# US 2014/0192243 A1 · Image pickup device, method of manufacturing same, and electronic apparatus

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- Number: US 2014/0192243 A1
- Document ID: US20140192243A1
- Status: Published application
- Kind: A1
- Application number: 14/146,386
- Filed: 2014-01-02
- Published: 2014-07-10
- Earliest claimed: 2013-01-09
- Assignees: Sony Corporation
- Applicants: Sony Corporation
- Inventors: Tomohiro Iwahori; Yusuke Kikuchi; Koichi Tanigawa
- Web page: https://patentgrep.com/patent/US20140192243A1

## CPC

- H10F 39/8057: {Optical shielding}
- H04N 25/704: Pixels specially adapted for focusing, e.g. phase difference pixel sets
- H10F 39/024: {of coatings or optical elements}
- H10F 39/8023: {Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

An image pickup device with a plurality of pixels, each of the pixels includes: a photoelectric conversion section formed in a semiconductor substrate; and a metallic member formed between the semiconductor substrate and a wiring layer provided in a layer on the semiconductor substrate, a part of the metallic member being configured to serve as a light-shielding member that blocks a part of light to be incident on the photoelectric conversion section.

## Claims

### Claim 1

An image pickup device with a plurality of pixels, each of the pixels comprising:
a photoelectric conversion section formed in a semiconductor substrate; and
a metallic member formed between the semiconductor substrate and a wiring layer provided in a layer on the semiconductor substrate, a part of the metallic member being configured to serve as a light-shielding member that blocks a part of light to be incident on the photoelectric conversion section.

### Claim 2 (depends on 1)

The image pickup device according to claim 1, wherein the pixels are phase difference detection pixels each configured to generate a signal used to perform focusing determination based on phase difference detection.

### Claim 3 (depends on 2)

The image pickup device according to claim 2, further comprising
a plurality of image generation pixels each configured to generate a signal used to generate an image, wherein
the phase difference detection pixels are dispersedly arranged among the plurality of image generation pixels that are arranged two-dimensionally in rows and columns.

### Claim 4 (depends on 2)

The image pickup device according to claim 2, wherein another part of the metallic member serves as a contact that electrically connects the wiring layer to the semiconductor substrate.

### Claim 5 (depends on 2)

The image pickup device according to claim 2, wherein the light-shielding member is electrically connected to GND through the wiring layer.

### Claim 6 (depends on 2)

The image pickup device according to claim 2, wherein the light-shielding member is electrically connected to a power supply through the wiring layer.

### Claim 7 (depends on 2)

The image pickup device according to claim 2, wherein the light-shielding member is electrically floating.

### Claim 8 (depends on 1)

The image pickup device according to claim 1, wherein each of the pixels is an image generation pixel that generates a signal used to generate an image.

### Claim 9

A method of manufacturing an image pickup device with a plurality of pixels, each of the pixels including
a photoelectric conversion section formed in a semiconductor substrate, and
a metallic member formed between the semiconductor substrate and a wiring layer provided in a layer on the semiconductor substrate,
the method comprising:
forming the metallic member to allow a part of the metallic member to serve as a light-shielding member that blocks a part of light to be incident on the photoelectric conversion section.

### Claim 10

An electronic apparatus with an image pickup device with a plurality of pixels, each of the pixels comprising:
a photoelectric conversion section formed in a semiconductor substrate; and
a metallic member formed between the semiconductor substrate and a wiring layer provided in a layer on the semiconductor substrate, a part of the metallic member being configured to serve as a light-shielding member that blocks a part of light to be incident on the photoelectric conversion section.