# US 2014/0192334 A1 · Pixel Blending For Multiple Charged-Particle Beam Lithography

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- Number: US 2014/0192334 A1
- Document ID: US20140192334A1
- Status: Published application
- Kind: A1
- Application number: 14/203,371
- Filed: 2014-03-10
- Published: 2014-07-10
- Earliest claimed: 2008-09-23
- Assignees: PineBrook Imaging, Inc.
- Applicants: PineBrook Imaging, Inc.
- Inventors: Jang Fung CHEN; Thomas Laidig
- Web page: https://patentgrep.com/patent/US20140192334A1

## CPC

- G03F 7/70275: {Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems}
- G03F 7/2059: {using a scanning corpuscular radiation beam, e.g. an electron beam}
- G03F 7/70291: {Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices}
- G03F 7/704: {Scanned exposure beam, e.g. raster-, rotary- and vector scanning (mask projection exposure involving relative movement of patterned beam and workpiece during imaging G03F7/70358)}
- G03F 7/70466: {Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature (stitching G03F7/70475)}
- G03F 7/70508: {Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus}
- G03F 7/70791: {Large workpieces, e.g. glass substrates for flat panel displays or solar panels}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

System and method for applying mask data patterns to substrate in a lithography manufacturing process are disclosed. In one embodiment, the method includes providing a parallel imaging writer system, where the parallel imaging writer system includes a plurality of multiple charged-particle beam (MCB) imaging units arranged in one or more parallel arrays, receiving a mask data pattern to be written to a substrate, processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate, identifying one or more objects in an area of the substrate to be imaged by corresponding MCB imaging units, and performing multiple exposures to image the one or more objects in the area of the substrate by controlling the plurality of MCB imaging units to write the plurality of partitioned mask data patterns in parallel.

## Claims

### Claim 1

A method for processing image data in a lithography manufacturing process, comprising:
providing a parallel imaging writer system, wherein the parallel imaging writer system includes a plurality of multiple charged-particle beam (MCB) imaging units arranged in one or more parallel arrays;
receiving a mask data pattern to be written to a substrate;
processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate;
identifying one or more objects in an area of the substrate to be imaged by corresponding MCB imaging units; and
performing multiple exposures to image the one or more objects in the area of the substrate by controlling the plurality of MCB imaging units to write the plurality of partitioned mask data patterns in parallel.

### Claim 2 (depends on 1)

The method of claim 1, wherein performing multiple exposures to image the one or more objects comprises:
referencing the one or more objects using a pixel grid;
performing exposure of the one or more objects using the pixel grid;
(a) shifting the pixel grid by predetermined increments with respect to the one or more objects to a next pixel grid location; and
(b) performing exposure of the one or more objects using the next pixel grid location; and
repeating steps (a) and (b) until a target exposure count is reached.

### Claim 3 (depends on 2)

The method of claim 2, wherein performing exposure of the one or more objects using the pixel grid comprises:
filling interior pixels of the one or more objects;
adjusting exposures of edge pixels according to the pixel grid; and
accumulating dosage at each pixel location in accordance with dosage of exposures received at the pixel location.

### Claim 4 (depends on 2)

The method of claim 2, wherein shifting the pixel grid by predetermined increments comprises:
shifting the pixel grid in a horizontal direction with respect to the substrate by a non-integer number of pixels; and
shifting the pixel grid in a vertical direction with respect to the substrate by a non-integer number of pixels.

### Claim 5 (depends on 2)

The method of claim 2, wherein performing exposure of the one or more objects using the next pixel grid location comprises:
identifying a first region of the next pixel grid, wherein the exposure dosages for pixels in the first region are computed as pixels to be shifted-out;
identifying a second region of the next pixel grid, wherein the exposure dosages for pixels in the second region are obtained from computations of a previous pixel grid as overlapping pixels; and
identifying a third region of the next pixel grid, wherein the exposure dosages for pixels in the third regions are computed as pixels newly shifted-in.

### Claim 6 (depends on 3)

The method of claim 3, wherein adjusting exposures of edge pixels comprises:
adjusting exposure of a partial edge pixel according to area of the partial edge pixel with respect to the pixel grid;
adjusting exposure dosage level with respect to a target exposure dosage level;
adjusting exposure dosage level with respect to amount of error corrections; and
adjusting threshold of exposure to model a desired dosage accumulation function.

### Claim 7 (depends on 6)

The method of claim 6, wherein adjusting exposure dosage level with respect to a target exposure dosage level comprises:
comparing an accumulated dosage at each selected evaluation point along edges of the one or more objects to a fraction of target exposure dosage for the evaluation point;
turning on the pixel covering the evaluation point for exposure if the accumulated dosage is lower than the fraction of target exposure dosage; and
turning off the pixel covering the evaluation point for exposure if the accumulated dosage is higher than the fraction of target exposure dosage.

### Claim 8 (depends on 1)

The method of claim 1, wherein performing multiple exposures to image the one or more objects further comprises:
selectively exposing a first set of pixel locations using a first dose having a first electron energy level; and
selectively exposing a second set of pixel locations using a second dose having a second electron energy level.

### Claim 9 (depends on 8)

The method of claim 8, wherein
the first set of pixel locations are exposed in a first scan direction;
the second set of pixel locations are exposed in a second scan direction;
wherein the first scan direction is different from the second scan direction; and
wherein the first electron energy level is different from the second electron energy level.

### Claim 10 (depends on 1)

The method of claim 1, wherein performing multiple exposures to image the one or more objects further comprises at least one of:
performing multiple exposures of a pixel using one of the MCB imaging unit; or
performing multiple exposures of a pixel using a set of the MCB imaging units.

### Claim 11

A system for processing image data in a lithography manufacturing process, comprising:
a parallel imaging writer system, wherein the parallel imaging writer system includes a plurality of multiple charged-particle beam (MCB) imaging units arranged in one or more parallel arrays;
a controller configured to control the plurality of MCB imaging units, wherein the controller includes
logic for receiving a mask data pattern to be written to a substrate;
logic for processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate;
logic for identifying one or more objects in an area of the substrate to be imaged by corresponding MCB imaging units; and
logic for performing multiple exposures to image the one or more objects in the area of the substrate by controlling the plurality of MCB imaging units to write the plurality of partitioned mask data patterns in parallel.

### Claim 12 (depends on 11)

The system of claim 11, wherein logic for performing multiple exposures to image the one or more objects comprises:
logic for referencing the one or more objects using a pixel grid;
logic for performing exposure of the one or more objects using the pixel grid;
(a) logic for shifting the pixel grid by predetermined increments with respect to the one or more objects to a next pixel grid location; and
(b) logic for performing exposure of the one or more objects using the next pixel grid location; and
logic for repeating steps (a) and (b) until a target exposure count is reached.

### Claim 13 (depends on 12)

The system of claim 12, wherein logic for performing exposure of the one or more objects using the pixel grid comprises:
logic for filling interior pixels of the one or more objects;
logic for adjusting exposures of edge pixels according to the pixel grid; and
logic for accumulating dosage at each pixel location in accordance with dosage of exposures received at the pixel location.

### Claim 14 (depends on 12)

The system of claim 12, wherein logic for shifting the pixel grid by predetermined increments comprises:
logic for shifting the pixel grid in a horizontal direction with respect to the substrate by a non-integer number of pixels; and
logic for shifting the pixel grid in a vertical direction with respect to the substrate by a non-integer number of pixels.

### Claim 15 (depends on 12)

The system of claim 12, wherein logic for performing exposure of the one or more objects using the next pixel grid location comprises:
logic for identifying a first region of the next pixel grid, wherein the exposure dosages for pixels in the first region are computed as pixels to be shifted-out;
logic for identifying a second region of the next pixel grid, wherein the exposure dosages for pixels in the second region are obtained from computations of a previous pixel grid as overlapping pixels; and
logic for identifying a third region of the next pixel grid, wherein the exposure dosages for pixels in the third regions are computed as pixels newly shifted-in.

### Claim 16 (depends on 13)

The system of claim 13, wherein logic for adjusting exposures of edge pixels comprises:
logic for adjusting exposure of a partial edge pixel according to area of the partial edge pixel with respect to the pixel grid;
logic for adjusting exposure dosage level with respect to a target exposure dosage level;
logic for adjusting exposure dosage level with respect to amount of error corrections; and
logic for adjusting threshold of exposure to model a desired dosage accumulation function.

### Claim 17 (depends on 16)

The system of claim 16, wherein logic for adjusting exposure dosage level with respect to a target exposure dosage level comprises:
logic for comparing an accumulated dosage at selected evaluation points along edges of the one or more objects] at each selected evaluation point along edges of the one or more objects to a fraction of target exposure dosage for the evaluation point;
logic for turning on the pixel covering the evaluation point for exposure if the accumulated dosage is lower than the fraction of target exposure dosage; and
logic for turning off the pixel covering the evaluation point for exposure if the accumulated dosage is higher than the fraction of target exposure dosage.

### Claim 18 (depends on 11)

The system of claim 11, wherein logic for performing multiple exposures to image the one or more objects further comprises:
logic for selectively exposing a first set of pixel locations using a first dose having a first electron energy level; and
logic for selectively exposing a second set of pixel locations using a second dose having a second electron energy level.

### Claim 19 (depends on 18)

The system of claim 18, wherein
the first set of pixel locations are exposed in a first scan direction;
the second set of pixel locations are exposed in a second scan direction;
wherein the first scan direction is different from the second scan direction; and
wherein the first electron energy level is different from the second electron energy level.

### Claim 20 (depends on 11)

The system of claim 11, wherein logic for performing multiple exposures to image the one or more objects further comprises at least one of:
logic for performing multiple exposures of a pixel using one of the MCB imaging unit; or
logic for performing multiple exposures of a pixel using a set of the MCB imaging units.