# US 2014/0191382 A1 · Circuit substrate, method of manufacturing circuit substrate, and electronic component

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- Number: US 2014/0191382 A1
- Document ID: US20140191382A1
- Status: Published application
- Kind: A1
- Application number: 14/133,074
- Filed: 2013-12-18
- Published: 2014-07-10
- Earliest claimed: 2013-01-09
- Assignees: Sony Corporation
- Applicants: Sony Corporation
- Inventors: Hiroshi Asami
- Web page: https://patentgrep.com/patent/US20140191382A1

## CPC

- H05K 3/108: {by semi-additive methods; masks therefor (characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241)}
- H05K 3/3478: Application of solder preforms; Transferring prefabricated solder patterns
- H05K 3/3485: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12)
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 72/072: {of bump connectors}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/3452: Solder masks
- H05K 2201/099: Coating over pads, e.g. solder resist partly over pads
- H05K 2201/10977: Encapsulated connections
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- Y10T 29/49155: Manufacturing circuit on or in base
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A circuit substrate includes: a mounting region having an exposed surface that is planarized, and in which a predetermined chip is to be mounted; patterns provided in the mounting region, and including respective top faces that form a part of the exposed surface; and solder bumps provided on the respective patterns, and having substantially same shape as one another.

## Claims

### Claim 1

A circuit substrate, comprising:
a mounting region having an exposed surface that is planarized, and in which a predetermined chip is to be mounted;
patterns provided in the mounting region, and including respective top faces that form a part of the exposed surface; and
solder bumps provided on the respective patterns, and having substantially same shape as one another.

### Claim 2 (depends on 1)

The circuit substrate according to claim 1, wherein the circuit substrate is manufactured by:
planarizing a surface of the mounting region;
covering the mounting region with a resist;
forming openings on the resist in alignment with respective locations on the patterns where respective terminals of the chip are to be connected, the openings having same shape as one another;
filling solder particles into the openings, the solder particles each having a diameter that is smaller than a diameter of each of the openings;
melting the solder particles to form the solder bumps in the openings; and
removing the resist.

### Claim 3 (depends on 1)

The circuit substrate according to claim 1, further comprising a solder resist provided at a circumferential portion of a mounting side of the circuit substrate to surround a periphery of the mounting region.

### Claim 4

A method of manufacturing a circuit substrate, the method comprising:
planarizing a surface of a mounting region in which a predetermined chip is to be mounted to expose top faces of respective patterns in the mounting region;
covering the mounting region with a resist;
forming openings on respective portions, of the resist, that cover the respective patterns, the openings having same shape as one another;
filling solder particles into the openings, the solder particles each having a diameter that is smaller than a diameter of each of the openings;
melting the solder particles to form the solder bumps in the openings; and
removing the resist.

### Claim 5 (depends on 4)

The method of manufacturing the circuit substrate according to claim 4, wherein surfaces of the solder particles are coated with a flux, and the melting the solder particles is carried out under a nitrogen atmosphere.

### Claim 6

An electronic component provided with a chip and a circuit substrate, the chip being provided with terminals, and the circuit substrate being mounted with the chip, the circuit substrate comprising:
a mounting region having an exposed surface that is planarized, and in which a predetermined chip is mounted;
patterns provided in the mounting region, and including respective top faces that form a part of the exposed surface; and
solder bumps provided on locations, on the respective patterns, that correspond to the respective terminals of the chip, and having substantially same shape as one another.

### Claim 7 (depends on 6)

The electronic component according to claim 6, wherein the circuit substrate is manufactured by:
planarizing a surface of the mounting region;
covering the mounting region with a resist;
forming openings on the resist in alignment with the respective locations on the patterns, the openings having same shape as one another;
filling solder particles into the openings, the solder particles each having a diameter that is smaller than a diameter of each of the openings;
melting the solder particles to form the solder bumps in the openings; and
removing the resist.