# US 2014/0190733 A1 · Printed circuit board and fabricating method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190733 A1 - Document ID: US20140190733A1 - Status: Published application - Kind: A1 - Application number: 14/123,076 - Filed: 2012-10-29 - Published: 2014-07-10 - Earliest claimed: 2011-12-31 - Assignees: Peking University Founder Group Co., Ltd.; Zhuhai Founder Pcb Development Co., Ltd.; Chongqing Founder Hi-Tech Electronic Inc. - Applicants: Peking University Founder Group Co., Ltd.; Zhuhai Founder PCB Development Co., Ltd.; Chongqing Gounder Hi-Tech Electronic Inc. - Inventors: George Dudnikov, JR.; Xinhong Su; Shuhan Shi - Web page: https://patentgrep.com/patent/US20140190733A1 ## CPC - H05K 1/0298: {Multilayer circuits} - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers} - H05K 1/116: {Lands, clearance holes or other lay-out details concerning the surrounding of a via} - H05K 2201/09645: Patterning on via walls; Plural lands around one hole - H05K 2201/09718: Clearance holes - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Embodiments of the present application relate to the technical field of a printed circuit plate, in particular, to a printed circuit plate and a method manufacturing same so as to resolve a problem of an incomplete elimination of a short-line effect. The method for manufacturing a printed circuit board in the embodiments of the present application comprises a step of drilling target prepregs at positions corresponding to at least one preset hole therein so as to form through holes perforating through the target prepregs, wherein the formed through holes have an aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB. The method further comprises: filling the formed through holes with a plating resist ink to prevent the through holes from being plated with a conductive material; laminating the target prepregs and core boards so as to form a multi-layer printed circuit board PCB, wherein some or all of the prepregs are the target prepregs; drilling the multi-layer PCB to perforate the preset holes in the target prepregs; and plating inner walls of holes formed by drilling the multi-layer PCB. ## Claims ### Claim 1 A method for manufacturing a printed circuit board (PCB), comprising: drilling at least one target prepreg at a position corresponding to at least one preset hole therein so as to form-a hole perforating through the target prepreg with aperture greater than that of the preset hole, and the preset hole does not need to transmit electrical signal between layers of the PCB; filling the formed holes with a plating resist ink to prevent the through holes from being plated with a conductive material; laminating at least one target prepreg and core board so as to form a multi-layer printed circuit board PCB; drilling the multi-layer PCB to perforate the preset holes in the target prepregs; and plating inner walls of holes formed by drilling the multi-layer PCB. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein, there are a plurality of target prepregs, and wherein, before drilling the target prepregs, the method further comprises: selecting, from the target prepregs, a target prepreg adjacent to a hole that is used to transmit the electrical signal between the layers, as a target prepreg to be drilled. ### Claim 3 (depends on 1) The method as claimed in claim 1, wherein after filling the through hole with the plating resist ink but before the lamination process, the method further comprises: curing the plating resist ink. ### Claim 4 (depends on 3) The method as claimed in claim 3, wherein before drilling the target prepregs, the method further comprises: covering top and bottom surfaces of the target prepreg with protective films to prevent the target prepreg from damage during the drilling process, respectively. ### Claim 5 (depends on 4) The method as claimed in claim 4, wherein the protective film is a polyester film. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein the plating resist ink is an insulating and hydrophobic resin material. ### Claim 7 (depends on 6) The method as claimed in claim 6, wherein the insulating and hydrophobic resin material includes compounds consisting of one or more materials selected from silicon resin, polyethylene resin, fluorocarbon resin, polyurethane resin and acrylic resin. ### Claim 8 (depends on 1) The method as claimed in claim 1, wherein the drilling process comprises a laser drilling, a mechanical drilling and a punching. ### Claim 9 (depends on 1) The method as claimed in claim 1, wherein the filling the through hole with the plating resist ink comprises: filling the through holes with the plating resist ink by a way of cavity filling; filling the through holes with the plating resist ink by a way of template printing; or filling the through holes with the plating resist ink by a way of screen printing. ### Claim 10 A printed circuit board, comprising: at least one target prepreg filled with a plating resist ink, wherein there is a hole ring perforating through the target prepreg at a position corresponding to a preset hole in the target prepreg, the preset hole is configured as an inner hole of the hole ring, and the hole ring has an outer diameter equal to an aperture of the through hole, and is filled with the plating resist ink. ### Claim 11 (depends on 10) The printed circuit board as claimed in claim 10, wherein the printed circuit board further comprises conductive layers; wherein, in a conductive layer of the conductive layers, which is adjacent to the target prepreg, there is conductive material at positions corresponding to the plating resist ink. ### Claim 12 (depends on 11) The printed circuit board as claimed in claim 11, wherein the conductive layers are adjacent to both sides of the target prepreg. ### Claim 13 (depends on 2) The method as claimed in claim 2, wherein after filling the through hole with the plating resist ink but before the lamination process, the method further comprises: curing the plating resist ink. ### Claim 14 (depends on 3) The method as claimed in claim 3, wherein after curing the plating resist ink but before the laminating process, the method further comprises: removing the protective films from the top and bottom surfaces of the target prepreg. ### Claim 15 (depends on 2) The method as claimed in claim 2, wherein the drilling process comprises a laser drilling, a mechanical drilling and a punching. ### Claim 16 (depends on 4) The method as claimed in claim 4, wherein the drilling process comprises a laser drilling, a mechanical drilling and a punching. ### Claim 17 (depends on 2) The method as claimed in claim 2, wherein the filling the through hole with the plating resist ink comprises: filling the through holes with the plating resist ink by a way of cavity filling; filling the through holes with the plating resist ink by a way of template printing; or filling the through holes with the plating resist ink by a way of screen printing. ### Claim 18 (depends on 4) The method as claimed in claim 4, wherein the filling the through hole with the plating resist ink comprises: filling the through holes with the plating resist ink by a way of cavity filling; filling the through holes with the plating resist ink by a way of template printing; or filling the through holes with the plating resist ink by a way of screen printing.