# US 2014/0191276 A1 · Light emitting device package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0191276 A1 - Document ID: US20140191276A1 - Status: Published application - Kind: A1 - Application number: 14/149,547 - Filed: 2014-01-07 - Published: 2014-07-10 - Earliest claimed: 2013-01-08 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: Byung Mok KIM; Hiroshi KODAIRA; Ha Na KIM; Yuichiro TANDA; Satoshi OZEKI - Web page: https://patentgrep.com/patent/US20140191276A1 ## CPC - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/85: Packages - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10W 72/884: {Die-attach connectors and bond wires} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm. ## Claims ### Claim 1 A light emitting device package comprising: a substrate; a light emitting device disposed on the substrate; and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm. ### Claim 2 (depends on 1) The light emitting device package according to claim 1, further comprising a support unit disposed on the substrate along a circumference of the substrate, wherein the light transmission unit is supported by the support unit. ### Claim 3 (depends on 2) The light emitting device package according claim 2, wherein the support unit includes a first region disposed in a first direction parallel to the light transmission unit and a second region disposed in a second direction different from the first direction, wherein the first region contacts the light transmission unit. ### Claim 4 (depends on 3) The light emitting device package according to claim 3, wherein the first region extends along the first direction from an end of the second region. ### Claim 5 (depends on 3) The light emitting device package according to claim 3, wherein the first region extends along the first direction from a middle portion of the second region. ### Claim 6 (depends on 4) The light emitting device package according claim 4, wherein the light transmission unit contacts a side of the first region, facing a bottom surface of the substrate. ### Claim 7 (depends on 1) The light emitting device package according to claim 1, wherein the light emitting device emits light having a wavelength range of 260 nm to 405 nm. ### Claim 8 (depends on 1) The light emitting device package according to claim 1, wherein the substrate comprises a ceramic material. ### Claim 9 (depends on 1) The light emitting device package according to claim 1, wherein the light emitting device is wire-bonded to the substrate. ### Claim 10 (depends on 3) The light emitting device package according to claim 3, wherein the first direction crosses the second direction at a right angle. ### Claim 11 (depends on 1) The light emitting device package according to claim 1, further comprising a sub-mount disposed between the substrate and the light emitting device. ### Claim 12 (depends on 1) The light emitting device package according to claim 1, wherein a space between the light-transmitting unit and the light emitting device is vaccumized. ### Claim 13 (depends on 1) The light emitting device package according to claim 1, wherein a space between the light-transmitting unit and the light emitting device is filled with a nitrogen gas or a forming gas. ### Claim 14 (depends on 1) The light emitting device package according to claim 1, wherein the light-transmitting unit comprises SiO2, Al2O3, LiF, MgF2, CaF2, low iron transparent glass or B2O3. ### Claim 15 (depends on 2) The light emitting device package according to claim 2, wherein the support unit comprises at least one of Al, Ag, Pt, Rh, Rd, Pd and Cr, or an alloy containing at least one thereof. ### Claim 16 A light emitting device package comprising: a substrate having a cavity including a side wall and a bottom surface; a light emitting device disposed in the cavity; a support unit including a first region, and a second region bent from the first region and disposed on the side wall of the cavity; and a light-transmitting unit adhered to the first region such that the light-transmitting unit is spaced from the light emitting device, the light-transmitting unit transmitting light emitted from the light emitting device. ### Claim 17 (depends on 16) The light emitting device package according to claim 16, wherein a distance between the upper surface of the light emitting device and the light-transmitting unit is 0.15 mm to 0.35 mm. ### Claim 18 (depends on 16) The light emitting device package according to claim 16, wherein the light emitting device emits light having a wavelength range of 260 nm to 405 nm. ### Claim 19 (depends on 17) The light emitting device package according to claim 17, further comprising a sub-mount disposed between the substrate and the light emitting device. ### Claim 20 (depends on 16) The light emitting device package according to claim 16, wherein the substrate comprises a single layer or a plurality of layers.