# US 2014/0190931 A1 · Removal of selected portions of protective coatings from substrates > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190931 A1 - Document ID: US20140190931A1 - Status: Published application - Kind: A1 - Application number: 14/157,743 - Filed: 2014-01-17 - Published: 2014-07-10 - Earliest claimed: 2013-01-08 - Assignees: HZO, Inc. - Applicants: HzO, Inc. - Inventors: David James Astle; Tyler Christensen Child; Vimal Kumar Kasagani; Cameron LaMar Loose; Blake LeRoy Stevens; Max Ernest Sorenson - Web page: https://patentgrep.com/patent/US20140190931A1 ## CPC - B23K 26/362: Laser etching - B05D 1/322: {Removable films used as masks} - B23K 26/0622: by shaping pulses - B23K 26/082: Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head - B23K 26/361: for deburring or mechanical trimming (B23K26/351 takes precedence) - B23K 26/402: involving non-metallic material, e.g. isolators - B24C 1/003: {using material which dissolves or changes phase after the treatment, e.g. ice, CO2} - B24C 3/322: {for electrical components} - C09J 9/00: Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks (C09J7/00 takes precedence) - C23C 14/042: {using masks} - C23C 16/042: {using masks} - H05K 1/181: associated with surface mounted components - H05K 3/0079: {characterised by the method of application or removal of the mask (H05K3/0091 takes precedence)} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/288: {Removal of non-metallic coatings, e.g. for repairing} - H10P 72/04: {Apparatus for manufacture or treatment} - H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like} - H10W 74/01: Manufacture or treatment - H10W 74/014: {using batch processing} - B23K 2103/50: {Inorganic materials other than metals or composite materials} - C09J 2301/304: the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C - H05K 3/0073: {Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces} - H05K 3/285: {Permanent coating compositions} - H05K 2201/0145: Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] - H05K 2201/09872: Insulating conformal coating - H05K 2203/025: Abrading, e.g. grinding or sand blasting - H05K 2203/092: Particle beam, e.g. using an electron beam or an ion beam - H05K 2203/095: Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes - H05K 2203/107: Using laser light - H05K 2203/1105: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating - H05K 2203/163: Monitoring a manufacturing process - H10W 74/114: {by a substrate and the encapsulations} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02) - B24C: ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed. ## Claims ### Claim 1 A method for selectively applying a protective coating to a substrate, comprising: applying a protective coating to a substrate; and selectively removing at least one selected portion of the protective coating from at least one selected component or feature of the substrate to expose the at least one selected component or feature through the protective coating. ### Claim 2 (depends on 1) The method of claim 1, wherein applying the protective coating to the substrate comprises applying the protective coating to a consumer electronic device or a subassembly of a consumer electronic device. ### Claim 3 (depends on 2) The method of claim 2, wherein applying the protective coating comprises applying a poly(p-xylylene) coating to the substrate. ### Claim 4 (depends on 1) The method of claim 1, wherein selectively removing the at least one selected portion of the protective coating comprises exposing at least some locations of the at least one selected portion of the protective coating to a removal medium. ### Claim 5 (depends on 4) The method of claim 4, wherein exposing at least some locations of the at least one selected portion of the protective coating to the removal medium comprises exposing at least some locations of the at least one selected portion of the protective coating to a laser beam. ### Claim 6 (depends on 4) The method of claim 4, wherein exposing at least some locations of the at least one selected portion of the protective coating to the removal medium comprises exposing at least some locations of the at least one selected portion of the protective coating to an abrasive removal medium. ### Claim 7 (depends on 6) The method of claim 6, wherein exposing at least some locations of the at least one selected portion of the protective coating to the abrasive removal medium comprises exposing at least some locations of the at least one selected portion of the protective coating to particulate solid carbon dioxide, particulate starch or sand. ### Claim 8 (depends on 4) The method of claim 4, wherein exposing at least some locations of the at least one selected portion of the protective coating to the removal medium comprises exposing at least some locations of the at least one selected portion of the protective coating to a heated element. ### Claim 9 (depends on 1) The method of claim 1, wherein selectively removing the at least one selected portion of the protective coating comprises cutting the at least one selected coating from a remainder of the protective coating. ### Claim 10 (depends on 9) The method of claim 9, wherein selectively removing comprises use of a laser beam, an abrasive material, a heated element, a plasma or an ion beam. ### Claim 11 (depends on 9) The method of claim 9, wherein cutting is effected by manually positioning a removal tool to direct a removal medium onto the protective coating. ### Claim 12 (depends on 1) The method of claim 1, wherein selectively removing the at least one selected portion of the protective coating comprises ablating the at least one selected portion of the protective coating. ### Claim 13 (depends on 12) The method of claim 12, wherein ablating comprises laser ablation, ablation with an abrasive material or plasma etching. ### Claim 14 (depends on 12) The method of claim 12, wherein ablating comprises automatically scanning a removal tool to direct a removal medium onto the protective coating. ### Claim 15 (depends on 12) The method of claim 12, further comprising: aligning and positioning a template over the protective coating with the at least one selected portion of the protective coating exposed through an aperture in the template before ablating the at least one selected portion of the protective coating. ### Claim 16 (depends on 1) The system of claim 1, wherein applying the protective coating comprises applying a moisture-resistant coating to the substrate. ### Claim 17 A system for applying a protective coating to a substrate, the system comprising: a coating element configured to apply a moisture-resistant coating to at least a portion of a substrate to provide a protectively coated substrate; and a removal element configured to receive the protectively coated substrate and to selectively remove at least one selected portion of the moisture-resistant coating without removing the moisture-resistant coating from at least one protected area of the substrate. ### Claim 18 (depends on 17) The system of claim 17, further comprising: the substrate. ### Claim 19 (depends on 17) The system of claim 17, further comprising: a positioning mechanism for that: positions the removal element to expose the at least one selected portion of the moisture-resistant coating to a removal medium from the removal element; and moves the removal element over the at least one selected portion of the moisture-resistant coating. ### Claim 20 (depends on 17) The system of claim 17, wherein the removal element is configured to focus the removal medium and to direct focused removal media onto the at least one selected portion of the moisture-resistant coating. ### Claim 21 (depends on 17) The system of claim 17, wherein the removal element is configured to direct unfocused removal media onto the at least one selected portion of the moisture-resistant coating. ### Claim 22 (depends on 17) The system of claim 17, further comprising: a template configured to be positioned over the substrate, the template including an aperture configured to be positioned over and to expose the at least one selected portion of the moisture-resistant coating. ### Claim 23 (depends on 17) The system of claim 17, wherein the removal element comprises a laser, an abrasive dispenser, a heated element or a liquid dispenser. ### Claim 24 A system for applying a protective coating to an electronic device, the system comprising: a coating element for applying a protective coating to at least a portion of an electronic assembly; and a removal element including: a containment unit for storing an abrasive material; and a dispensing element comprising: an accelerator for accelerating the abrasive material; and a nozzle for directing the abrasive material at one or more selected portions of the protective coating. ### Claim 25 (depends on 24) The system of claim 24, wherein the abrasive material is particulate solid carbon dioxide, particulate starch or sand. ### Claim 26 (depends on 24) The system of claim 24, wherein the removal element further comprises a template configured to be positioned over the electronic assembly, the template including an aperture configured to be positioned over and to expose the at least one selected portion of the protective coating. ### Claim 27 (depends on 24) The system of claim 24, wherein the removal element is configured to focus the abrasive material. ### Claim 28 (depends on 27) The system of claim 27, wherein the removal element further comprises: a positioning mechanism that: positions the nozzle to expose the at least one selected portion of the protective coating to the abrasive material; and moves the nozzle over the at least one selected portion of the moisture-resistant coating. ### Claim 29 (depends on 24) The system of claim 24, wherein the removal element is configured to direct unfocused abrasive material onto the protective coating.