# US 2014/0190937 A1 · System and Method for Cleaning Semiconductor Fabrication Equipment Parts

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- Number: US 2014/0190937 A1
- Document ID: US20140190937A1
- Status: Published application
- Kind: A1
- Application number: 14/209,289
- Filed: 2014-03-13
- Published: 2014-07-10
- Earliest claimed: 2000-08-11
- Assignees: Quantum Global Technologies, LLC
- Applicants: Quantum Global Technologies LLC
- Inventors: Samantha Tan
- Web page: https://patentgrep.com/patent/US20140190937A1

## CPC

- B44C 1/22: Removing surface-material, e.g. by engraving, by etching {(for multi-layer articles B44C3/005)}
- B08B 3/00: Cleaning by methods involving the use or presence of liquid or steam (B08B9/00 takes precedence)
- B08B 3/08: the liquid having chemical or dissolving effect
- B08B 3/12: by sonic or ultrasonic vibrations
- B44C 1/227: {by etching}
- C11D 3/3947: {Liquid compositions}
- C11D 7/08: Acids
- C23C 16/4407: {Cleaning of reactor or reactor parts by using wet or mechanical methods}
- H10P 72/0604: {Process monitoring, e.g. flow or thickness monitoring}
- C11D 2111/22: Electronic devices, e.g. PCBs or semiconductors
- Y10S 134/902: Semiconductor wafer
- Y10T 436/12: Condition responsive control
- B44C: PRODUCING DECORATIVE EFFECTS (processes for applying liquids or other fluent materials to surfaces, in general B05D; shaping of plastics or substances in a plastic state B29C; printing processes to produce transfer pictures B41M3/12; thermographic duplication or marking methods B41M5/00); MOSAICS; TARSIA WORK (imitation of mosaic or tarsia work patterns B44F11/04); PAPERHANGING {(labels G09F; multi-step processes for making paper labels or tags B31D1/02)}
- B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- C11D: DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An exemplary embodiment discloses a process for cleaning semiconductor fabrication equipment parts with non-metallic surfaces. The process optionally includes providing a semiconductor fabrication part with a non-metallic surface to be cleaned and applying a dilute aqueous solution to remove contamination from the non-metallic surface. The aqueous solution optionally includes dilute amounts of hydrofluoric acid, nitric acid and hydrogen peroxide. The dilute amounts would optionally be in the ranges of 0.5-1.5% wt. hydrofluoric acid, 0.1-0.5% wt. nitric acid and 1-10% wt. hydrogen peroxide.

## Claims

### Claim 1

A method for removing particles on a textured surface of a semiconductor fabrication equipment part comprising: determining a chemical bonding characteristic of the particles; identifying a type of particles embedded in the textured surface; measuring a depth of any subsurface damage; and performing a combination of ultrasonication and chemical etching to the textured surface based upon said chemical bonding characteristics, said type of particles and said depth of subsurface damage.