# US 2014/0191272 A1 · Optoelectronic Component and Method for Producing an Optoelectronic Component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0191272 A1 - Document ID: US20140191272A1 - Status: Published application - Kind: A1 - Application number: 14/233,754 - Filed: 2012-06-27 - Published: 2014-07-10 - Earliest claimed: 2011-07-19 - Assignees: OSRAM Opto Semiconductors GmbH - Inventors: Simon Jerebic; Erik Heinemann; Markus Pindl; Michael Bestele; Jan Marfeld - Web page: https://patentgrep.com/patent/US20140191272A1 ## CPC - H10H 20/8516: {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient} - H10H 20/856: Reflecting means - H10H 20/855: Optical field-shaping means, e.g. lenses - H10W 90/00: Package configurations - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element. ## Claims ### Claim at position 1 1-21. (canceled) ### Claim 22 An optoelectronic component comprising: a substrate; a semiconductor chip arranged on the substrate; a wettable attractor element arranged on the substrate; and a medium comprising pigments, the medium at least regionally covering an exposed region of the substrate that is not covered by the semiconductor chip and the attractor element and at least partly wetting the semiconductor chip and the attractor element. ### Claim 23 (depends on 22) The optoelectronic component according to claim 22, wherein the medium comprising pigments has a minimum thickness above the substrate of at least 10% of a smaller height of attractor element and of semiconductor chip above the substrate. ### Claim 24 (depends on 22) The optoelectronic component according to claim 22, wherein the attractor element has a height above the substrate of 10% to 300% of a height of the semiconductor chip. ### Claim 25 (depends on 22) The optoelectronic component according to claim 22, further comprising a further semiconductor chip, wherein the attractor element is arranged between the semiconductor chip and the further semiconductor chip. ### Claim 26 (depends on 25) The optoelectronic component according to claim 25, wherein the semiconductor chip and the further semiconductor chip each comprise a light-emitting surface, wherein the medium at least partly wets side areas of the semiconductor chips, and wherein the light-emitting surfaces of the semiconductor chips are not wetted by the medium. ### Claim 27 (depends on 26) The optoelectronic component according to claim 26, wherein the attractor element is arranged centrally between the semiconductor chip and the further semiconductor chip and has a height above the substrate between 80% and 120% of a height of the semiconductor chip. ### Claim 28 (depends on 22) The optoelectronic component according to claim 22, wherein the component comprises a plurality of semiconductor chips and a plurality of attractor elements, wherein distances between adjacent semiconductor chips, between adjacent attractor elements as well as between adjacent semiconductor chips and adjacent attractor elements are uniform. ### Claim 29 (depends on 22) The optoelectronic component according to claim 22, wherein the attractor element has a bonding wire. ### Claim 30 (depends on 22) The optoelectronic component according to claim 22, wherein the attractor element is embodied as a blocky element that comprises at least one material selected from the group consisting of: silicon, gallium arsenide, germanium, plastic, glass, sapphire, and metal. ### Claim 31 (depends on 22) The optoelectronic component according to claim 22, wherein the attractor element is composed of polybutylene terephthalate (PBT). ### Claim 32 (depends on 22) The optoelectronic component according to claim 22, wherein the attractor element has a delimiting element and an inner structure, wherein the delimiting element and the inner structure are embodied in one piece. ### Claim 33 (depends on 22) The optoelectronic component according to claim 22, wherein the attractor element has an inner structure that has the form of a grid. ### Claim 34 (depends on 22) The optoelectronic component according to claim 22, wherein the medium comprises at least one material selected from the group consisting of: silicone; epoxy resin; and hybrid materials. ### Claim 35 (depends on 22) The optoelectronic component according to claim 22, wherein the medium is filled with white pigments which are composed of at least one material selected from the group consisting of: titanium dioxide (TiO2); aluminum oxide (Al2O3); and zirconium oxide (ZrO). ### Claim 36 (depends on 22) The optoelectronic component according to claim 22, wherein the medium is filled with black pigments which are composed of at least one material selected from the group consisting of: carbon black particles; and graphite particles. ### Claim 37 (depends on 22) The optoelectronic component according to claim 22, wherein the medium is filled with chromatic pigments. ### Claim 38 (depends on 22) The optoelectronic component according to claim 22, further comprising a layer comprising luminophore particles or a layer comprising diffuser particles overlying on an area of the semiconductor chip facing away from the substrate, on an area of the attractor element facing away from the substrate and on the medium. ### Claim 39 A method for producing an optoelectronic component, the method comprising: providing a substrate with a semiconductor chip arranged thereon; arranging a wettable attractor element over the substrate; at least regionally applying a liquid medium comprising pigments to an exposed region of the substrate that is not covered by the semiconductor chip and the attractor element, wherein the semiconductor chip and the attractor element are at least partly wetted; and curing the liquid medium. ### Claim 40 (depends on 39) The method according to patent claim 39, wherein the liquid medium is applied by dispensing. ### Claim 41 An optoelectronic component comprising: a substrate; a semiconductor chip arranged on the substrate; a wettable attractor element arranged on the substrate; and a medium comprising pigments; wherein the medium at least regionally covers an exposed region of the substrate that is not covered by the semiconductor chip or by the attractor element; wherein the medium partly wets the semiconductor chip; wherein the attractor element is completely covered by the medium; and wherein a light-emitting surface of the semiconductor chip is not wetted by the medium.