# US 2014/0191420 A1 · Embedded package in pcb build up > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0191420 A1 - Document ID: US20140191420A1 - Status: Published application - Kind: A1 - Application number: 13/735,776 - Filed: 2013-01-07 - Published: 2014-07-10 - Earliest claimed: 2013-01-07 - Assignees: Intel Corporation - Inventors: Tin Poay Chuah - Web page: https://patentgrep.com/patent/US20140191420A1 ## CPC - H10W 95/00: Packaging processes not covered by the other groups of this subclass - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 70/635: {Through-vias} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/874: {On different surfaces} - H10W 72/9413: {on encapsulations} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An apparatus including a printed circuit board including a body of a plurality of alternating layers of conductive material and insulating material; and a package including a die disposed within the body of the printed circuit board. A method including forming a printed circuit board including a core and a build-up section including alternating layers of conductive material and insulating material coupled to the core; and coupling a package including a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. An apparatus including a printed circuit board including a body; a computing device including a package including a microprocessor disposed within the body of the printed circuit board; and a peripheral device that provides input or output to the computing device. ## Claims ### Claim 1 An apparatus comprising: a printed circuit board comprising a body of a plurality of alternating layers of conductive material and insulating material; and a package comprising a die disposed within the body of the printed circuit board, wherein the package comprises a plurality of package contact points coupled to contact points of the die and at least one of the package contact points is coupled to the one of the plurality of conductive material of the printed circuit board. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the plurality of alternating layers of conductive material of the printed circuit board comprise at least one patterned signal layer and at least one of the package contact points is coupled to the at least one patterned signal layer. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the plurality of alternating layers of conductive material of the printed circuit board comprise at least one patterned signal layer and at least one reference layer, wherein the plurality of package contact points is coupled to the at least one patterned signal layer and the at least one reference layer. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the package comprises a first side comprising the plurality of external package contact points and a second side opposite the first side, wherein a portion of the second side is exposed in a surface of the printed circuit board. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the package comprises a first side comprising the plurality of external package contact points and a second side opposite the first side, wherein each of the first side and the second side are embedded in the printed circuit board. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the package comprises a first side and a second side opposite the first side, wherein a first portion of the plurality of package contact points are disposed on the first side of the package and a second portion of the plurality of package contact points are disposed on the second side of the package. ### Claim 7 (depends on 6) The apparatus of claim 6, wherein the die is disposed in the package with a device side oriented toward the first side of the package. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein the body of the printed circuit board comprises a core and the package and the plurality of alternating layers of conductive material and insulating material are disposed on the core. ### Claim 9 A method comprising: forming a printed circuit board comprising a core and a build-up section comprising alternating layers of conductive material and insulating material coupled to the core; and coupling a package comprising a die to the core of the printed circuit board such that at least a portion of a sidewall of the package is embedded in at least a portion of the build-up section. ### Claim 10 (depends on 9) The method of claim 9, wherein forming a printed circuit board comprises coupling the alternating layers of conductive material and insulating material to the core after coupling the package to the core. ### Claim 11 (depends on 9) The method of claim 9, wherein the core comprises a plurality of core contact points and the package comprises a plurality of contact points and coupling the package to the core comprises coupling the contact points of the package to the core contact points. ### Claim 12 (depends on 9) The method of claim 9, further comprising forming a plurality of core contact points on the core coupling the package to the core comprises coupling a plurality of contact points of the package to the core contact points. ### Claim 13 (depends on 9) The method of claim 9, wherein the entire portion of the sidewall of the package is embedded in the build-up section. ### Claim 14 (depends on 9) The method of claim 9, wherein the package comprises a first side comprising a plurality of contact points and a second side opposite the first side, wherein each of the first side and the second side are embedded in the build-up section. ### Claim 15 (depends on 9) The method of claim 9, wherein the package comprises a first side and a second side opposite the first side and package contact points, wherein a first portion of the plurality of package contact points are disposed on the first side of the package and a second portion of the plurality of external package contact points are disposed on the second side of the package and coupling the package to the printed circuit board comprises coupling at least ones of the first portion of package contact points and ones of the second portion of package contact points. ### Claim 17 (depends on 15) The method of claim 15, further comprising, on a surface of the printed circuit board, coupling an auxiliary device to the package through at least ones of the second portion of package contact points. ### Claim 18 An apparatus comprising: a printed circuit board comprising a body of a plurality of alternating layers of conductive material and insulating material; a computing device comprising a package comprising a microprocessor disposed within the body of the printed circuit board, wherein the package comprises a plurality of package contact points coupled to contact points of the die and at least one of the package contact points is coupled to the one of the plurality of conductive material of the printed circuit board; and a peripheral device that provides input or output to the computing device. ### Claim 19 (depends on 18) The apparatus of claim 18, wherein the printed circuit board and peripheral device are embodied in a hand-held product. ### Claim 20 (depends on 18) The apparatus of claim 18, wherein the package comprises a first side and a second side opposite the first side, wherein a first portion of the plurality of package contact points are disposed on the first side of the package and a second portion of the plurality of package contact points are disposed on the second side of the package, the apparatus further comprising a memory device coupled to the second portion of the plurality of package contact points.