# US 2014/0190732 A1 · Carrier Device, Electrical Device Having a Carrier Device and Method for Producing Same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190732 A1 - Document ID: US20140190732A1 - Status: Published application - Kind: A1 - Application number: 14/234,960 - Filed: 2012-07-09 - Published: 2014-07-10 - Earliest claimed: 2011-07-25 - Assignees: OSRAM GmbH - Inventors: Krister Bergenek; Andreas Biebersdorf; Jörg Erich Sorg - Web page: https://patentgrep.com/patent/US20140190732A1 ## CPC - H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] - H05K 3/301: {by means of a mounting structure (H05K3/325 takes precedence)} - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - Y10T 29/49155: Manufacturing circuit on or in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the electrically insulating layer The electrical contact layer includes at least one bridge-shaped contact region At least one recess in the electrically insulating layer is arranged at least on one side surface of the bridge-shaped contact region and/or the bridge-shaped contact region includes a bridge width reducing toward the insulating layer. ## Claims ### Claim at position 1 1-15. (canceled) ### Claim 16 A carrier device for an electrical component, the carrier device comprising: a carrier comprising an electrically insulating layer; and an electrical contact layer overlying the electrically insulating layer; wherein the electrical contact layer comprises a ridge-shaped contact region; and wherein a recess is arranged in the electrically insulating layer at least at one side surface of the ridge-shaped contact region or wherein the ridge-shaped contact region has a ridge width that decreases toward the electrically insulating layer. ### Claim 17 (depends on 16) The carrier device according to claim 16, wherein a recess is arranged in the electrically insulating layer at least at one side surface of the ridge-shaped contact region. ### Claim 18 (depends on 17) The carrier device according to claim 17, wherein the ridge-shaped contact region has a ridge width that decreases toward the insulating layer. ### Claim 19 (depends on 16) The carrier device according to claim 16, wherein the ridge-shaped contact region has a ridge width that decreases toward the insulating layer. ### Claim 20 (depends on 16) The carrier device according to claim 16, wherein the ridge-shaped contact region is arranged between two recesses or two partial regions of the recess, which adjoin the side surfaces of the ridge-shaped contact region. ### Claim 21 (depends on 16) The carrier device according to claim 16, wherein the ridge-shaped contact region, apart from one side, is surrounded on all sides by one or a plurality of recesses. ### Claim 22 (depends on 16) The carrier device according to claim 16, wherein the electrical contact layer comprises two ridge-shaped contact regions, which are arranged in a manner directed toward one another and between which the recess is formed in the electrically insulating layer. ### Claim 23 (depends on 16) The carrier device according to claim 16, wherein the electrical contact layer comprises a further contact region which is electrically insulated from the ridge-shaped contact region, and wherein the recess is arranged in the electrically insulating layer between the ridge-shaped contact region and the further contact region. ### Claim 24 (depends on 16) The carrier device according to claim 16, wherein the side surfaces of the ridge-shaped contact region are slightly etched or undercut by etching. ### Claim 25 (depends on 16) The carrier device according to claim 16, wherein the carrier device is embodied as a circuit board, as a metal core circuit board, as a ceramic carrier, as a glass carrier, as a glass ceramic carrier or as an anodically oxidized carrier. ### Claim 26 (depends on 16) An electrical device comprising: a carrier device according to claim 16; and an electrical component electrically and mechanically connected to the ridge-shaped contact region. ### Claim 27 (depends on 26) The electrical device according to claim 26, wherein the electrical component and the carrier device have different coefficients of thermal expansion. ### Claim 28 (depends on 26) The electrical device according to claim 26, wherein the electrical contact layer of the carrier device comprises a further contact region that is electrically insulated from the ridge-shaped contact region, wherein the recess is arranged in the electrically insulating layer between the ridge-shaped contact region and the further contact region, and wherein the electrical component is electrically and mechanically connected to the further contact region. ### Claim 29 (depends on 26) The electrical device according to claim 26, wherein the electrical component comprises a light-emitting semiconductor chip embodied as a flip-chip and the electrical device comprises a light-emitting device. ### Claim 30 A method for producing a carrier device, the method comprising: (A) providing a carrier comprising an electrically insulating layer; (B) forming an electrical contact layer over the electrically insulating layer, the electrical contact layer having a ridge-shaped contact region; and (C) forming a recess in the electrically insulating layer by at least partly removing the electrically insulating layer at least at one side surface of the ridge-shaped contact region or forming a ridge width of the ridge-shaped contact region which decreases toward the insulating layer. ### Claim 31 (depends on 30) The method according to claim 30, wherein step (C) comprises performing an etching method. ### Claim 32 (depends on 31) The method according to claim 31, wherein the etching method comprises wet-chemical etching or ion etching. ### Claim 33 (depends on 31) The method according to claim 31, wherein the electrical contact layer is slightly etched or undercut by etching in the region of the ridge-shaped contact region. ### Claim 34 (depends on 30) The method according to claim 30, wherein step (C) comprises laser processing or embossing. ### Claim 35 A carrier device for an electrical component, the carrier device comprising: a carrier comprising an electrically insulating layer; and an electrical contact layer on the electrically insulating layer; wherein the electrical contact layer comprises at least one ridge-shaped contact region; wherein at least one recess is arranged in the electrically insulating layer at least at one side surface of the ridge-shaped contact region; wherein the ridge-shaped contact region has a ridge width that decreases toward the electrically insulating layer; and wherein the carrier device is embodied as a circuit board, a metal core circuit board, a ceramic carrier, a glass carrier, a glass ceramic carrier or an anodically oxidized carrier.