# US 2014/0191395 A1 · Forming Interconnect Structures Using Pre-Ink-Printed Sheets

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- Number: US 2014/0191395 A1
- Document ID: US20140191395A1
- Status: Published application
- Kind: A1
- Application number: 14/204,722
- Filed: 2014-03-11
- Published: 2014-07-10
- Earliest claimed: 2010-05-12
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Jung Cheng Ko; Chi-Chun Hsieh; Shang-Yun Hou; Wen-Chih Chiou; Shin-Puu Jeng; Chen-Hua Yu
- Web page: https://patentgrep.com/patent/US20140191395A1

## CPC

- H10W 70/611: {for connecting multiple chips together}
- H10W 20/023: {the interconnections being through-semiconductor vias}
- H10W 20/0245: {comprising use of blind vias during the manufacture}
- H10W 20/0249: {wherein the through-semiconductor via protrudes from backsides of the chips, wafers or substrates during the manufacture}
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W 20/4473: {Conductive organic materials, e.g. conductive adhesives or conductive inks}
- H10W 20/481: {on the rear surfaces of the wafers or substrates}
- H10W 70/635: {Through-vias}
- H10W 70/666: {Organic materials or pastes}
- H10W 70/685: comprising multiple insulating layers
- H10W 70/698: Semiconductor materials that are electrically insulating, e.g. undoped silicon
- H10W 20/49: Adaptable interconnections, e.g. fuses or antifuses
- H10W 72/221: {Structures or relative sizes}
- H10W 72/248: {Top-view layouts, e.g. mirror arrays}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/255: {of outermost layers of multilayered bumps, e.g. material of a coating}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of forming a device includes printing conductive patterns on a dielectric sheet to form a pre-ink-printed sheet, and bonding the pre-ink-printed sheet onto a side of a substrate. The conductive feature includes a through-substrate via extending from a first major side of the substrate to a second major side of the substrate opposite the first major side. A conductive paste is then applied to electrically couple conductive patterns to a conductive feature in the substrate.

## Claims

### Claim 1

A device comprising:
a substrate comprising a through-substrate via (TSV) extending from a first side of the substrate to a second side of the substrate opposite the first side;
a first dielectric sheet over the substrate; and
a first redistribution line over the first dielectric sheet, wherein the first redistribution line is formed of an ink, and is electrically coupled to the TSV through a first through-hole in the first dielectric sheet.

### Claim 2 (depends on 1)

The device of claim 1, wherein the TSV comprises a portion extending into the first through-hole.

### Claim 3 (depends on 2)

The device of claim 2 further comprising a conductive paste filling a portion of the first through-hole.

### Claim 4 (depends on 1)

The device of claim 1, further comprising:
a plurality of second dielectric sheets disposed over and bonded to the first dielectric sheet, each of the plurality of second dielectric sheets having a second through-hole;
a plurality of second redistribution lines, each of the plurality of second redistribution lines printed on a respective one of the plurality of second dielectric sheets; and
a plurality of a second conductive materials, each of the plurality of second conductive materials electrically coupling the second conductive patterns of a respective one of the plurality of second dielectric sheets to a second redistribution line of an adjacent dielectric sheet.

### Claim 5 (depends on 4)

The device of claim 4, further comprising:
a conductive bump formed on a topmost pattern of the plurality of second redistribution lines.

### Claim 6

A device, comprising:
a substrate having a through-substrate via (TSV) extending through a first side of the substrate to a second side of the substrate opposite the first side;
a first dielectric sheet having a first through-hole with a size greater than the size of a top portion of the TSV, wherein the first dielectric sheet is bonded to the first side of the substrate, wherein the TSV extends into the first through-hole without extending laterally over the first side of the substrate, and wherein the top portion of the TSV fits into the first through-hole;
first conductive patterns printed on the first dielectric sheet, the first conductive patterns comprising a conductive ink; and
a first conductive material disposed over the first through-hole and over a portion of the TSV in the through-hole, the first conductive material electrically coupling the first conductive patterns to the TSV.

### Claim 7 (depends on 6)

The device of claim 6, wherein the ink is a conductive paste that is a copper paste or a silver paste.

### Claim 8 (depends on 6)

The device of claim 6, wherein the first conductive patterns have a first portion extending to an edge of the first through-hole.

### Claim 9 (depends on 6)

The device of claim 6, wherein the first conductive material extends into the first through-hole between a sidewall of the first through-hole and a sidewall of the TSV.

### Claim 10 (depends on 9)

The device of claim 9, further comprising:
a second dielectric sheet disposed over and bonded to the first dielectric sheet and having a second through-hole;
second conductive patterns printed on the second dielectric sheet; and
a second conductive material electrically coupling the second conductive patterns to the first conductive patterns through the second through-hole.

### Claim 11 (depends on 10)

The device of claim 10, wherein the first conductive pattern comprises an RDL and a via; and
wherein the via is disposed on the RDL and extends into the second through-hole, the second conductive material contacting the via.

### Claim 12 (depends on 11)

The device of claim 11, wherein the second through-hole is laterally spaced part from the second through-hole; and
wherein a portion of the first conductive pattern extends from the edge of the first through-hole to under the second through-hole.

### Claim 13 (depends on 10)

The device of claim 10, wherein the second dielectric sheet is spaced apart from the first dielectric sheet by a gap, a bottom surface of the second dielectric sheet in contact with top surfaces of the first conductive patterns.

### Claim 14

A device, comprising:
a substrate having a through-substrate via (TSV) extending through a first side of the substrate to a second side of the substrate opposite the first side, a TSV bump of the TSV extending above the first side of the substrate;
a plurality of dielectric sheets, each of the plurality of dielectric sheets having a through-hole, the plurality of dielectric sheets stacked over and bonded to the first side of the substrate, wherein a first through-hole of a bottommost dielectric sheet of the plurality of dielectric sheets has a size greater than the size of the TSV bump, wherein the TSV bump extends into the first through-hole without extending laterally over the first side of the substrate;
a plurality of conductive patterns formed from a conductive ink, each of the plurality of conductive patterns printed a respective sheet of the plurality of dielectric sheets; and
a plurality of conductive materials, each of the plurality of conductive materials disposed over a through-hole of a respective sheet of the plurality of dielectric sheets and electrically connecting a conductive pattern of the respective sheet to one of a conductive pattern of an adjacent one of the plurality of dielectric sheets or to the TSV bump.

### Claim 15 (depends on 14)

The device of claim 14, further comprising:
a conductive bump formed on a topmost one of the plurality of conductive patterns.

### Claim 16 (depends on 14)

The device of claim 14, wherein each of plurality of the conductive patterns below a topmost one of the plurality of conductive patterns comprises an RDL and a via; and
wherein the via is disposed on the RDL, the via of each of the plurality of conductive patterns extend into the through-hole of an adjacent one of the dielectric sheets.

### Claim 17 (depends on 16)

The device of claim 16, wherein each of the plurality of conductive materials extends into the through-hole of the respective sheet and contacts a sidewall of the through-hole.

### Claim 18 (depends on 14)

The device of claim 14, wherein adjacent sheets of the plurality of dielectric sheets are spaced apart by a gap; and
wherein a conductive pattern of one of the adjacent sheets is disposed between the adjacent sheets in the gap.

### Claim 19 (depends on 18)

The device of claim 18, wherein a dielectric epoxy is disposed in the gap.

### Claim 20 (depends on 14)

The device of claim 14, wherein the ink is a copper paste or a silver paste.