# US 2014/0191255 A1 · Led module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0191255 A1 - Document ID: US20140191255A1 - Status: Published application - Kind: A1 - Application number: 14/133,747 - Filed: 2013-12-19 - Published: 2014-07-10 - Earliest claimed: 2013-01-08 - Assignees: OSRAM GmbH - Applicants: OSRAM GmbH - Inventors: Farhang Ghasemi Afshar; Krister Bergenek; Andreas Dobner; Holger Huebner; Meik Weckbecker; Ralph Wirth - Web page: https://patentgrep.com/patent/US20140191255A1 ## CPC - H05B 45/00: Circuit arrangements for operating light-emitting diodes [LED] - H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL ## Abstract In various embodiments, a light emitting diode module may include a carrier plate, at least one light emitting diode, and at least one sensor configured to register light emitted by the light emitting diode. The light emitting diode is attached to a light emitting diode installation side of the carrier plate. The sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof. ## Claims ### Claim 1 A light emitting diode module, comprising: a carrier plate; at least one light emitting diode; and at least one sensor configured to register light emitted by the light emitting diode, wherein the light emitting diode is attached to a light emitting diode installation side of the carrier plate, wherein the sensor is installed countersunk through a hole of the carrier plate in relation to the light emitting diode installation side thereof. ### Claim 2 (depends on 1) The light emitting diode module of claim 1, further comprising: a plurality of light emitting diode, which are attached jointly to a carrier plate. ### Claim 3 (depends on 1) The light emitting diode module of claim 1, wherein the sensor is installed with its light emitting diode installation side countersunk in an emission direction of the light emitting diodes in relation to the light emitting diode installation side of the carrier plate. ### Claim 4 (depends on 1) The light emitting diode module of claim 1, wherein the hole is a through hole penetrating the carrier plate and the sensor is attached in or below the through hole. ### Claim 5 (depends on 1) The light emitting diode module of claim 1, wherein the hole only exposes a part of a sensitive surface of the sensor toward the emission side of the light emitting diodes. ### Claim 6 (depends on 1) The light emitting diode module of claim 1, wherein the sensor is connected through a connection hole through the carrier plate to a connection element. ### Claim 7 (depends on 6) The light emitting diode module of claim 6, wherein the sensor is connected through a connection hole through the carrier plate to a plug contact on the light emitting diode installation side of the carrier plate. ### Claim 8 (depends on 2) The light emitting diode module of claim 2, wherein the light emitting diodes are of different colors, wherein the sensor is designed for registering light emitted from the light emitting diodes in mixed form. ### Claim 9 (depends on 1) The light emitting diode module of claim 1, wherein the sensor is arranged under a diffuse layer with respect to an emission direction of the light emitting diodes, and is designed for the purpose of registering light, which is generated by the light emitting diodes and is diffusely reflected by the diffuse layer. ### Claim 10 (depends on 9) The light emitting diode module of claim 9, wherein the diffuse layer comprises a phosphor layer. ### Claim 11 (depends on 1) The light emitting diode module of claim 1, wherein the sensor is attached to a separate carrier and via this carrier to the carrier plate. ### Claim 12 (depends on 1) The light emitting diode module of claim 1, wherein the sensor is an optical color sensor, which can output X, Y, and Z color values. ### Claim 13 (depends on 8) The light emitting diode module of claim 8, further comprising: an at least translucent coupling body, which is arranged above the sensor in relation to an emission direction of the light emitting diodes, and has at least one of a diffuser or reflector on a top side in relation to the emission direction and is designed for the purpose of absorbing light generated by the light emitting diodes on a lateral jacket surface and supplying it, in at least one of mixed form or vertically selected with respect to the sensor surface, to the sensor. ### Claim 14 (depends on 1) The light emitting diode module of claim 1, wherein a height of the coupling body above an emission surface of the light emitting diode module is between one-eighth of the mean diameter of this emission surface and this diameter. ### Claim 15 (depends on 1) The light emitting diode module of claim 1, wherein the sensor is protected by a screen envelope in a lower region of the lateral jacket surface against undesired light coupling. ### Claim 16 (depends on 1) The light emitting diode module of claim 1, further comprising: a neutral filter on the sensor for light current reduction.