# US 2014/0191440 A1 · Potting method for lamp chain

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- Number: US 2014/0191440 A1
- Document ID: US20140191440A1
- Status: Published application
- Kind: A1
- Application number: 13/976,066
- Filed: 2011-12-13
- Published: 2014-07-10
- Earliest claimed: 2010-12-30
- Assignees: OSRAM GmbH
- Inventors: Huajian Fan; Shuai Li; Hui Wu; Zesheng Ye
- Web page: https://patentgrep.com/patent/US20140191440A1

## CPC

- H01H 17/08: Operating part, e.g. cord
- B29C 41/20: incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
- F21S 4/10: with light sources attached to loose electric cables, e.g. Christmas tree lights
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2203/1322: Encapsulation comprising more than one layer
- H01H: ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B7/10; electrolytic self-interrupters H01G9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K17/00)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A potting method for a lamp chain includes a) providing a mold having a potting groove; b) providing a fixing support which is fixedly kept in the potting groove; c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support; d) potting a potting material into the potting groove and curing the potting material; and e) removing the mold.

## Claims

### Claim 1

A potting method for a lamp chain, the method comprising:
a) providing a mold having a potting groove;
b) providing a fixing support which is fixedly kept in the potting groove;
c) fixedly keeping a printed circuit board provided with a light emitting assembly in the fixed support;
d) potting a potting material into the potting groove and curing the potting material; and
e) removing the mold.

### Claim 2 (depends on 1)

The potting method according to claim 1, wherein, in b), the fixing support made of a flexible material is provided.

### Claim 3 (depends on 2)

The potting material according to claim 2, wherein, in b), the fixing support made of a material the same as the potting material is provided.

### Claim 4 (depends on 2)

The potting material according to claim 2, wherein, in b), the fixing support made of a material similar to the potting material is provided.

### Claim 5 (depends on 1)

The potting method according to claim 1, wherein, in b), the fixing support is clamped in the potting groove.

### Claim 6 (depends on 1)

The potting method according to claim 1, wherein, in c), the printed circuit board is clamped in the fixing support.

### Claim 7 (depends on 1)

The potting method according to claim 1, wherein, in a), the mold of the potting groove having a U-shape section contour is provided; and in b) the fixing support consisting of multiple U-shape supports spaced apart is provided.

### Claim 8 (depends on 7)

The potting method according to claim 7, wherein, in b), the height of the U-shape support is made to be less than or equal to the depth of the potting groove.

### Claim 9 (depends on 7)

The potting method according to claim 7, characterized in wherein, in c), the depth of the opening of the U-shape support is made to be greater than the thickness of the printed circuit board.

### Claim 10 (depends on 1)

The potting method according to claim 1, wherein the potting material is epoxy resin, polyurethane modified epoxy resin and polyurethane resin.