# US 2014/0190738 A1 · Electronic substrate and an electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190738 A1 - Document ID: US20140190738A1 - Status: Published application - Kind: A1 - Application number: 14/240,348 - Filed: 2012-08-15 - Published: 2014-07-10 - Earliest claimed: 2011-08-25 - Assignees: NEC Corporation - Inventors: Hitoshi Sakamoto; Minoru Yoshikawa; Masaki Chiba; Kenichi Inaba; Arihiro Matsunaga - Web page: https://patentgrep.com/patent/US20140190738A1 ## CPC - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - F28D 15/0266: {with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence)} - G06F 1/20: Cooling means - H05K 7/2029: {using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract An electronic substrate 100D has a tabular base material 110 which can install a heater element 120 and the cooling structure that cools the heater element 120. An electronic substrate 100 can be plugged in/out in the case 200 in the direction which is almost parallel to the face of the base material 110. The cooling structure is installed on the tabular base material 110, and has the first heat radiation part 160D with a hollow shape and the heat transfer part 700. The first heat radiation part 160D with a hollow shape radiates the generated heat of the heater element 120 installed in the base material. The heat transfer part 700 transfers the generated heat of the heater element 120 to the first heat radiation part 160D. The first heat radiation part 160D has the first joint surface 165 formed along a face which is almost vertical to the insert and removal direction W of the base material 110. The first heat radiation part 160D is connected to the second radiation part 260B set up in the case 200 thermally through the first joint surface 165. As a result, the generated heat of the heater element can be radiated sufficiently. ## Claims ### Claim 1 An electronic substrate including a tabular base material which can install a heater element and a cooling structure which cools the generated heat of the heater element, in which the base material is possible to be plugged in and out in a case to the direction which is almost parallel to the surface of the base material, the cooling structure provided for the base material is equipped with a first heat radiation part with a hollow shape that radiates the generated heat of the heater element installed in the base material, and a heat transfer part that transfers the generated heat of the heater element to the first heat radiation part, and the first heat radiation part is equipped with a first joint surface that is a face which is almost vertical to the insert and removal direction of the base material, and connects with a second heat radiation part installed thermally in the case through the first joint surface. ### Claim 2 (depends on 1) The electronic substrate according to claim 1, in which the heat transfer part transfers the generated heat of the heater element to the first heat radiation part through a refrigerant, and the first heat radiation part includes a condensing part with a hollow shape, in which the refrigerant vaporized by the heat generation of the heater element is poured, for cooling and condensing the refrigerant which is vaporized. ### Claim 3 (depends on 1) The electronic substrate according to claim 1, including a pressing part in addition, in which the pressing part presses the first heat radiation part towards the second heat radiation part so that the second joint surface that is a face of which the second heat radiation part is composed and opposes to the first joint surface may connect to the first joint surface thermally. ### Claim 4 (depends on 3) The electronic substrate according to claim 3 in which the first joint surface presses the position corresponding to the almost central portion. ### Claim 5 (depends on 3) The electronic substrate according to claim 3 in which the pressing part is installed at a joint part of the heat transfer part and the first heat radiation part. ### Claim 6 (depends on 3) The electronic substrate according to claim 3, in which the pressing part includes a screw part which is installed on the surface of the base material and whose central axis has been arranged in the direction which is almost vertical to said the first and the second joint surfaces, and a tip portion of the screw part presses the first heat radiation part for the second heat radiation part. ### Claim 7 (depends on 5) The electronic substrate according to claim 5 in which, the joint part is a tube installed so as to be extended in the direction which is almost vertical to the first and the second joint surfaces, and the pressing part includes a moving part which is installed so as to move along the tube, a moving part holding part which fixes the moving part in the base material, and an energizing part which energizes the first heat radiation part for the second heat radiation part between the moving part and the first joint surface. ### Claim 8 (depends on 7) The electronic substrate according to claim 7 in which the tube is a refrigerant inflow/outflow tube for flowing in and flowing out the refrigerant to the condensing part. ### Claim 9 (depends on 7) The electronic substrate according to claim 7, in which the energizing part includes an elastic member. ### Claim 10 (depends on 3) The electronic substrate according to claim 3, in which a thermal conductivity member has been installed between the first and the second joint surfaces. ### Claim 11 (depends on 3) The electronic substrate according to claim 3 in which the first and the second joint surface are planes. ### Claim 12 An electronic apparatus including an electronic substrate and a case which accommodates the electronic substrate, in which the electronic substrate has a tabular base material that can install a heater element and a cooling structure that cools the generated heat of the heater element, and the base material can be plugged in/out on a case in the direction which is almost parallel to the surface of the base material, the cooling structure installed in the base material is equipped with the first heat radiation part with a hollow shape that radiates the generated heat of the heater element installed on the base material, and a heat transfer part that transfers the generated heat of the heater element to the first heat radiation part, in which the first heat radiation part is equipped with a first joint surface that is a face which is almost vertical to the insert and removal direction of the base material and connects the second heat radiation part set up to the case thermally through the first joint surface. ### Claim 13 (depends on 12) The electronic apparatus according to claim 12 in which the case is formed so as to hold a plurality of the electronic substrates, and the second joint surface is formed on the second heat radiation part in order to connect with a plurality of the first joint surfaces thermally.