# US 2014/0191275 A1 · Ceramic substrate adapted to mounting electronic component and electronic component module

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- Number: US 2014/0191275 A1
- Document ID: US20140191275A1
- Status: Published application
- Kind: A1
- Application number: 14/146,652
- Filed: 2014-01-02
- Published: 2014-07-10
- Earliest claimed: 2013-01-09
- Assignees: Panasonic Corporation
- Applicants: Panasonic Corporation
- Inventors: Takashi AIBARA
- Web page: https://patentgrep.com/patent/US20140191275A1

## CPC

- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}
- H10H 20/8506: {Containers}
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern
- H05K 1/181: associated with surface mounted components
- H05K 3/16: by cathodic sputtering
- H05K 3/243: {characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K3/108, H05K3/182)}
- H05K 3/285: {Permanent coating compositions}
- H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
- H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

To provide a ceramic substrate having a reflective film formed on the surface thereof that is suitable for mounting electronic components such as LEDs, a ceramic substrate 1 includes a ceramic substrate body 2, a terminal 4 for connecting an electronic component 3 on the ceramic substrate body 2, and a wiring unit 5 forming an electronic wiring pattern over the ceramic substrate body 2. The thickness of the terminal 4 is configured to be greater than the thickness of the wiring unit 5.

## Claims

### Claim 1

A ceramic substrate, comprising:
a ceramic substrate body;
at least one terminal arranged on the ceramic substrate body for connecting an electronic component; and
at least one wiring unit arranged on the ceramic substrate body and forming an electronic wiring pattern, wherein
the terminal is greater in thickness than the wiring unit.

### Claim 2 (depends on 1)

The ceramic substrate of claim 1, wherein
a surface of the ceramic substrate body is divided into:
a mounting area where the terminal is arranged and where the electronic component is to be mounted; and
a non-mounting area where the wiring unit is arranged, and
a reflective film is formed over the wiring unit in the non-mounting area.

### Claim 3 (depends on 1)

The ceramic substrate of claim 1, wherein
the terminal and the wiring unit are made of a substantially similar metal material.

### Claim 4 (depends on 3)

The ceramic substrate of claim 3, wherein
the terminal and the wiring unit are made of a metal material that includes copper.

### Claim 5 (depends on 1)

The ceramic substrate of claim 1, wherein
the terminal and the wiring unit are formed from a first metal unit and a second metal unit that is layered over a portion of the first metal unit,
the terminal is the portion of the first metal unit where the second metal unit is layered over the first metal unit, and
the wiring unit is a remaining portion of the first metal unit where the second metal layer is not present.

### Claim 6 (depends on 5)

The ceramic substrate of claim 5, wherein
the first metal unit is formed continuously over the ceramic substrate body so as to extend across the terminal and the wiring unit.

### Claim 7 (depends on 1)

An electronic component module, comprising
an electronic component mounted on the terminal of the ceramic substrate pertaining to claim 1.

### Claim 8 (depends on 7)

The electronic component module of claim 7, wherein
the electronic component is a light-emitting diode.