# US 2014/0191342 A1 · Mems sensor

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- Number: US 2014/0191342 A1
- Document ID: US20140191342A1
- Status: Published application
- Kind: A1
- Application number: 14/239,877
- Filed: 2012-08-10
- Published: 2014-07-10
- Earliest claimed: 2011-09-30
- Assignees: Hitachi Automotive Systems, Ltd.
- Inventors: Ichiro Ohsaka; Kazunori Ohta
- Web page: https://patentgrep.com/patent/US20140191342A1

## CPC

- B81B 3/0018: {Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators}
- B81B 7/0083: {Temperature control}
- B81C 1/00238: {Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure}
- G01C 19/5783: Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
- G01P 15/0802: {Details}
- G01P 21/00: Testing or calibrating of apparatus or devices covered by the preceding groups
- B81B 2201/0278: Temperature sensors
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- G01C: MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY (measuring liquid level G01F; radio navigation, determining distance or velocity by use of propagation effects, e.g. Doppler effects, propagation time, of radio waves, analogous arrangements using other waves G01S)
- G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G})

## Abstract

There is provided a MEMS sensor including a signal processing LSI equipped with a temperature sensor for measuring temperature of a sensor, and a MEMS sensor chip overlaid on the signal processing LSI, the MEMS sensor chip being mounted on a heat generating part of the signal processing LSI. This MEMS sensor decreases the effects caused by thermally triggered changes in temperature characteristics.

## Claims

### Claim 1

A MEMS sensor comprising:
a signal processing LSI equipped with a temperature sensor for measuring temperature of a sensor; and
a MEMS sensor chip overlaid on said signal processing LSI, wherein
said MEMS sensor chip is mounted on a heat generating part of said signal processing LSI.

### Claim 2 (depends on 1)

A MEMS sensor according to claim 1, wherein
said MEMS sensor chip is an acceleration sensor.

### Claim 3 (depends on 1)

A MEMS sensor according to claim 1, wherein
said MEMS sensor chip is an angular velocity sensor.

### Claim 4 (depends on 1)

A MEMS sensor according to claim 1, wherein
said MEMS sensor chip is made up of an acceleration sensor and an angular velocity sensor.

### Claim 5 (depends on 1)

A MEMS sensor according to claim 1, wherein
said MEMS sensor chip is made up of a biaxial acceleration sensor and an angular velocity sensor.

### Claim 6 (depends on 1)

A MEMS sensor according to claim 1, wherein
said MEMS sensor chip is made up of a triaxial acceleration sensor and an angular velocity sensor.

### Claim 7 (depends on 1)

A MEMS sensor according to claim 1, wherein
said temperature sensor is disposed on the position that bears thermal resistance and thermal capacity equivalent to the thermal resistance and thermal capacity in effect between the heat generating part of said signal processing LSI and a sensing part of said MEMS sensor.

### Claim 8 (depends on 1)

A MEMS sensor according to claim 1, wherein
said temperature sensor is disposed on the position that bears thermal resistance and thermal capacity with the same proportions as those of the thermal resistance and thermal capacity in effect between the heat generating part of said signal processing LSI and a sensing part of said MEMS sensor.