# US 2014/0191233 A1 · Microphone component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0191233 A1 - Document ID: US20140191233A1 - Status: Published application - Kind: A1 - Application number: 14/142,360 - Filed: 2013-12-27 - Published: 2014-07-10 - Earliest claimed: 2013-01-04 - Assignees: Robert Bosch GmbH - Inventors: Bernhard GEHL; Thomas Buck; Florian Schoen - Web page: https://patentgrep.com/patent/US20140191233A1 ## CPC - B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) - H04R 1/245: {of microphones} - H04R 19/005: {using semiconductor materials} - H10P 74/27: {Structural arrangements therefor} - H04R 19/04: Microphones (H04R19/01 takes precedence) - H10W 70/681: {comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage} - H10W 90/753: {between laterally-adjacent chips} - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A 2-chip MEMS microphone component includes: at least one first MEMS microphone structural component having at least one first microphone structure formed in the front side of the structural component; an ASIC structural component having evaluation electronics for the microphone signal of the MEMS microphone structural component; and a housing having a sound opening. The MEMS microphone structural component is mounted within the housing and above the sound opening in such a way that the rear side of the microphone structure is acted on by the sound pressure. The ASIC structural component also includes a second MEMS microphone structure whose microphone signal is fed to the evaluation electronics. ## Claims ### Claim 1 A microphone component, comprising: a first MEMS microphone structural component having at least one first microphone structure formed in the front side of the structural component; an ASIC structural component having evaluation electronics for the microphone signal of the first MEMS microphone structural component; and a housing having a sound opening; wherein the first MEMS microphone structural component is mounted within the housing and above the sound opening such that that the rear side of the first microphone structure is acted on by the sound pressure, and wherein the ASIC structural component includes a second MEMS microphone structure, and wherein a microphone signal of the second MEMS microphone structure is fed to the evaluation electronics. ### Claim 2 (depends on 1) The microphone component as recited in claim 1, wherein the evaluation electronics evaluates the redundancy of the microphone signals of the first MEMS microphone structural component and of the second MEMS microphone structure of the ASIC structural component in order to monitor the functionality of the microphone component. ### Claim 3 (depends on 2) The microphone component as recited in claim 2, wherein the characteristic behavior of the second MEMS microphone structure of the ASIC structural component differs from the characteristic behavior of the first MEMS microphone structural component, and the second MEMS microphone structure of the ASIC structural component has a different microphone sensitivity than the first MEMS microphone structural component in at least one frequency range. ### Claim 4 (depends on 3) The microphone component as recited in claim 3, wherein the first MEMS microphone structural component is configured for a frequency of approximately 16 Hz to 20 kHz, and wherein the second MEMS microphone structure of the ASIC structural component is configured for a frequency range of approximately 20 kHz to 100 kHz. ### Claim 5 (depends on 4) The microphone component as recited in claim 4, wherein at least one of the first microphone component of the first MEMS microphone structural component and the second microphone component of the ASIC structural component is configured to be activated as a sound source for calibrating the respective other microphone component. ### Claim 6 (depends on 2) The microphone component as recited in claim 2, wherein the ASIC structural component includes an absolute pressure sensor component for detecting the internal pressure of the housing. ### Claim 7 (depends on 2) The microphone component as recited in claim 2, wherein the second MEMS microphone structure of the ASIC structural component is connected via a pressure channel to the sound opening in the housing. ### Claim 8 (depends on 7) The microphone component as recited in claim 7, wherein: the second MEMS microphone structure is formed in the front side of the ASIC structural component; the ASIC structural component is mounted face-up and adjacent to the first MEMS microphone structural component on a support of the housing; and the pressure channel is limited by (i) the support and (ii) a section of the rear side of the first MEMS microphone structural component and a section of the rear side of the ASIC structural component. ### Claim 9 (depends on 8) The microphone component as recited in claim 8, wherein the pressure channel is in the form of a trench structure in at least one of (i) the support upper surface, (ii) the rear side of the first MEMS microphone structural component, and (iii) the ASIC structural component.