# US 2014/0190736 A1 · Radiation-curable rubber adhesive/sealant

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- Number: US 2014/0190736 A1
- Document ID: US20140190736A1
- Status: Published application
- Kind: A1
- Application number: 13/565,952
- Filed: 2012-08-03
- Published: 2014-07-10
- Earliest claimed: 2010-01-12
- Inventors: Jie Cao; Donald E. Herr
- Web page: https://patentgrep.com/patent/US20140190736A1

## CPC

- C08L 21/00: Compositions of unspecified rubbers
- C08L 23/22: Copolymers of isobutene; Butyl rubber; Homopolymers or copolymers of other iso-olefins
- C09J 123/22: Copolymers of isobutene; Butyl rubber {; Homo- or copolymers of other iso-olefines}
- C09K 3/10: {Materials in mouldable or extrudable form} for sealing or packing joints or covers (filling pastes C09D5/34)
- H10K 50/8426: {Peripheral sealing arrangements, e.g. adhesives, sealants}
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H10W 76/48: Fillings including materials for absorbing or reacting with moisture or other undesired substances
- C08L 2312/00: Crosslinking
- C08L 2666/02: Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C09K 2003/1062: {UV-curable materials}
- C09K 2200/061: Butyl rubber
- C09K 2200/0617: Polyalkenes
- C09K 2200/0642: Copolymers containing at least three different monomers
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A radiation-curable adhesive/sealant composition comprises a radiation-curable rubber resin, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.

## Claims

### Claim 1

A radiation-curable adhesive/sealant composition comprising:
a) a radiation-curable polyisobutylene or butyl rubber barrier rubber resin containing reactive functionality selected from the group consisting of glycidyl epoxy, aliphatic epoxy, cycloaliphatic epoxy, oxetane, acrylate and methacrylate, and no siloxane functionality,
b) a radiation-curable resin diluent
c) a photoinitiating system comprising one or more photoinitiators and optionally one or more photosensitizers,

### Claim 2

(canceled)

### Claim 3

(canceled)

### Claim 4 (depends on 1)

The radiation-curable adhesive/sealant in accordance with claim 1 in which the radiation-curable diluent contains reactive functionality selected from the group consisting of glycidyl epoxy, aliphatic epoxy, cycloaliphatic epoxy and oxetane.

### Claim 5 (depends on 1)

The radiation-curable adhesive/sealant in accordance with claim 1 in which the radiation-curable diluent contains reactive functionality selected from the group consisting of acrylate and methacrylate.

### Claim 6 (depends on 1)

A device, disposed on a substrate and encapsulated with a lid in which the lid and substrate are bonded together with a sealant/adhesive disposed on the whole area between the substrate and the lid, the sealant/adhesive comprising the composition according to claim 1.

### Claim 7 (depends on 1)

A device, disposed on a substrate and encapsulated with a lid in which the lid and substrate are bonded together with a sealant/adhesive disposed along the perimeter of the substrate and the lid, the sealant/adhesive comprising the composition according to claim 1.