# US 2014/0191349 A1 · Solid-state imaging apparatus and method of manufacturing the same

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- Number: US 2014/0191349 A1
- Document ID: US20140191349A1
- Status: Published application
- Kind: A1
- Application number: 14/147,279
- Filed: 2014-01-03
- Published: 2014-07-10
- Earliest claimed: 2013-01-06
- Assignees: Canon Kabushiki Kaisha
- Applicants: Canon Kabushiki Kaisha
- Inventors: Masaki Kurihara; Daisuke Shimoyama
- Web page: https://patentgrep.com/patent/US20140191349A1

## CPC

- H10F 39/024: {of coatings or optical elements}
- H10F 39/8053: {Colour filters}
- H10F 39/8063: {Microlenses}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

The present invention provides a solid-state imaging apparatus which has hollow portions provided around each of color filters and achieves the prevention of the peeling of each of the color filters. The solid-state imaging apparatus having a plurality of light receiving portions provided on a semiconductor substrate includes: a plurality of color filters arranged correspondingly to each of the plurality of light receiving portions; and hollow portions formed around each of the plurality of color filters, wherein each of the color filters has one peripheral part contacting with adjacent one or more of the color filters.

## Claims

### Claim 1

A solid-state imaging apparatus having a plurality of light receiving portions on at one surface of a semiconductor substrate comprising:
a plurality of color filters arranged correspondingly to each of the plurality of light receiving portions; and
a hollow portion formed around each of the plurality of color filter , wherein
each of the plurality of color filters has one peripheral part contacting with an adjacent one or more of the plurality of color filters, and has the other peripheral part around the hollow portion.

### Claim 2 (depends on 1)

The solid-state imaging apparatus according to claim 1, wherein
the hollow portion has a width of 0.1 μm or less.

### Claim 3 (depends on 1)

The solid-state imaging apparatus according to claim 1, wherein
a boundary line between adjacent ones of the plurality of color filters is equal to or longer than ½ of a width of the hollow portion.

### Claim 4 (depends on 1)

The solid-state imaging apparatus according to claim 1, further comprising:
a sealing layer sealing an aperture area of the hollow portion.

### Claim 5 (depends on 1)

The solid-state imaging apparatus according to claim 1, wherein
each of the plurality of color filters has a corner area contacting with the adjacent one or more of the plurality of color filters.

### Claim 6 (depends on 1)

The solid-state imaging apparatus according to claim 1, further comprising:
a micro lens formed above each of the plurality of color filters, correspondingly to each of the plurality of light receiving portions.

### Claim 7

A method for manufacturing a solid-state imaging apparatus having a plurality of light receiving portions on at one surface of a semiconductor substrate, wherein the method comprises:
preparing a plurality of color filters arranged correspondingly to each of the plurality of light receiving portions above the semiconductor substrate; and
forming a hollow portion around each of the plurality of color filters, wherein
each of the plurality of color filters has one peripheral part contacting with an adjacent one or more of the plurality of color filters, and has the other peripheral part around the hollow portion.