# US 2014/0191779 A1 · Crosstalk suppression in wireless testing of semiconductor devices

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- Number: US 2014/0191779 A1
- Document ID: US20140191779A1
- Status: Published application
- Kind: A1
- Application number: 14/171,211
- Filed: 2014-02-03
- Published: 2014-07-10
- Earliest claimed: 2007-02-28
- Assignees: STMicroelectronics S.r.l.
- Applicants: STMicroelectronics S.r.l.
- Inventors: Alberto Pagani
- Web page: https://patentgrep.com/patent/US20140191779A1

## CPC

- G01R 31/2851: {Testing of integrated circuits [IC] (G01R31/317 takes precedence; testing individual devices G01R31/26; testing printed circuits G01R31/2801)}
- G01R 31/2886: {Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06)}
- G01R 31/3025: {Wireless interface with the DUT}
- G01R 31/303: of integrated circuits (G01R31/305 - G01R31/315 take precedence)
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.

## Claims

### Claim at position 1

1-12. (canceled)

### Claim 13

An apparatus, comprising:
a wireless probe card having a plurality of wireless units, the plurality of wireless units including at least a first wireless unit and a second wireless unit,
wherein the first wireless unit is configured to wirelessly communicate with a first integrated circuit die at a first frequency, and
wherein the second wireless unit is configured to wirelessly communicate with a second integrated circuit die at a second frequency different than the first frequency.

### Claim 14 (depends on 13)

The apparatus of claim 13, wherein each wireless unit of the plurality of wireless units of the wireless probe card is configured to wirelessly communicate with a respective integrated circuit die at a respective frequency.

### Claim 15 (depends on 13)

The apparatus of claim 13, wherein the wireless probe card further comprises a control circuit configured to manage test signals exchanged between the wireless probe card and a tester.

### Claim 16 (depends on 15)

The apparatus of claim 15, further comprising the tester.

### Claim 17 (depends on 13)

The apparatus of claim 13, wherein the first wireless unit comprises a first transceiver circuit configured to transmit wireless signals at the first frequency.

### Claim 18 (depends on 17)

The apparatus of claim 17, wherein the first transceiver circuit is physically coupled to a first antenna on the wireless probe card.

### Claim 19 (depends on 13)

The apparatus of claim 13, further comprising a test coupled to the wireless probe card.