conductive resin paste has viscosity of 8,000 to 50,000 cPs. ### Claim 11 (depends on 9) The method of claim 9, wherein in the forming of the first and second conductive resin layers, conductive metal powder particles of the conductive resin paste include at least one of copper (Cu), silver (Ag), and copper coated with silver thereon. ### Claim 12 (depends on 9) The method of claim 9, wherein in the forming of the first and second conductive resin layers, a ratio of thickness of respective parts corresponding to both end surfaces of the ceramic body and a thickness of a part corresponding to a corner portion of the ceramic body satisfies a range of 1˜5:1. ### Claim 13 (depends on 9) The method of claim 9, wherein in the plating of the surfaces of the first and second conductive resin layers, a nickel (Ni) plating layer is formed on the surfaces of the first and second conductive resin layers and then a tin (Sn) plating layer is formed on a surface of the nickel plating layer.