# US 2014/0191348 A1 · Integrated circuit and manufacturing method

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2014/0191348 A1
- Document ID: US20140191348A1
- Status: Published application
- Kind: A1
- Application number: 14/147,214
- Filed: 2014-01-03
- Published: 2014-07-10
- Earliest claimed: 2013-01-07
- Assignees: NXP B.V.
- Applicants: NXP B.V.
- Inventors: Aurelie Humbert; Roel Daamen; Youri Victorovitch Ponomarev
- Web page: https://patentgrep.com/patent/US20140191348A1

## CPC

- H10F 71/129: {Passivating}
- G01N 21/766: {of gases}
- G01N 21/77: by observing the effect on a chemical indicator
- G01N 21/783: {for analysing gases}
- G01N 29/022: {Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices (microdevices per se B81B)}
- G01N 29/036: by measuring frequency or resonance of acoustic waves
- G01N 33/004: {CO or CO2}
- H10F 77/00: Constructional details of devices covered by this subclass (constructional details of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00)
- G01N 2291/021: Gases
- G01N 2291/0256: Adsorption, desorption, surface mass change, e.g. on biosensors
- G01N 2291/02809: Concentration of a compound, e.g. measured by a surface mass change
- G01N 2291/0427: Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever
- Y02A 50/20: Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- Y02A: TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE

## Abstract

Disclosed is an integrated circuit comprising a substrate (10); and an optical CO2 sensor comprising: first and second light sensors (12, 12′) on said substrate, said second light sensor being spatially separated from the first light sensor; and a layer portion (14) including an organic compound comprising at least one amine or amidine functional group over the first light sensor; wherein said integrated circuit further comprises a signal processor (16) coupled to the first and second light sensor for determining a difference in the respective outputs of the first and second light sensor. An electronic device comprising such a sensor and a method of manufacturing such an IC are also disclosed.

## Claims

### Claim 1

An integrated circuit comprising:
a substrate; and
an optical CO2 sensor comprising:
first and second light sensors on said substrate, said second light sensor being spatially separated from the first light sensor; and
a layer portion including an organic compound comprising at least one amine or amidine functional group for reacting with CO2 over the first light sensor;
wherein said integrated circuit further comprises a signal processor coupled to the first and second light sensor for determining a difference in the respective outputs of the first and second light sensor.

### Claim 2 (depends on 1)

The integrated circuit of claim 1, further comprising a further sensor comprising a pair of electrodes separated by a gas or moisture sensitive material.

### Claim 3 (depends on 2)

The integrated circuit of claim 2, wherein the integrated circuit comprises an interconnect structure over the substrate and at least one passivation layer over the interconnect structure, said layer portion and said further sensor being at least partially located on the passivation layer.

### Claim 4 (depends on 2)

The integrated circuit of claim 2, wherein the CO2 sensor comprises a further layer portion of the gas or moisture sensitive material over the first light sensor, said organic compound containing layer portion at least partially covering the further layer portion.

### Claim 5 (depends on 4)

The integrated circuit of claim 4, wherein the gas or moisture sensitive material comprises a polymer.

### Claim 6 (depends on 5)

The integrated circuit of claim 5, wherein the polymer is selected from the group consisting of polyacrylates, polymethacrylates, polyimides, polyamides, polyamines, polypyridines, polycarbonates, polyacetates, polystyrenes, polyacetylenes, polyanilines, polypyrroles, polythiophenes, poly(phenyl vinylene) and derivatives thereof.

### Claim 7 (depends on 6)

The integrated circuit of claim 6, wherein the polymer is a polyimide.

### Claim 8 (depends on 1)

The integrated circuit of claim 1, wherein at least the further layer portion of the moisture sensitive material further comprises a dye.

### Claim 9 (depends on 1)

The integrated circuit of claim 1, further comprising a polymer well structure surrounding the first light sensor, wherein the layer portion is contained in the polymer well structure.

### Claim 10

The integrated circuit of 1, wherein the organic compound is immobilized in a further polymer.

### Claim 11 (depends on 1)

An electronic device comprising the integrated circuit of claim 1.

### Claim 12

A method of manufacturing an integrated circuit comprising an optical CO2 sensor, comprising:
providing a substrate comprising first and second light sensors spatially separated from each other and a signal processor coupled to the first and second light sensor for determining a difference in the respective outputs of the first and second light sensor; and
forming a layer portion including an organic compound comprising at least one amine or amidine functional group for reacting with CO2 over the first light sensor.

### Claim 13 (depends on 12)

The method of claim 12, further comprising:
forming an interconnect structure over the substrate;
forming at least one passivation layer over the interconnect structure, said passivation layer including a first area over the first light sensor;
wherein the step of forming the layer portion comprising forming the layer portion in the first area.

### Claim 14 (depends on 13)

The method of claim 13, further comprising:
forming a further sensor at least partially on the at least one passivation layer by:
forming a pair of electrodes on a further area of the at least one passivation layer;
depositing a gas or moisture sensitive layer over the at least one passivation layer including the pair of electrodes; and
patterning the gas or moisture sensitive layer such that said layer remains in the first and further areas;
and wherein the step of forming the layer portion comprises forming the layer portion at least partially over the portion of the gas or moisture sensitive layer remaining in the first area.

### Claim 15 (depends on 14)

The method of claim 14, further comprising the step of including a dye in the gas or moisture sensitive layer prior to said patterning step.