# US 2014/0190835 A1 · Plating apparatus, nozzle-anode unit, method of manufacturing plated member, and fixing apparatus for member to be plated > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190835 A1 - Document ID: US20140190835A1 - Status: Published application - Kind: A1 - Application number: 14/155,175 - Filed: 2014-01-14 - Published: 2014-07-10 - Earliest claimed: 2012-11-01 - Assignees: Yuken Industry Co., Ltd. - Applicants: Yuken Industry Co., Ltd. - Inventors: Norikazu KOJIMA; Yoshiharu KIKUCHI - Web page: https://patentgrep.com/patent/US20140190835A1 ## CPC - C25D 5/04: Electroplating with moving electrodes - C25D 17/00: Constructional parts, or assemblies thereof, of cells for electrolytic coating - C25D 17/06: Suspending or supporting devices for articles to be coated - C25D 17/10: Electrodes {, e.g. composition, counter electrode} - C25D 21/10: Agitating of electrolytes; Moving of racks - C25D 21/12: Process control or regulation (controlling or regulating in general G05) - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR ## Abstract A plating apparatus includes a plating bath, an insoluble anode located in the plating bath, a plating electric power supply being capable of applying a voltage between the insoluble anode and the member to be plated, an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath, and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism. ## Claims ### Claim 1 A plating apparatus comprising: a plating bath; an insoluble anode located in the plating bath; a plating electric power supply being capable of applying a voltage between the insoluble anode and a member to be plated; an anode-displacement mechanism being capable of moving the insoluble anode in the plating bath and of holding the insoluble anode at a predetermined position in the plating bath; and a controller having an anode-position controller being capable of generating a control signal for controlling an action of the anode-displacement mechanism and of outputting the control signal to the anode-displacement mechanism. ### Claim 2 (depends on 1) The plating apparatus according to claim 1 comprising a measurement instrument being capable of measuring at least one of a current flowing through the insoluble anode and an electric potential of the insoluble anode with respect to the member to be plated while a voltage is applied from the plating electric power supply. ### Claim 3 (depends on 2) The plating apparatus according to claim 2, wherein the controller comprises an electric-output controller being capable of generating a control signal for controlling at least one of a current and a voltage applied to the insoluble anode based on a result measured by the measurement instrument and of outputting the control signal to the plating electric power supply. ### Claim 4 (depends on 2) The plating apparatus according to claim 2, wherein the anode-position controller is capable of generating a control signal for controlling an action of the anode-displacement mechanism based on a result measured by the measurement instrument and of outputting the control signal to the anode-displacement mechanism. ### Claim 5 (depends on 1) The plating apparatus according to claim 1, the apparatus further comprising: a circulation mechanism for circulating a plating solution in the plating bath, the circulation mechanism having a plating solution-suctioning portion, a pump, and a plating solution-ejecting portion; a circulation controller contained in the controller, the circulation controller being capable of generating a control signal for controlling an action of the circulation mechanism and of outputting the control signal to the circulation mechanism; an ejecting portion-displacement mechanism being capable of moving the ejecting portion in the plating bath and of holding the ejecting portion at a predetermined position in the plating bath; and an ejecting portion-position controller contained in the controller, the ejecting portion-position controller being capable of generating a control signal for controlling an action of the ejecting portion-displacement mechanism and of outputting the control signal to the ejecting portion-displacement mechanism. ### Claim 6 (depends on 5) The plating apparatus according to claim 5, wherein the circulation mechanism has an ejecting-volume adjusting mechanism being capable of adjusting a plating solution ejecting-volume ejected from the plating solution-ejecting portion, and the circulation controller comprises an ejecting-volume controller being capable of generating a control signal for controlling an action of the ejecting-volume adjusting mechanism and of outputting the control signal to the ejecting-volume adjusting mechanism. ### Claim 7 (depends on 2) The plating apparatus according to claim 2, the apparatus further comprising: a circulation mechanism for circulating a plating solution in the plating bath, the circulation mechanism having a plating solution-suctioning portion, a pump, and a plating solution-ejecting portion; a circulation controller contained in the controller, the circulation controller being capable of generating a control signal for controlling an action of the circulation mechanism and of outputting the control signal to the circulation mechanism; an ejecting portion-displacement mechanism being capable of moving the ejecting portion in the plating bath and of holding the ejecting portion at a predetermined position in the plating bath; and an ejecting portion-position controller contained in the controller, the ejecting portion-position controller being capable of generating a control signal for controlling an action of the ejecting portion-displacement mechanism and of outputting the control signal to the ejecting portion-displacement mechanism, wherein the ejecting portion-position controller is capable of generating the control signal for controlling an action of the ejecting portion-displacement mechanism based on a result measured by the measurement instrument. ### Claim 8 (depends on 7) The plating apparatus according to claim 7, wherein the circulation mechanism has an ejecting-volume adjusting mechanism being capable of adjusting a plating solution ejecting-volume ejected from the plating solution-ejecting portion, and the circulation controller comprises an ejecting-volume controller being capable of generating a control signal for controlling an action of the ejecting-volume adjusting mechanism based on a result measured by the measurement instrument and of outputting the control signal to the ejecting-volume adjusting mechanism. ### Claim 9 (depends on 1) The plating apparatus according to claim 1, the apparatus further comprising: a member-displacement mechanism being capable of moving the member to be plated and of holding the member to be plated at a position in which at least a part of the member to be plated is located in the plating bath; and a member-position controller contained in the controller, the member-position controller being capable of generating a control signal for controlling an action of the member-displacement mechanism and of outputting the control signal to the member-displacement mechanism. ### Claim 10 (depends on 9) The plating apparatus according to claim 9, wherein the member-position controller is capable of outputting the control signal for controlling an action of the member-displacement mechanism while a voltage is applied between the insoluble anode and the member to be plated from the plating electric power supply. ### Claim 11 (depends on 5) The plating apparatus according to claim 5, wherein the insoluble anode is such that its relative position to the plating solution-ejecting portion is managed, at least a part of the insoluble anode is located at a position from which an ejecting hole of the plating solution-ejecting portion is in view, the ejecting portion-displacement mechanism and the anode-displacement mechanism are integrated, and the ejecting portion-position controller and the anode-position controller are integrated. ### Claim 12 (depends on 11) The plating apparatus according to claim 11, wherein the insoluble anode is such that the part of the insoluble anode located at the position from which the ejecting hole of the plating solution-ejecting portion is in view has a shape of a guide being capable of guiding a plating solution ejected from the plating solution-ejecting portion to a predetermined direction. ### Claim 13 (depends on 11) The plating apparatus according to claim 11, wherein the insoluble anode is such that the part of the insoluble anode located at the position from which the ejecting hole of the plating solution-ejecting portion is in view has a shape of a structure formed of a planar member having a through-hole or a structure obtained by fabricating a planar member. ### Claim 14 (depends on 9) The plating apparatus according to claim 9, wherein, upon a condition that the member-position controller has driven the member-displacement mechanism so that at least a part of the member to be plated is immersed in a plating solution, at least one of plural position controllers included in the controller drives at least one of displacement mechanisms, which is other than the member-displacement mechanism and is controlled by the at least one position controller, so that a component that is capable of moving in the plating bath by the at least one displacement mechanism moves in a direction proximal to the member to be plated. ### Claim 15 (depends on 14) The plating apparatus according to claim 14, wherein, upon a condition that at least one of plural position controllers included in the controller has driven at least one of displacement mechanisms, which is other than the member-displacement mechanism and is controlled by the at least one position controller, so that a component that is capable of moving in the plating bath by the at least one displacement mechanism moves in a direction distal from the member to be plated, the member-position controller drives the member-displacement mechanism so that the member to be plated is taken out of the plating solution. ### Claim 16 A method of manufacturing a plated member, comprising: a member-positioning step of immersing at least a part of a member to be plated in a plating solution in a plating bath; an anode-positioning step of moving an insoluble anode located in the plating bath so as to be more proximal to the member to be plated in the plating solution and of holding the insoluble anode at a first position; an applying step of applying a voltage between the insoluble anode and the member to be plated to form a plated film on the member; an anode-evacuating step of moving the insoluble anode so as to be more distal from the member formed thereon with the plated film and of holding the insoluble anode at a second position; and a member-recovering step of taking the member formed thereon with the plated film out of the plating solution to obtain the member as the plated member. ### Claim 17 (depends on 16) The method according to claim 16, wherein the anode-positioning step starts before the member-positioning step has finished. ### Claim 18 (depends on 16) The method according to claim 16, wherein the member-recovering step starts before the anode-evacuating step has finished. ### Claim 19 (depends on 16) The method according to claim 16, wherein the first position is a position at which the member to be plated interferes with the insoluble anode when the member is moved so that the member is taken out of the plating solution, and the second position is a position at which the member to be plated does not interfere with the insoluble anode when the member is moved so that the member is taken out of the plating solution. ### Claim 20 (depends on 16) The method according to claim 16, wherein at least one of a position of the member to be plated in the plating bath and a position of the insoluble anode in the plating bath is changed during the applying step. ### Claim 21 (depends on 20) The method according to claim 20, wherein the position of the member to be plated in the plating bath and the position of the insoluble anode in the plating bath are changed while the relative positional relationship between the member to be plated and the insoluble anode is managed. ### Claim 22 (depends on 16) The method according to claim 16, wherein at least the applying step is carried out while the plating solution in the plating bath is circulated by a circulation mechanism comprising a plating solution-suctioning portion, a pump, and a plating solution-ejecting portion, and wherein the method further comprises: an ejecting portion-positioning step of moving the plating solution-ejecting portion located in the plating bath so as to be more proximal to the member to be plated in the plating solution and of holding the plating solution-ejecting portion at a third position, the step being started in a period from the beginning of the member-positioning step to the end of the applying step; and an ejecting portion-evacuating step of moving the plating solution-ejecting portion so as to be more distal from the member formed thereon with the plated film and of holding the plating solution-ejecting portion at a fourth position, the ejecting portion-evacuating step being started in a period from the beginning of the applying step to the end of the member-recovering step. ### Claim 23 (depends on 22) The method according to claim 22, wherein the third position is a position at which the member to be plated interferes with at least one of the insoluble anode and the plating solution-ejecting portion when the member is moved so that the member is taken out of the plating solution, and the fourth position is a position at which the member to be plated does not interfere with any of the insoluble anode and the plating solution-ejecting portion when the member is moved so that the member is taken out of the plating solution. ### Claim 24 (depends on 22) The method according to claim 22, wherein at least one of a location of the member to be plated in the plating bath, a location of the insoluble anode in the plating bath, a location of the plating solution-ejecting portion in the plating bath, and a plating solution volume ejected from the plating solution-ejecting portion is changed during the applying step. ### Claim 25 (depends on 24) The method according to claim 24, wherein the location of the member to be plated in the plating bath, the location of the insoluble anode in the plating bath, the location of the plating solution-ejecting portion in the plating bath are changed while the relative positional relationship among the member to be plated, the insoluble anode, and the plating solution-ejecting portion is managed. ### Claim 26 (depends on 22) The method according to claim 22, wherein the insoluble anode is such that its relative position to the plating solution-ejecting portion is managed, at least a part of the insoluble anode is located at a position from which an ejecting hole of the plating solution-ejecting portion is in view, the anode-positioning step and the ejecting portion-positioning step are integrated, and the anode-evacuating step and the ejecting portion-evacuating step are also integrated. ### Claim 27 A nozzle-anode unit comprising a plating solution-ejecting portion and an insoluble anode, the plating solution-ejecting portion being located in a plating bath for returning a plating solution in the plating bath, suctioned from a plating solution-suctioning portion, back to the plating bath using circulation by a pump, at least a part of the insoluble anode being located at a position from which an ejecting hole of the plating solution-ejecting portion is in view, the insoluble anode being such that its relative position to the ejecting hole is managed. ### Claim 28 (depends on 27) The nozzle-anode unit according to claim 27, wherein the insoluble anode is such that the part of the insoluble anode located at the position from which the ejecting hole of the plating solution-ejecting portion is in view comprises a planar member having a through-hole or has a shape of a structure obtained by fabricating the planar member. ### Claim 29 (depends on 27) The nozzle-anode unit according to claim 27, wherein the insoluble anode is such that the part of the insoluble anode located at the position from which the ejecting hole of the plating solution-ejecting portion is in view has a shape of a guide being capable of guiding a plating solution ejected from the plating solution-ejecting portion to a predetermined direction. ### Claim 30 (depends on 28) The nozzle-anode unit according to claim 28, wherein the insoluble anode has a portion comprised of a tubular body having a first end, the first end being one end of the tubular body and located at the position from which the ejecting hole of the plating solution-ejecting portion is in view, and wherein the plating solution ejected from the ejecting hole of the plating solution-ejecting portion is supplied into a plating bath through the inside of the portion comprised of the tubular body. ### Claim 31 (depends on 30) The nozzle-anode unit according to claim 30, wherein a second end, which is the opposite end to the first end of the portion comprised of the tubular body, is covered up with a planar member having an inscribed circle of a diameter larger than that of a circumscribed circle of an aperture at the second end; and wherein the plating solution-ejecting portion has a through-hole, one aperture of the through-hole is the ejecting hole for the plating solution, and the portion comprised of the tubular body is set inside from the other aperture-side of the through-hole so that the first end is located at the position from which the ejecting hole for the plating solution is in view. ### Claim 32 A fixing apparatus for fixing a member to be plated comprising two hollow portions, each of the two hollow portions having at least one aperture, the fixing apparatus comprising: a first rod-shaped body, one end of the first rod-shaped body being capable of being inserted into one of the two hollow portions from the aperture thereof; a second rod-shaped body, one end of the second rod-shaped body being capable of being inserted into the other of the two hollow portions from the aperture thereof; and a rod-shaped body-movably holding mechanism, wherein the rod-shaped body-movably holding mechanism allows the other ends of the first rod-shaped body and the second rod-shaped body to move both closer to each other and apart from each other and to be held in a condition of being biased to directions that the other ends are closer to each other and in a condition of being biased to directions that the other ends are apart from each other, so that the first rod-shaped body contacts with pressure at least two positions inside the one hollow portion and the second rod-shaped body contacts with pressure at least two positions inside the other hollow portion, and thereby the member to be plated is held by the first rod-shaped body and the second rod-shaped body. ### Claim 33 (depends on 32) The fixing apparatus according to claim 32, wherein contact portions of at least one of the first rod-shaped body and the second rod-shaped body with the hollow portion of the member to be plated are electrical contacts to the member to be plated. ### Claim 34 (depends on 32) The fixing apparatus according to claim 32 comprising a rod-shape member-driving mechanism having a driving mechanism being capable of moving the other ends of the first rod-shaped body and the second rod-shaped body both closer to each other and apart from each other, and of holding the other ends of the first rod-shaped body and the second rod-shaped body in a condition of being biased to directions that the other ends have been moved.