# US 2014/0190930 A1 · Methods for transparent encapsulation and selective encapsulation > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190930 A1 - Document ID: US20140190930A1 - Status: Published application - Kind: A1 - Application number: 13/935,250 - Filed: 2013-07-03 - Published: 2014-07-10 - Earliest claimed: 2013-01-04 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: Sean A. Mayo; James H. Foster; Trevor J. Ness; Shankar S. Pennathur - Web page: https://patentgrep.com/patent/US20140190930A1 ## CPC - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 3/288: {Removal of non-metallic coatings, e.g. for repairing} - H05K 2201/0108: Transparent - H05K 2201/10106: Light emitting diode [LED] - H05K 2203/107: Using laser light - H05K 2203/1316: Moulded encapsulation of mounted components - H05K 2203/1476: Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components. ## Claims ### Claim 1 A method for selectively encapsulating a circuit board, the method comprising: encapsulating the circuit board using a first encapsulant; removing the first encapsulant from a first region of the circuit board; and encapsulating the first region of the circuit board using a second encapsulant. ### Claim 2 (depends on 1) The method as recited in claim 1, wherein the second encapsulant is optically transparent. ### Claim 3 (depends on 1) The method as recited in claim 1, wherein the second encapsulant is thermally conductive. ### Claim 4 (depends on 1) The method as recited in claim 1, wherein the second encapsulant is electrically conductive. ### Claim 5 (depends on 1) The method as recited in claim 1, wherein removing the first encapsulant comprises at least one of ablation, etching, and milling. ### Claim 6 (depends on 1) The method as recited in claim 1, wherein the first encapsulant and the second encapsulant are formed of at least partially different encapsulating materials. ### Claim 7 (depends on 1) The method as recited in claim 1, further comprising: removing the first encapsulant from a second region of the circuit board; and encapsulating the second region of the circuit board using a third encapsulant. ### Claim 8 (depends on 7) The method as recited in claim 7, the first encapsulant, the second encapsulant, and the third encapsulant are formed of at least partially different encapsulating materials. ### Claim 9 A method for selectively encapsulating a circuit board, the method comprising: receiving the circuit board in a mold fixture, wherein the mold fixture defines a first region of the circuit board configured to receive a first encapsulant and a second region of the circuit board configured to be restricted of the first encapsulant; and encapsulating the first region of the circuit board in the mold fixture using the first encapsulant. ### Claim 10 (depends on 9) The method as recited in claim 9, further comprising: encapsulating the second region of the circuit board with a second encapsulant. ### Claim 11 (depends on 10) The method as recited in claim 10, wherein the second encapsulant is optically transparent. ### Claim 12 (depends on 10) The method as recited in claim 10, wherein the second encapsulant is thermally conductive. ### Claim 13 (depends on 10) The method as recited in claim 10, wherein the second encapsulant is electrically conductive. ### Claim 14 (depends on 10) The method as recited in claim 10, wherein the first encapsulant and the second encapsulant are formed of at least partially different encapsulating materials. ### Claim 15 (depends on 10) The method as recited in claim 10, further comprising: removing a portion of the first encapsulant or the second encapsulant from a third region of the circuit board; and encapsulating the third region of the circuit board using a third encapsulant. ### Claim 16 (depends on 15) The method as recited in claim 15, the first encapsulant, the second encapsulant, and the third encapsulant are formed of at least partially different encapsulating materials. ### Claim 17 A method for selectively encapsulating a circuit board, the method comprising: receiving the circuit board in a mold fixture, wherein the mold fixture defines a first region of the circuit board configured to receive a first encapsulant and a second region of the circuit board configured to receive a second encapsulant; encapsulating the first region of the circuit board in the mold fixture using the first encapsulant; and encapsulating the second region of the circuit board in the mold fixture using the second encapsulant. ### Claim 18 (depends on 17) The method as recited in claim 17, wherein the second encapsulant is optically transparent, thermally conductive, or electrically conductive. ### Claim 19 A method for selectively encapsulating a circuit board, the method comprising: defining a first region of the circuit board with a cutting barrier and a release layer, wherein the release layer is configured to restrict adhering of a first encapsulant to a surface of the circuit board within the first region; encapsulating the circuit board and the release layer with the first encapsulant; and removing the first encapsulant covering the first region with a cutting process. ### Claim 20 (depends on 19) The method as recited in claim 19, wherein the cutting barrier is a laser barrier configured to impede a path of a laser beam and wherein the cutting process is a laser cutting process configured to cut the first encapsulant adjacent the laser barrier.