# US 2014/0191417 A1 · Multi-Chip Package Assembly with Improved Bond Wire Separation

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- Number: US 2014/0191417 A1
- Document ID: US20140191417A1
- Status: Published application
- Kind: A1
- Application number: 13/735,650
- Filed: 2013-01-07
- Published: 2014-07-10
- Earliest claimed: 2013-01-07
- Assignees: Spansion LLC
- Applicants: Spansion LLC
- Inventors: Kiah Ling Tan; Sally Yin Lye Foong; Lee Changhak; Chin Nguk Lai
- Web page: https://patentgrep.com/patent/US20140191417A1

## CPC

- H10W 90/00: Package configurations
- H10W 72/073: {of die-attach connectors}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/075: {of bond wires}
- H10W 72/354: {comprising polymers}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/585: {Alignment aids, e.g. alignment marks}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/732: {between stacked chips}
- H10W 90/752: {between stacked chips}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A multi-chip package is disclosed that has a construction capable of preventing and/or reducing electrical shorts caused by shifts in bond wires. The multi-chip package includes a die attach formed between connection points of a bond wire. The die attach is made of a non-conductive material and can be constructed so as to support or encompass a portion of the bond wire. By contacting the bond wire, the die attach restricts the motion of the bond wire by acting as a physical barrier to the bond wire's movement and/or as a source of friction. In this manner, undesired position shifts of the bond wires can be prevented, reducing device failures and allowing for improved manufacturing allowances.

## Claims

### Claim 1

A multi-chip package, comprising:
a first semiconductor die having a first metal contact;
a second semiconductor die that overlaps the first semiconductor die, the second semiconductor die having a second metal contact;
a plurality of lead fingers;
a first bond wire electrically connecting a first one of the plurality of lead fingers to the first metal contact of the first semiconductor die;
a second bond wire electrically connecting a second one of the plurality of lead fingers to the second metal contact of the second semiconductor die; and
a first die attach composed of an insulating material and disposed between the first metal contact and the first one of the plurality of lead fingers, the first die attach restricting relative motion of the first bond wire.

### Claim 2 (depends on 1)

The multi-chip package of claim 1, further comprising:
a second die attach composed of an insulating material and disposed between the second metal contact and the second one of the plurality of lead fingers, the second die attach restricting relative motion of the second bond wire.

### Claim 3 (depends on 2)

The multi-chip package of claim 2, wherein the first die attach has at least one of a different size and shape from the second die attach.

### Claim 4 (depends on 2)

The multi-chip package of claim 2, wherein the first die attach is disposed on a surface of the first semiconductor die, and
wherein the second die attach is disposed on a surface of the second semiconductor die.

### Claim 5 (depends on 1)

The multi-chip package of claim 1, wherein the first bond wire is disposed so as to contact a top surface of the first die attach.

### Claim 6 (depends on 1)

The multi-chip package of claim 1, wherein the first bond wire is disposed so as to pass through the first die attach.

### Claim 7 (depends on 6)

The multi-chip package of claim 6, wherein the second bond wire is disposed so as to contact a top surface of the first die attach.

### Claim 8

A multi-chip package, comprising:
a semiconductor die having a metal contact;
a lead finger;
a bond wire electrically connecting the metal contact and the lead finger; and
a non-conductive die attach disposed between the metal contact and the lead finger and restricting relative movement of the bond wire.

### Claim 9 (depends on 8)

The multi-chip package of claim 8, wherein the die attach is disposed on a surface of the semiconductor die.

### Claim 10 (depends on 8)

The multi-chip package of claim 8, further comprising a substrate that includes the lead finger,
wherein the die attach is disposed on a surface of the substrate.

### Claim 11 (depends on 9)

The multi-chip package of claim 9, wherein the die attach is disposed along a plurality of edges of the semiconductor die.

### Claim 12 (depends on 11)

The multi-chip package of claim 11, wherein a first portion of the die attach formed along a first edge of the plurality of edges of the semiconductor die is separated discontinuous with a second portion of the die attach formed along a second edge of the plurality of edges of the semiconductor die.

### Claim 13 (depends on 11)

The multi-chip package of claim 11, wherein the die attach is continuous between the plurality of edges.

### Claim 14 (depends on 10)

The multi-chip package of claim 10, further comprising a second die attach configured to restrict relative movement of the bond wire, the second die attach disposed on a surface of the semiconductor die.

### Claim 15 (depends on 14)

The multi-chip package of claim 14, wherein the second die attach has a different cross-sectional shape than the die attach disposed on the surface of the substrate.

### Claim 16 (depends on 14)

The multi-chip package of claim 14, wherein the bond wire passes through one of the die attach disposed on the surface of the substrate or the second die attach, and
wherein the bond wire contacts the upper surface of the other of the die attach disposed on the substrate or the second die attach.

### Claim 17

A method of manufacturing bond wires in a multi-chip package, the multi-chip package including lead finger and a semiconductor die having a metal contact, the method comprising:
dispensing a non-conductive material between the metal contact and the lead finger;
forming a die attach by curing the non-conductive material; and
installing a bond wire between the metal contact and the lead finger that contacts an upper surface of the die attach.

### Claim 18 (depends on 17)

The method of claim 17, further comprising installing a pass-through bond wire prior to the curing of the non-conductive material.

### Claim 19 (depends on 18)

The method of claim 18, wherein the installing of the pass-through bond wire is performed prior to dispensing the non-conductive material.

### Claim 20 (depends on 17)

The method of claim 17, wherein the dispensing of the non-conductive material includes dispensing the non-conductive material at a first position separately from dispensing the non-conductive material at a second position.