# US 2014/0191585 A1 · Method and system for maximum achievable efficiency in near-field coupled wireless power transfer systems > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0191585 A1 - Document ID: US20140191585A1 - Status: Published application - Kind: A1 - Application number: 14/148,590 - Filed: 2014-01-06 - Published: 2014-07-10 - Earliest claimed: 2013-01-06 - Inventors: Glenn Gulak; Meysam Zargham - Web page: https://patentgrep.com/patent/US20140191585A1 ## CPC - H01F 27/2804: {Printed windings} - G01R 27/02: Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant (by measuring phase angle only G01R25/00) - G01R 33/16: Measuring susceptibility {(G01R33/1238 takes precedence)} - H01F 38/14: Inductive couplings - H02J 50/10: using inductive coupling - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - H02J: ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY ## Abstract Methods and systems for maximum efficiency achievable in near-field coupled wireless power transfer systems are disclosed and may include configuring coil geometry, independently of load impedance and source impedance, for a transmit (Tx) coil and a receive (Rx) coil based on a media expected to be between the coils during operation. A desired susceptance and conductance may be determined and an impedance of an amplifier for the Tx coil may be configured based on the determined susceptance and conductance. A load impedance for the Rx coil may be configured based on the determined susceptance and conductance. A matching network may be coupled to the amplifier. The Rx coil may be integrated on a complementary metal-oxide semiconductor (CMOS) chip. One or more matching networks may be integrated on the CMOS chip for the configuring of the load impedance for the Rx coil. ## Claims ### Claim 1 A method for wireless power transfer, the method comprising: configuring, independently of load impedance and source impedance, coil geometry for a transmit (Tx) coil and a receive (Rx) coil based on a media expected to be between the coils during operation; determining a desired susceptance and conductance corresponding to the configured coil geometry and expected media; configuring a load impedance for an amplifier for the Tx coil based on the determined susceptance and conductance; and configuring a load impedance for the Rx coil based on the determined susceptance and conductance. ### Claim 2 (depends on 1) The method according to claim 1, comprising operatively coupling a matching network to the amplifier for said configuring said load impedance for the amplifier. ### Claim 3 (depends on 1) The method according to claim 1, wherein the Rx coil is integrated on a complementary metal-oxide semiconductor (CMOS) chip. ### Claim 4 (depends on 3) The method according to claim 3, wherein one or more matching networks are integrated on the CMOS chip for said configuring the load impedance for the Rx coil. ### Claim 5 (depends on 4) The method according to claim 4, wherein the one or more matching networks comprise a configurable impedance bank comprising capacitors and/or inductors. ### Claim 6 (depends on 5) The method according to claim 5, comprising adaptively configuring the load impedance for the Rx coil utilizing the configurable impedance bank. ### Claim 7 (depends on 3) The method according to claim 3, wherein a portion of a matching network for configuring the load impedance for the Rx coil is mounted to a surface of the CMOS chip. ### Claim 8 (depends on 1) The method according to claim 1, wherein the Tx coil is integrated on a printed circuit board (PCB) or other insulating substrate. ### Claim 9 (depends on 6) The method according to claim 6, wherein matching networks are integrated on said PCB or insulating substrate for said configuring the load impedance for the amplifier for the Tx coil. ### Claim 10 (depends on 1) The method according to claim 1, comprising communicating control commands and/or data utilizing the Tx and Rx coils. ### Claim 11 (depends on 1) The method according to claim 1, comprising operatively coupling a matching network to the Rx coil for said configuring a load impedance for the Rx coil. ### Claim 12 (depends on 1) The method according to claim 1, comprising configuring the desired susceptance and conductance for a maximum power transmission efficiency. ### Claim 13 (depends on 1) The method according to claim 1, wherein the coil geometry and expected media comprises a general two-port model. ### Claim 14 (depends on 1) The method according to claim 1, wherein the coil geometry comprises one or more of: coil area, metal layer thickness, metal layer width, and metal layer spacing. ### Claim 15 (depends on 1) The method according to claim 1, wherein the expected media comprises one or more of: biological liquid, organic or inorganic substances, biological material, biological agents, biological tissue, chemical compositions, buffer solutions. ### Claim 16 A system for wireless power transfer, the system comprising: a coil geometry for a transmit (Tx) coil and a receive (Rx) coil configured based on a media expected to be between the coils during operation but configured independent of a load impedance and source impedance; a determined susceptance and conductance corresponding to the configured coil geometry and expected media; a load impedance for an amplifier for the Tx coil, said impedance configured based on the determined susceptance and conductance; and a load impedance configured for the Rx coil based on the determined susceptance and conductance. ### Claim 17 (depends on 16) The system according to claim 16, wherein a matching network is operatively coupled to the amplifier for said configured impedance of the amplifier. ### Claim 18 (depends on 16) The system according to claim 16, wherein the Rx coil is integrated on a complementary metal-oxide semiconductor (CMOS) chip. ### Claim 19 (depends on 18) The system according to claim 18, wherein one or more matching networks are integrated on the CMOS chip for said configuring the load impedance for the Rx coil. ### Claim 20 (depends on 19) The system according to claim 19, wherein the one or more matching networks comprise a configurable impedance bank comprising capacitors and/or inductors. ### Claim 21 (depends on 20) The system according to claim 20, wherein the load impedance for the Rx coil is adaptively configured utilizing the configurable impedance bank. ### Claim 22 (depends on 17) The system according to claim 17, wherein a portion of a matching network for configuring the load impedance for the Rx coil is mounted to a surface of the CMOS chip. ### Claim 23 (depends on 16) The system according to claim 16, wherein the Tx coil is integrated on a printed circuit board (PCB) or other insulating substrate. ### Claim 24 (depends on 23) The system according to claim 23, wherein matching networks are integrated on said PCB or insulating substrate for said configuring the load impedance for the amplifier for the Tx coil. ### Claim 25 (depends on 16) The system according to claim 16, wherein a matching network is operatively coupled to the Rx coil for said configured load impedance for the Rx coil. ### Claim 26 (depends on 19) The system according to claim 19, wherein the desired susceptance and conductance are configured for a maximum power transmission efficiency. ### Claim 27 (depends on 16) The system according to claim 16, wherein the coil geometry and expected media comprises a general two-port model. ### Claim 28 (depends on 16) The system according to claim 16, wherein the coil geometry comprises one or more of: coil area, metal layer thickness, metal layer width, and metal layer spacing. ### Claim 29 (depends on 16) The system according to claim 16, wherein the expected media comprises one or more of: biological liquid, organic or inorganic substances, biological material, biological agents, biological tissue, chemical compositions, buffer solutions. ### Claim 30 A system for wireless power transfer, the system comprising: a coil geometry for a transmit (Tx) coil on a printed circuit board and a receive (Rx) coil on a complimentary metal-oxide semiconductor (CMOS) chip, said Tx coil and Rx coil configured based on a biological media expected to be between the coils during operation but configured independent of a configurable load impedance and source impedance, said Rx coil integrated on a chip with the configurable load impedance; a determined susceptance and conductance corresponding to the configured coil geometry and expected media; a load impedance for an amplifier for the Tx coil, said impedance configured based on the determined susceptance and conductance; and a load impedance configured for the Rx coil based on the determined susceptance and conductance.