# US 2014/0191377 A1 · Integrated circuit package

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- Number: US 2014/0191377 A1
- Document ID: US20140191377A1
- Status: Published application
- Kind: A1
- Application number: 14/240,765
- Filed: 2011-08-31
- Published: 2014-07-10
- Earliest claimed: 2011-08-31
- Assignees: Freescale Semiconductor, Inc.
- Inventors: Ralf Reuter; Saverio Trotta
- Web page: https://patentgrep.com/patent/US20140191377A1

## CPC

- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H01P 5/10: for coupling balanced lines or devices with unbalanced lines or devices
- H01P 3/003: {Coplanar lines}
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 44/248: {for antennas}
- H10W 70/685: comprising multiple insulating layers
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)

## Abstract

An integrated circuit package comprising a substrate and at least one semiconductor die is described. A connection unit may provide electrical connections between the substrate and the semiconductor die. The connection unit may comprise a stack of conduction layers and isolation layers stacked atop each other. The stack may include a microstrip line or a coplanar waveguide. The microstrip line or the coplanar waveguide may be part of a balun, a power divider, or a directional coupler.

## Claims

### Claim 1

An integrated circuit package comprising:
a substrate,
one or more semiconductor dies, and
a connection unit configured to provide electrical connections between said substrate and said one or more semiconductor dies, wherein; said connection unit comprises
a stack comprising
one or more conduction layers and of one or more isolation layers stacked atop each other in an alternating manner,
a first conduction layer comprising a microstrip conductive line, and
a second conduction layer comprising a ground plane, wherein said microstrip conductive line and said ground plane form a microstrip line.

### Claim 2 (depends on 1)

The package of claim 1 wherein said second conduction layer further comprises one or more coplanar conductive lines, said coplanar conductive lines and said ground plane forming a coplanar waveguide.

### Claim 3 (depends on 3)

The package of claim 3, said coplanar conductive lines are at least partly surrounded by said ground plane.

### Claim 4 (depends on 2)

The package of claim 2 wherein said stack further comprises a passive unit, said passive unit comprising at least one of said microstrip line and said coplanar waveguide.

### Claim 5 (depends on 4)

The package of claim 4, wherein said passive unit comprises one of a balun, a power divider or a directional coupler.

### Claim 6 (depends on 2)

The package of claim 2, wherein said coplanar waveguide is arranged to carry a balanced signal.

### Claim 7 (depends on 6)

The package of claim 6 wherein said coplanar waveguide and said microstrip line are connected to each other and arranged to form a balun for converting said balanced signal into an unbalanced signal and vice versa.

### Claim 8 (depends on 7)

The package of claim 7 wherein said coplanar conductive lines comprise:
a first coplanar conductive line and a second coplanar conductive line connected to each other at one end of said coplanar waveguide by a first segment and at another end of said coplanar waveguide by a second segment of said microstrip conductive line.

### Claim 9 (depends on 8)

The package of claim 8 wherein said first segment and said second segment have an electrical length of L/2 and L, respectively, L being a wavelength of a signal to be transferred via said balun.

### Claim 10 (depends on 9)

The package of claim 9 wherein
said second segment comprises a third segment of electrical length L/4 and a fourth segment of electrical length ¾*L contacting each other in a node, and
said node is arranged to transfer said unbalanced signal.

### Claim 11 (depends on 1)

The package of claim 1 wherein said second conduction layer is arranged between said first conduction layer and said one or more semiconductor dies.

### Claim 12 (depends on 1)

The package claim 1 further comprising one or more transverse conductors arranged to interconnect separate conduction layers of said stack.

### Claim 13 (depends on 1)

The package claim 1 wherein said one or more semiconductor dies comprises a radar receiver circuit or a radar transmitter circuit.

### Claim 14 (depends on 1)

The package of claim 1 wherein said substrate comprises a printed circuit board.