# US 2014/0190815 A1 · Moisture barrier layer dielectric for thermoformable circuits > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190815 A1 - Document ID: US20140190815A1 - Status: Published application - Kind: A1 - Application number: 14/049,525 - Filed: 2013-10-09 - Published: 2014-07-10 - Earliest claimed: 2013-01-08 - Assignees: E. I. Du Pont de Nemours and Company - Applicants: E I Du Pont De Nemours and Company - Inventors: JAY ROBERT DORFMAN - Web page: https://patentgrep.com/patent/US20140190815A1 ## CPC - C09D 5/00: Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced {(electrically insulating plastics, resins or waxes H01B3/30)}; Filling pastes - C08L 75/04: Polyurethanes - H03K 17/962: {Capacitive touch switches} - H03K 17/975: using a capacitive movable element - H03K 2217/960755: Constructional details of capacitive touch and proximity switches - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) ## Abstract This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver above it and the polycarbonate substrate below it in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process. ## Claims ### Claim 1 A polymer thick film barrier layer dielectric composition comprising: (a) a first organic medium comprising 10-50 wt % thermoplastic urethane resin dissolved in an organic solvent, wherein the weight percent is based on the total weight of said first organic medium; (b) a second organic medium comprising 10-50 wt % thermoplastic phenoxy resin in an organic solvent wherein the weight percent is based on the total weight of said second organic medium; (c) 1-20 wt % diacetone alcohol, wherein the weight percent is based on the total weight of the composition; and (d) 0.1-5.0 wt % fumed silica, wherein the weight percent is based on the total weight of the composition. ### Claim 2 (depends on 1) The polymer thick film barrier layer dielectric composition of claim 1, wherein said thermoplastic urethane resin is a urethane elastomer or a polyester-based copolymer. ### Claim 3 (depends on 2) The polymer thick film barrier layer dielectric composition of claim 2, wherein said thermoplastic urethane resin is a polyester-based copolymer. ### Claim 4 A polymer thick film moisture barrier layer dielectric composition comprising: (a) thermoplastic urethane resin: (b) thermoplastic phenoxy resin; (c) diacetone alcohol; and (d) fumed silica. ### Claim 5 (depends on 4) The polymer thick film barrier layer dielectric composition of claim 4, wherein said thermoplastic urethane resin is a urethane elastomer or a polyester-based copolymer. ### Claim 6 (depends on 5) The polymer thick film barrier layer dielectric composition of claim 5, wherein said thermoplastic urethane resin is a polyester-based copolymer. ### Claim 7 (depends on 1) A capacitive switch circuit comprising a barrier layer dielectric formed from the polymer thick film moisture barrier layer dielectric composition of claim 1. ### Claim 8 (depends on 7) The capacitive switch circuit of claim 7, wherein said thermoplastic urethane resin is a urethane elastomer or a polyester-based copolymer. ### Claim 9 (depends on 8) The capacitive switch circuit of claim 8, wherein said thermoplastic urethane resin is a polyester-based copolymer. ### Claim 10 (depends on 7) The capacitive switch circuit of claim 7, wherein said circuit is thermoformed. ### Claim 11 (depends on 8) The capacitive switch circuit of claim 8, wherein said circuit is thermoformed. ### Claim 12 (depends on 9) The capacitive switch circuit of claim 9, wherein said circuit is thermoformed. ### Claim 13 (depends on 10) The capacitive switch circuit of claim 10, wherein said capacitive switch circuit has been subsequently subjected to an injection molding process. ### Claim 14 (depends on 11) The capacitive switch circuit of claim 11, wherein said capacitive switch circuit has been subsequently subjected to an injection molding process. ### Claim 15 (depends on 12) The capacitive electrical circuit of claim 12, wherein said capacitive switch circuit has been subsequently subjected to an injection molding process.