# US 2014/0191253 A1 · Optoelectronic device and method for producing optoelectronic devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0191253 A1 - Document ID: US20140191253A1 - Status: Published application - Kind: A1 - Application number: 14/118,367 - Filed: 2011-05-19 - Published: 2014-07-10 - Earliest claimed: 2011-05-19 - Assignees: OSRAM Opto Semiconductors GmbH - Inventors: Stephan Haslbeck; Markus Foerste; Michael Schwind; Martin Haushalter; Hubert Halbritter; Frank Möllmer - Web page: https://patentgrep.com/patent/US20140191253A1 ## CPC - H10W 90/00: Package configurations - H10F 55/25: wherein the radiation-sensitive devices and the electric light source are all semiconductor devices - H10F 77/331: {for filtering or shielding light, e.g. multicolour filters for photodetectors} - H10F 77/407: {indirectly associated with the devices} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10H 20/8506: {Containers} - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/856: Reflecting means - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract An optoelectronic device includes an optoelectronic component that receives or generates radiation, a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed, and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component. ## Claims ### Claim at position 1 1-15. (canceled) ### Claim 16 An optoelectronic device, comprising: an optoelectronic component that receives or generates radiation; a frame having a cavity, the optoelectronic component being arranged in said cavity, a connection carrier to which the optoelectronic component is fixed; and a cover covering the cavity and forming a radiation passage area for the radiation; wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component. ### Claim 17 (depends on 16) The optoelectronic device according to claim 16, wherein the connection carrier is arranged on a side of the frame facing away from the cover. ### Claim 18 (depends on 16) The optoelectronic device according to claim 16, further comprising an opening for an air exchange between the cavity and the environment. ### Claim 19 (depends on 18) The optoelectronic device according to claim 18, wherein the connection carrier is a circuit board and the connection carrier has the opening. ### Claim 20 (depends on 16) The optoelectronic device according to claim 16, further comprising contact areas for the external electrical contact-making on a side facing away from the radiation passage area, and the contact areas electrically connect to the optoelectronic component via plated-through holes through the connection carrier. ### Claim 21 (depends on 16) The optoelectronic device according to claim 16, wherein the cover is a film containing a polyimide. ### Claim 22 (depends on 16) The optoelectronic device according to claim 16, wherein the frame, the connection carrier and the cover terminate flush at least along one direction. ### Claim 23 (depends on 16) The optoelectronic device according to claim 16, wherein the cavity has an undercut region in a direction running from the cover to the optoelectronic component. ### Claim 24 (depends on 16) The optoelectronic device according to claim 16, wherein the cavity has a region that tapers at least regionally from the cover in a direction of the optoelectronic component. ### Claim 25 (depends on 16) The optoelectronic device according claim 16, further comprising a further optoelectronic component, which together with the optoelectronic component forms an emitter-detector pair. ### Claim 26 (depends on 25) The optoelectronic device according to claim 25, wherein the further optoelectronic component is arranged in a further cavity and the further cavity is spaced apart from the cavity. ### Claim 27 (depends on 16) The optoelectronic device according to claim 16, which is a proximity sensor and/or an ambient light sensor. ### Claim 28 A method of producing a plurality of optoelectronic devices comprising: a) providing a connection carrier assemblage; b) arranging optoelectronic components on the connection carrier assemblage; c) positioning a frame element having a plurality of cavities on the connection carrier assemblage such that the optoelectronic components are respectively arranged in a cavity; d) arranging a cover on the frame element; and e) severing the connection carrier assemblage into a plurality of connection carriers, on each of which at least one optoelectronic component and a frame having a cavity are arranged. ### Claim 29 (depends on 28) The method according to claim 28, wherein the cover, the frame element and the connection carrier assemblage are severed in e). ### Claim 30 An optoelectronic device comprising: an optoelectronic component that receives or generates radiation; a frame having a cavity, the optoelectronic component arranged in said cavity; a connection carrier to which the optoelectronic component is fixed, wherein the connection carrier is a circuit board and has a plated through hole through the connection carrier, the plated through hole being an opening for an air exchange between the cavity and the environment; and a cover covering the cavity and forming a radiation passage area for the radiation, wherein a beam path from the optoelectronic component to the radiation passage area is free of an encapsulation material for the optoelectronic component.