# US 2014/0190946 A1 · Laser Microdissection Method and Laser Microdissection Device

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- Number: US 2014/0190946 A1
- Document ID: US20140190946A1
- Status: Published application
- Kind: A1
- Application number: 14/005,575
- Filed: 2012-03-21
- Published: 2014-07-10
- Earliest claimed: 2011-03-22
- Assignees: Carl Zeiss Microscopy GmbH
- Inventors: Michael Gögler
- Web page: https://patentgrep.com/patent/US20140190946A1

## CPC

- G01N 1/286: {involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising (microtomes G01N1/06; pulverising in general B02C; mixing in general B01F)}
- B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)}
- B23K 26/38: by boring or cutting
- B23K 2103/30: {Organic materials}
- G01N 2001/2886: {Laser cutting, e.g. tissue catapult}
- G05B 2219/45041: Laser cutting
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- G05B: CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables G05D; systems for regulating electric or magnetic variables G05F; control devices or systems insofar as characterised by mechanical features only G05G)

## Abstract

Methods and apparatuses for laser microdissection are provided. For example, by a user at least one first system parameter is adjusted, for example varied, and at least one second system parameter of the laser microdissection system is adjusted automatically by the laser microdissection system such that a cut line has a desired cut line parameter.

## Claims

### Claim 1

A method for laser microdissection, comprising:
adjusting at least one first system parameter of a laser microdissection system, and
automatically adjusting at least one second system parameter of the laser microdissection system depending on the at least one first system parameter such that a desired value of a cut line parameter describing a cut line of the laser microdissection is present.

### Claim 2 (depends on 1)

The method of claim 1, further comprising:
initial adjusting of the at least one first system parameter and the at least one second system parameter such that the desired value of the cut line parameter is present,
wherein adjusting of the at least one first system parameter comprises a varying of the at least one first system parameter from a value of the initial adjusting, and
wherein the automatic adjustment of the at least one second system parameter takes place such that the desired cut line parameter is kept constant at least within a predetermined range.

### Claim 3 (depends on 2)

The method of claim 2, further comprising a confirming of the cut line parameter as to be kept to be constant after the initial adjusting.

### Claim 4 (depends on 1)

The method of claim 1, wherein the automatically adjusting takes place depending on at least one characteristic curve, which describes a dependency of the at least one second parameter from the at least one first system parameter with at least one predetermined cut line parameter.

### Claim 5 (depends on 1)

The method of claim 1, further comprising cutting of a biologic object with the at least one first system parameter and the at least one second system parameter.

### Claim 6 (depends on 1)

The method of claim 1, wherein the at least one first system parameter is selected from a group comprising an energy of a laser, a repetition rate of a laser, a focus of a laser, an aperture of a laser, a profile of a laser beam of a laser and a cutting speed.

### Claim 7 (depends on 1)

The method of claim 1, wherein the at leas one second parameter is selected from a group comprising an energy of a laser, a repetition rate of a laser, a focus of a laser, an aperture of a laser, a profile of a laser beam of a laser and a cutting speed.

### Claim 8 (depends on 1)

The method of claim 1, wherein the cut line parameter is selected from the group comprising a cut width and a parameter describing an interruption freeness of a cut line.

### Claim 9 (depends on 1)

The method of claim 1, wherein the adjusting of the at least one first system parameter comprising an adjusting of a laser energy and/or a repetition rate of a laser, and wherein the automatic adjusting of at least one second parameter comprises an adjusting of the cutting speed such that a resulting cut line is free of interruptions.

### Claim 10 (depends on 1)

The method of claim 1, wherein adjusting of the at least one first system parameter comprises an increasing of a cutting speed.

### Claim 11 (depends on 1)

The method of claim 1, wherein the adjusting of the at least one first system parameter is performed by a user of the laser microdissection system.

### Claim 12

A laser microdissection system, comprising:
a laser device,
a receiving device for a sample to be treated, and
a control device, wherein the control device is configured to enable an adjusting of at least one first system parameter of the laser microdissection system and further to automatically adjust at least one second system parameter of the laser microdissection system depending on the at least one first system parameter such that a desired value of a cut line parameter describing a cut line of the laser microdissection system is obtained.

### Claim 13 (depends on 12)

The system of claim 12, further comprising a user interface for adjusting the at least one first system parameter.

### Claim 14 (depends on 12)

The system of claim 12, the system being configured to allow:
an initial adjusting of the at least one first system parameter and the at least one second system parameter such that the desired value of the cut line parameter is present,
wherein adjusting of the at least one first system parameter comprises a varying of the at least one first system parameter from a value of the initial adjusting, and
wherein the control device is configured such that the automatic adjustment of the at least one second system parameter takes place such that the desired cut line parameter is kept constant at least within a predetermined range.

### Claim 15 (depends on 12)

The system of claim 12, wherein the control device is configured such that the automatically adjusting takes place depending on at least one characteristic curve, which describes a dependency of the at least one second parameter from the at least one first system parameter with at least one predetermined cut line parameter.

### Claim 16 (depends on 12)

The system of claim 12, wherein the at least one first system parameter is selected from a group consisting of an energy of a laser, a repetition rate of a laser, a focus of a laser, an aperture of a laser, a profile of a laser beam of a laser and a cutting speed.

### Claim 17 (depends on 12)

The system of claim 12, wherein the at least one second parameter is selected from a group consisting of an energy of a laser, a repetition rate of a laser, a focus of a laser, an aperture of a laser, a profile of a laser beam of a laser and a cutting speed.

### Claim 18 (depends on 12)

The system of claim 12, wherein the cut line parameter is selected from the group consisting of a cut width and a parameter describing an interruption freeness of a cut line.

### Claim 19 (depends on 12)

The system of claim 12, wherein the control device is configured to adjust at least one of a laser energy and a repetition rate as adjustment of the at least one second system parameter in response to an increasing of a cutting speed as the adjusting of the at least one first system parameter.