# US 2014/0191278 A1 · Light emitting device and method of manufacturing the light emitting device

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- Number: US 2014/0191278 A1
- Document ID: US20140191278A1
- Status: Published application
- Kind: A1
- Application number: 14/152,712
- Filed: 2014-01-10
- Published: 2014-07-10
- Earliest claimed: 2009-10-29
- Assignees: Nichia Corporation
- Applicants: Nichia Corporation
- Inventors: Shinji NISHIJIMA; Tomohide MIKI; Hiroto TAMAKI
- Web page: https://patentgrep.com/patent/US20140191278A1

## CPC

- H05K 5/0091: {Housing specially adapted for small components (for resistors H01C; for capacitors H01G; for integrated circuits H10W99/00)}
- H10H 20/8506: {Containers}
- H10H 20/852: Encapsulations
- H10H 20/856: Reflecting means
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A light emitting device includes a base body forming a recess defined by a bottom surface and a side wall thereof, a conductive member whose upper surface being exposed in the recess and whose lower surface forming an outer surface, a protruding portion disposed in the recess, a light emitting element mounted in the recess and electrically connected to the conductive member, and a sealing member disposed in the recess to cover the light emitting element. The base body has a bottom portion and a side wall portion integrally formed of a resin, an inner surface of the side wall portion is the side wall defining the recess and has a curved portion, and the protruding portion is disposed in close vicinity to the curved surface. With this arrangement, a thin and small-sized light emitting device excellent in light extraction efficiency and reliability can be obtained.

## Claims

### Claim 1

A light emitting device comprising:
a resin package comprising:
a base body forming a recess defined by a bottom surface and a side wall thereof, and
a conductive member having an upper surface exposed at the bottom surface of the recess and a lower surface forming an outer surface;
a light emitting element mounted in the recess; and
a sealing member disposed in the recess to cover the light emitting element,
wherein a corner between the bottom surface and the side wall of the recess has a rounded shape.

### Claim 2 (depends on 1)

The light emitting device according to claim 1, wherein a light emitting element is electrically connected with the conductive member via a conductive wire or a bump.

### Claim 3 (depends on 1)

The light emitting device according to claim 1, wherein a thickness of the conductive member is from 25 μm to 500 μm.

### Claim 4

A resin package comprising:
a base body forming a recess defined by a bottom surface and a side wall thereof; and
a conductive member having an upper surface exposed at the bottom surface of the recess and a lower surface forming an outer surface,
wherein a corner between the bottom surface and the side wall of the recess has a rounded shape.

### Claim 5 (depends on 4)

The resin package according to claim 4, wherein the side wall is formed such that the inner surface of the side wall extends continuously on the conductive member toward a center of the bottom surface of the recess with its thickness gradually decreasing.

### Claim 6 (depends on 4)

The resin package according to claim 4, wherein a depression is formed in the bottom surface of the base body.