# US 2014/0191260 A1 · Light emitting semiconductor structure

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- Number: US 2014/0191260 A1
- Document ID: US20140191260A1
- Status: Published application
- Kind: A1
- Application number: 14/209,325
- Filed: 2014-03-13
- Published: 2014-07-10
- Earliest claimed: 2011-04-01
- Assignees: SemiLEDS Optoelectronics Co., Ltd.; VisEra Technologies Company Limited
- Applicants: SemiLEDs Optoelectronics Co., Ltd.; VisEra Technologies Company Limited
- Inventors: Wu-Cheng KUO
- Web page: https://patentgrep.com/patent/US20140191260A1

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- H10W 72/884: {Die-attach connectors and bond wires}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The invention provides a light emitting semiconductor structure, which includes a substrate; a first LED chip formed on the substrate; an adhesion layer formed on the first LED chip; and a second light emitting diode chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate.

## Claims

### Claim at position 1

1-5. (canceled)

### Claim 6

A light emitting semiconductor structure light emitting semiconductor structure, comprising:
a substrate;
a first LED chip formed on the substrate;
an adhesion layer formed on the first LED chip;
a second LED chip formed on the adhesion layer, wherein the second LED chip has a first conductive wire which is electrically connected to the substrate;
a second adhesion layer formed on the second LED chip; and
a third LED chip formed on the second adhesion layer.

### Claim 7 (depends on 6)

The light emitting semiconductor structure as claimed in claim 6, wherein the second LED chip has a third surface contacting the second adhesion layer, the third LED chip has a fourth surface contacting the second adhesion layer, and the third surface is insulated from the fourth surface.

### Claim 8 (depends on 6)

The light emitting semiconductor structure as claimed in claim 6, wherein the third LED chip has a third conductive wire which is electrically connected to the substrate.

### Claim 9 (depends on 6)

The light emitting semiconductor structure as claimed in claim 6, wherein the first LED chip, the second LED chip and the third LED chip emit three different colors of light.

### Claim 10 (depends on 9)

The light emitting semiconductor structure as claimed in claim 9, wherein the three different colors of light comprises blue light, green light and red light.

### Claim 11 (depends on 9)

The light emitting semiconductor structure as claimed in claim 9, wherein the three different colors of light comprises blue light, yellow light and red light.

### Claim 12 (depends on 6)

The light emitting semiconductor structure as claimed in claim 6, further comprising a phosphor coated on the first LED chip, the second LED chip and the third LED chip.

### Claim 13 (depends on 6)

The light emitting semiconductor structure as claimed in claim 6, further comprising a third LED chip formed on the adhesion layer.

### Claim 14 (depends on 13)

The light emitting semiconductor structure as claimed in claim 13, wherein the first LED chip has a first surface contacting the adhesion layer, the third LED chip has a fifth surface contacting the contacting the adhesion layer, and the first surface is insulated from the fifth surface.

### Claim 15 (depends on 13)

The light emitting semiconductor structure as claimed in claim 13, wherein the third LED chip has a third conductive wire which is electrically connected to the substrate.

### Claim 16 (depends on 13)

The light emitting semiconductor structure as claimed in claim 13, wherein the first LED chip, the second LED chip and the third LED chip emit three different colors of light.

### Claim 17 (depends on 16)

The light emitting semiconductor structure as claimed in claim 16, wherein the three different colors of light comprises blue light, green light and red light.

### Claim 18 (depends on 16)

The light emitting semiconductor structure as claimed in claim 16, wherein the three different colors of light comprises blue light, yellow light and red light.

### Claim 19 (depends on 13)

The light emitting semiconductor structure as claimed in claim 13, further comprising a phosphor coated on the first LED chip, the second LED chip and the third LED chip.

### Claim 20 (depends on 6)

The light emitting semiconductor structure as claimed in claim 6, further comprising a phosphor coated on the first LED chip and the second LED chip.