# US 2014/0191257 A1 · Electronic devices with yielding substrates

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- Number: US 2014/0191257 A1
- Document ID: US20140191257A1
- Status: Published application
- Kind: A1
- Application number: 14/169,384
- Filed: 2014-01-31
- Published: 2014-07-10
- Earliest claimed: 2010-06-29
- Assignees: Cooledge Lighting Inc.
- Inventors: Michael A. Tischler; Philippe M. Schick; Ian Ashdown; Calvin Wade Sheen; Paul Jungwirth
- Web page: https://patentgrep.com/patent/US20140191257A1

## CPC

- F21V 9/30: Elements containing photoluminescent material distinct from or spaced from the light source (shades F21V1/17; globes, bowls or cover glasses F21V3/08, F21V3/12; refractors F21V5/10; reflectors F21V7/26, F21V7/30; elements with provision for controlling the spectral properties or intensity F21V9/40)
- F21K 9/20: Light sources comprising attachment means
- F21K 9/275: Details of bases or housings, i.e. the parts between the light-generating element and the end caps; Arrangement of components within bases or housings (F21K9/278 takes precedence)
- F21K 9/278: Arrangement or mounting of circuit elements integrated in the light source
- F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
- F21K 9/65: specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
- F21K 9/66: Details of globes or covers forming part of the light source
- F21V 3/02: characterised by the shape
- F21V 5/10: comprising photoluminescent material
- F21V 7/30: the coatings comprising photoluminescent substances
- F21V 13/08: the elements being filters or photoluminescent elements and reflectors
- F21V 13/14: the elements being filters or photoluminescent elements, reflectors and refractors
- F21V 23/003: {the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array}
- F21V 23/02: the elements being transformers, impedances {or power supply units, e.g. a transformer with a rectifier}
- F21V 29/74: with fins or blades
- H02S 30/00: Structural details of PV modules other than those related to light conversion (semiconductor device aspects of modules of electrolytic light sensitive devices H01G9/20, of inorganic PV modules H10F10/00, H10F19/00, of organic PV modules H10K30/00)
- H05B 45/12: using optical feedback
- H05B 45/22: using optical feedback
- H05B 47/11: by determining the brightness or colour temperature of ambient light
- H05B 47/115: by determining the presence or movement of objects or living beings
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H10F 19/37: comprising means for obtaining partial light transmission through the integrated devices, or the assemblies of multiple devices, e.g. partially transparent thin-film photovoltaic modules for windows
- H10H 20/811: having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H 20/813: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
- H10H 20/824: comprising only Group III-V materials, e.g. GaP
- H10H 20/825: containing nitrogen, e.g. GaN
- H10H 20/83: Electrodes
- H10H 20/8506: {Containers}
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout}
- H10K 77/111: {Flexible substrates}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/688: {Flexible insulating substrates}
- H10W 90/00: Package configurations
- F21Y 2115/10: Light-emitting diodes [LED]
- G02F 1/133603: {with LEDs}
- H05K 2201/09036: Recesses or grooves in insulating substrate
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2203/302: Bending a rigid substrate; Breaking rigid substrates by bending
- H10H 20/812: within the light-emitting regions, e.g. having quantum confinement structures
- H10H 20/823: comprising only Group II-VI materials, e.g. ZnO
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/354: {comprising polymers}
- H10W 72/931: {Shapes of bond pads}
- H10W 72/944: {Dispositions of multiple bond pads}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y02B 20/40: Control techniques providing energy savings, e.g. smart controller or presence detection
- Y02E 10/549: Organic PV cells
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- H02S: GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES (obtaining electrical energy from radioactive sources G21H1/12; light sensitive inorganic semiconductor devices H10F; light sensitive organic semiconductor devices H10K30/00; thermoelectric devices H10N10/00; pyroelectric devices H10N15/00)
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

## Claims

### Claim at position 1

-62. (canceled)

### Claim 63

An electronic device comprising:
an inorganic light-emitting diode (LED) having first and second spaced-apart contacts;
a flexible substrate having first and second conductive traces on a first surface thereof in a bonding region, the first and second conductive traces being separated on the substrate by a gap therebetween; and
disposed on the substrate, control circuitry electrically connected to the LED,
wherein (i) the first and second conductive traces comprise at least one of silver, gold, aluminum, chromium, copper, or carbon, (ii) the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces via an anisotropic conductive adhesive (ACA) electrically connecting the first contact only to the first trace and the second contact only to the second trace, and (iii) a portion of the ACA is disposed in the gap and substantially isolates the first contact from the second contact.

### Claim 64 (depends on 63)

The device of claim 63, wherein the LED extends across the gap between the first and second traces, and further comprising a second inorganic LED, proximate the LED, extending across the gap between the first and second traces.

### Claim 65 (depends on 63)

The device of claim 63, wherein the substrate comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyethersulfone, polyester, polyimide, polyethylene, or paper.

### Claim 66 (depends on 65)

The device of claim 65, wherein the substrate consists essentially of polyethylene terephthalate.

### Claim 67 (depends on 63)

The device of claim 63, wherein the first and second trances consist essentially of aluminum.

### Claim 68 (depends on 63)

The device of claim 63, wherein a reflectivity of the substrate for a wavelength of light emitted by the LED is greater than 80%.

### Claim 69 (depends on 63)

The device of claim 63, wherein the LED emits white light having a color temperature in the range of 2000K to 7000K.

### Claim 70 (depends on 63)

The device of claim 63, wherein the LED is a packaged LED.

### Claim 71 (depends on 63)

The device of claim 63, wherein the LED is a bare LED die.

### Claim 72 (depends on 63)

The device of claim 63, further comprising a power supply electrically connected to the LED.

### Claim 73 (depends on 63)

The device of claim 63, further comprising an optical element arranged to transmit light emitted by the LED.

### Claim 74 (depends on 73)

The device of claim 73, wherein the optical element is disposed above and optically coupled to the LED.

### Claim 75 (depends on 74)

The device of claim 74, wherein the optical element is disposed in contact with at least one of the substrate or the traces so as to enclose the LED between the substrate and the optical element.

### Claim 76 (depends on 74)

The device of claim 74, further comprising:
a plurality of additional inorganic LEDs each having first and second spaced-apart contacts, the LED and the additional LEDs being arranged in a two-dimensional array on the substrate; and
a plurality of additional optical elements each disposed over and optically coupled to one of the additional LEDs,
wherein (i) the optical element is optically coupled only to the LED, and (ii) each additional optical element is optically coupled only to a different one of the additional LEDs.

### Claim 77 (depends on 63)

The device of claim 63, wherein the substrate comprises a local flexing or a local deformation for maintaining electrical contact between the contacts and traces during operation of the LED.

### Claim 78

A method of forming an electronic device, the method comprising:
providing a flexible substrate having first and second conductive traces on a first surface thereof in a bonding region, the first and second conductive traces being separated on the substrate by a gap therebetween;
providing an inorganic light-emitting diode (LED) having first and second contacts;
providing a pressure-activated adhesive material between the first and second contacts of the LED and the first and second conductive traces;
applying pressure to at least one of the flexible substrate or the LED, thereby establishing electrical connection between at least one of (i) the first contact and the first trace or (ii) the second contact and the second trace, but without electrically bridging the traces or the contacts, such that the LED extends across the gap between the first and second traces,
wherein after the electrical connection is established, the substrate comprises a local flexing or a local deformation for maintaining electrical contact between the contacts and traces during operation of the LED.

### Claim 79 (depends on 78)

The method of claim 78, wherein providing the pressure-activated adhesive material comprises dispensing the pressure-activated adhesive material in substantially liquid form (i) over at least portions of the first and second conductive traces and (ii) within the gap between the first and second conductive traces.

### Claim 80 (depends on 78)

The method of claim 78, further comprising applying heat to the bonding region while applying pressure to at least one of the flexible substrate or the LED.

### Claim 81 (depends on 80)

The method of claim 80, wherein applying heat comprises heating the pressure-activated adhesive material to a temperature in the range of 80° C. to 150° C.

### Claim 82 (depends on 80)

The method of claim 80, wherein applying heat comprises heating the pressure-activated adhesive material for less than approximately 10 minutes.

### Claim 83 (depends on 78)

The method of claim 78, wherein the adhesive material comprises an anisotropic conductive adhesive (ACA) electrically connecting the first contact only to the first trace and the second contact only to the second trace.

### Claim 84 (depends on 83)

The method of claim 83, wherein a portion of the ACA is disposed in the gap and substantially isolates the first contact from the second contact.

### Claim 85 (depends on 78)

The method of claim 78, wherein the adhesive material comprises a substantially isotropic adhesive electrically connecting the first contact only to the first trace and the second contact only to the second trace, and further comprising a non-conductive adhesive material disposed in the gap.

### Claim 86 (depends on 78)

The method of claim 78, further comprising a second inorganic LED, proximate the LED, extending across the gap between the first and second traces.

### Claim 87 (depends on 78)

The method of claim 78, wherein the substrate comprises at least one of polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyethersulfone, polyester, polyimide, polyethylene, or paper.

### Claim 88 (depends on 78)

The method of claim 78, wherein a reflectivity of the substrate for a wavelength emitted by the LED is greater than 80%.

### Claim 89 (depends on 78)

The method of claim 78, wherein the LED emits white light having a color temperature in the range of 2000K to 7000K.

### Claim 90 (depends on 78)

The method of claim 78, wherein the LED is a packaged LED.

### Claim 91 (depends on 78)

The method of claim 78, wherein the LED is a bare LED die.

### Claim 92 (depends on 78)

The method of claim 78, further comprising electrically connecting a power supply to the LED.

### Claim 93 (depends on 78)

The method of claim 78, further comprising arranging an optical element to transmit light emitted by the LED.

### Claim 94 (depends on 78)

The method of claim 78, wherein the substrate comprises third and fourth conductive traces on the first surface thereof, the third and fourth conductive traces being separated on the substrate by a gap therebetween, further comprising:
providing an electronic component having first and second contacts;
providing a pressure-activated adhesive material between the first and second contacts of the electronic component and the third and fourth conductive traces; and
applying pressure to at least one of the flexible substrate or the electronic component, thereby establishing electrical connection between at least one of (i) the first contact of the electronic component and the third trace or (ii) the second contact of the electronic component and the fourth trace, but without electrically bridging the third and fourth traces or the contacts of the electronic component, such that the electronic component extends across the gap between the third and fourth traces.

### Claim 95 (depends on 94)

The method of claim 94, wherein the electronic component comprises at least one of a resistor, inductor, capacitor, transistor, battery, or integrated circuit.

### Claim 96 (depends on 94)

The method of claim 94, wherein the electronic component does not emit light and is electrically connected in series with the LED.

### Claim 97 (depends on 78)

The method of claim 78, wherein (i) the flexible substrate is provided in roll form and (ii) providing the pressure-activated adhesive material and applying pressure are performed in a roll-to-roll process.

### Claim 98 (depends on 78)

The method of claim 78, wherein the conductive traces comprise at least one of silver, gold, aluminum, chromium, copper, or carbon.