# US 2014/0190727 A1 · Method of fabricating flexible metal core printed circuit board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190727 A1 - Document ID: US20140190727A1 - Status: Published application - Kind: A1 - Application number: 13/738,599 - Filed: 2013-01-10 - Published: 2014-07-10 - Earliest claimed: 2013-01-10 - Assignees: Starlite LED USA - Applicants: Starlite Led USA - Inventors: Emily Yu-Hsuan Lee; Pao Hsu Chen; Chang Han - Web page: https://patentgrep.com/patent/US20140190727A1 ## CPC - H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)} - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 3/0061: {onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20)} - H05K 2201/09054: Raised area or protrusion of metal substrate - H05K 2201/10106: Light emitting diode [LED] - Y10T 29/49155: Manufacturing circuit on or in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A flexible metal core printed circuit board assembly comprises a flexible printed circuit board structure. The flexible printed circuit board structure includes a flexible substrate, a conductive layer on the flexible substrate and a space formed in the flexible printed circuit board structure. The space extends through the flexible printed circuit board structure. The flexible metal core printed circuit board assembly further comprises a flexible conductive structure having a pillar. The flexible conductive structure is provided underneath the flexible printed circuit board structure with the pillar disposed in the space. The pillar has a top surface that is in a planar surface with a top surface of the flexible printed circuit board structure. ## Claims ### Claim 1 A flexible metal core printed circuit board assembly, comprising: a flexible printed circuit board structure, including a flexible substrate; a conductive layer on the flexible substrate, a space formed in the flexible printed circuit board structure, the space extending through the flexible printed circuit board structure; and a flexible conductive structure having a pillar, wherein the flexible conductive structure is provided underneath the flexible printed circuit board structure with the pillar disposed in the space, the pillar having a top surface being in a planar surface with a top surface of the flexible printed circuit board structure. ### Claim 2 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein the flexible printed circuit board structure further comprises a circuit adhesive layer laminated between the flexible substrate and the conductive layer. ### Claim 3 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein the flexible printed circuit board structure further comprises a cover layer provided over the conductive layer. ### Claim 4 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, further comprising a structure adhesive layer disposed between the conductive structure and the flexible printed circuit board structure. ### Claim 5 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein size and shape of the pillar is determined by the space. ### Claim 6 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein the top surface of the pillar is coupled to an electronic component disposed on the top surface of the flexible printed circuit board structure by filling one of solder, conductive bonders, thermal-conductive epoxy, thermal grease and solder paste between the top surface of the pillar and a bottom surface of the electronic component. ### Claim 7 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein the flexible substrate comprises dielectric material. ### Claim 8 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein the flexible substrate comprises one of polyester, polyimide, polyethylene napthalate, polyetherimide and fluropolymers. ### Claim 9 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein the conductive layer comprises at least one of metal foil, conductive ink and plated metal. ### Claim 10 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein the conductive layer comprises one or more of Tin, zinc, silver, indium, gold, aluminum, copper and nickel. ### Claim 11 (depends on 1) The flexible metal core printed circuit board assembly of claim 1, wherein the flexible conductive structure comprises at least one of metal, metal alloy, graphite, polymer and ceramic. ### Claim 12 A method of fabricating a flexible metal core printed circuit board assembly, comprising: providing a flexible printed circuit board structure, including providing a flexible substrate; forming a conductive layer on the flexible substrate; forming a space in the flexible printed circuit board structure, the space extending through the flexible printed circuit board structure; providing a flexible conductive structure underneath the flexible printed circuit board structure, the flexible conductive structure including a pillar having a top surface; and disposing the pillar in the space, wherein the top surface of the pillar is in a planar surface with a top surface of the flexible printed circuit board structure. ### Claim 13 (depends on 12) The method of claim 12, further comprising applying a printing process to the conductive layer to pattern electronic circuits. ### Claim 14 (depends on 13) The method of claim 13, wherein the printing process comprising one of evaporation, sputter deposition, spray deposition, airbrushing, screen-printing and photolithograph. ### Claim 15 (depends on 13) The method of claim 13, further comprising providing a circuit adhesive layer laminated between the flexible substrate and the conductive layer. ### Claim 16 (depends on 12) The method of claim 12, further comprising providing a cover layer over the conductive layer. ### Claim 17 (depends on 12) The method of claim 12, further comprising providing a structure adhesive layer between the flexible conductive structure and the flexible printed circuit board structure. ### Claim 18 (depends on 12) The method of claim 12, further comprising selectively removing a portion of the flexible metal core printed circuit board structure by applying one of mechanical punch, drilling, carving and chemical etching to form the space. ### Claim 19 (depends on 12) The method of claim 12, further comprising fabricating the pillar by one of computer numerical control milling, photolithography processes, mechanical punching, molding and forging.