# US 2014/0191259 A1 · Molded chip fabrication method and apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0191259 A1 - Document ID: US20140191259A1 - Status: Published application - Kind: A1 - Application number: 14/209,652 - Filed: 2014-03-13 - Published: 2014-07-10 - Earliest claimed: 2003-09-18 - Assignees: Cree, Inc. - Applicants: Cree, Inc. - Inventors: MICHAEL S. LEUNG; Eric J. Tarsa; James Ibbetson - Web page: https://patentgrep.com/patent/US20140191259A1 ## CPC - H10H 20/8513: {having two or more wavelength conversion materials} - H10D 62/117: {Shapes of semiconductor bodies} - H10H 20/851: Wavelength conversion means - H10H 29/10: Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 (active-matrix LED displays H10H29/30) - H10W 72/0198: {batch processes} - H10W 74/016: {using moulds} - H10H 20/0361: {of wavelength conversion means} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/10: characterised by their shape or disposition - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices. ## Claims ### Claim 1 A method for fabricating a solid state light emitter, comprising: bonding at least one light emitting diode (LED) chip to a temporary bonding media; applying a coating to the at least one LED chip on the bonding media; and removing the at least one LED chip with said coating from the bonding media. ### Claim 2 (depends on 1) The method of claim 1, wherein said LED chip comprises first and second contacts on opposite surfaces, wherein one of said contacts on said bonding media. ### Claim 3 (depends on 2) The method of claim 2, wherein at least a portion of a surface of said one of said contacts is not covered by said coating material. ### Claim 4 (depends on 1) The method of claim 1, wherein said LED chip comprises first and second contacts on the same side of said LED chip, wherein both said first and second contact are on said bonding media. ### Claim 5 (depends on 1) The method of claim 1, wherein at least a portion of a surface of said first and second contacts is not covered by said coating material. ### Claim 6 (depends on 1) The method of claim 1, wherein said at least one LED chip are flip-chip mounted on said bonding media. ### Claim 7 (depends on 1) The method of claim 1, further comprising curing the coating material. ### Claim 8 (depends on 1) The method of claim 1, further comprising curing the coating by one of the processes comprising thermal curing, optical curing and room temperature curing. ### Claim 9 (depends on 1) The method of claim 1, wherein said coating is applied by injection or otherwise introducing said coating over said LED chips. ### Claim 10 (depends on 1) The method of claim 1, wherein aid coating comprises a conformal coating. ### Claim 11 (depends on 1) The method of claim 1, wherein said coating comprises one or more conversion materials. ### Claim 12 (depends on 11) The method of claim 11, wherein said coating comprises a plurality of conversion materials having different peak emissions. ### Claim 13 (depends on 1) The method of claim 1, wherein said coating further comprises a binder material. ### Claim 14 (depends on 1) The method of claim 1, wherein said coating comprises multiple layers. ### Claim 15 (depends on 1) The method of claim 1, wherein said coating further comprises scattering particles. ### Claim 16 (depends on 1) The method of claim 1, wherein said bonding media comprises a polymeric material. ### Claim 17 (depends on 1) The method of claim 1, where said bonding media comprises a film or tape. ### Claim 18 (depends on 17) The method of claim 17, wherein said bonding media further comprises an adhesive. ### Claim 19 (depends on 1) The method of claim 1, wherein said a least one LED chip and coating are formed into a sheet. ### Claim 20 (depends on 19) The method of claim 19, wherein at least one of said at least one LED chip and coating are separated from said sheet after removal from said bonding media. ### Claim 21 (depends on 19) The method of claim 19, wherein at least one of said at least one LED chip and coating are separated from said sheet after removal from said bonding media. ### Claim 22 (depends on 1) The method of claim 1, wherein said coating covers at least some light emitting surfaces of said at least one LED chip. ### Claim 23 (depends on 1) The method of claim 1, wherein said coating covers most light emitting surfaces of said at least one LED chip. ### Claim 24 A method for fabricating a solid state light emitter, comprising: mounting a plurality of light emitting diode (LED) chip to a temporary bonding media; covering said LED chips with a conversion material coating; and curing said coating to form a sheet of LED chips and coating. ### Claim 25 (depends on 24) The method of claim 24, further comprising removing said sheet from said bonding media. ### Claim 26 (depends on 25) The method of claim 25, separating one or more LED chips and coating from said sheet after said removal of said sheet from said bonding media. ### Claim 27 (depends on 24) The method of claim 24, further comprising separating one or more of said LED chips and coating from said sheet. ### Claim 28 (depends on 27) The method of claim 27, further comprising removing said separated LED chips and coating from said bonding media. ### Claim 29 (depends on 24) The method of claim 24, wherein said LED chips are mounted to said temporary bonding media with substantially uniform distance between adjacent ones of said LED chips. ### Claim 30 A plurality of coated LED chips, comprising: a temporary bonding media, a plurality of LED chips on the bonding media with a substantially uniform distance between adjacent ones of said LED chips; and a cured coating over said LED chips, with said LED chips and coating comprising a sheet. ### Claim 31 (depends on 30) The coated LED chips of claim 30, wherein said sheet is capable of removal from said temporary bonding media. ### Claim 32 (depends on 30) The coated LED chips of claim 30, wherein one or more of said LED chips and coating are capable of separation from said sheet.