# US 2014/0190669 A1 · Cooling head and electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190669 A1 - Document ID: US20140190669A1 - Status: Published application - Kind: A1 - Application number: 14/051,521 - Filed: 2013-10-11 - Published: 2014-07-10 - Earliest claimed: 2013-01-10 - Assignees: Fujitsu Limited - Applicants: Fujitsu Limited - Inventors: Yuki HOSHINO; Kenji FUKUZONO - Web page: https://patentgrep.com/patent/US20140190669A1 ## CPC - F28D 15/0266: {with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence)} - F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} - H10W 40/47: by flowing liquids, e.g. forced water cooling - F28D 2021/0028: {for cooling heat generating elements, e.g. for cooling electronic components or electric devices} - F28F 9/0273: {with multiple holes} - F28F 2250/04: Communication passages between channels - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A cooling head includes: a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant; a second refrigerant flow channel configured to flow the refrigerant; and at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other. ## Claims ### Claim 1 A cooling head comprising: a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant; a second refrigerant flow channel configured to flow the refrigerant; and at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other. ### Claim 2 (depends on 1) The cooling head according to claim 1, wherein the first refrigerant flow channel and the second refrigerant flow channel communicates with each other without a nozzle. ### Claim 3 (depends on 1) The cooling head according to claim 1, wherein a downstream end of the second refrigerant flow channel in a second flow direction of refrigerant in the second refrigerant flow channel is blocked. ### Claim 4 (depends on 1) The cooling head according to claim 1, wherein the second refrigerant flow channel is provided on the side of the first refrigerant flow channel opposite to the side in contact with the object. ### Claim 5 (depends on 1) The cooling head according to claim 1, wherein the second refrigerant flow channel includes a plurality of flow channels for the object. ### Claim 6 (depends on 5) The cooling head according to claim 5, wherein the plurality of flow channels extend parallel to each other. ### Claim 7 (depends on 5) The cooling head according to claim 5, wherein the at least one communication hole is shared by at least two of the plurality of flow channels. ### Claim 8 (depends on 7) The cooling head according to claim 7, wherein the at least one communication hole is formed so as to be elongate in a direction across the first flow direction. ### Claim 9 (depends on 1) The cooling head according to claim 1, wherein the at least one communication hole includes a plurality of communication holes for the object, and the plurality of communication holes are arranged in the first flow direction. ### Claim 10 (depends on 1) The cooling head according to claim 1, wherein the at least one communication hole is provided so as to correspond to the position of a hot spot having a large amount of heat generation of the object or is provided on an upstream side of the position of the hot spot. ### Claim 11 (depends on 1) The cooling head according to claim 1, further comprising, a first flow channel member in which the first refrigerant flow channel is formed; and a second flow channel member in which the second refrigerant flow channel is formed so as to form a stacked structure. ### Claim 12 (depends on 1) The cooling head according to claim 1, wherein the refrigerant in the second refrigerant flow channel is merged with the refrigerant flowing through the first refrigerant flow channel at a communication position with the first refrigerant flow channel and flows to the downstream side. ### Claim 13 An electronic apparatus comprising: an electronic device; and a cooling head configured to cool the electronic device, wherein the cooling head includes: a first refrigerant flow channel, provided so as to be in contact with an object to be cooled, configured to flow refrigerant; a second refrigerant flow channel configured to flow the refrigerant; and at least one communication hole, provided between both ends of the object to be cooled in the first refrigerant flow channel in a first flow direction of refrigerant in the first refrigerant flow channel, configured to allow the first refrigerant flow channel and the second refrigerant flow channel to communicate with each other. ### Claim 14 (depends on 13) The electronic apparatus according to claim 13, wherein a downstream end of the second refrigerant flow channel in a second flow direction of refrigerant in the second refrigerant flow channel is blocked. ### Claim 15 (depends on 13) The electronic apparatus according to claim 13, wherein the second refrigerant flow channel is provided on the side of the first refrigerant flow channel opposite to the side in contact with the object. ### Claim 16 (depends on 13) The electronic apparatus according to claim 13, wherein the second refrigerant flow channel includes a plurality of flow channels for the object. ### Claim 17 (depends on 13) The electronic apparatus according to claim 13, wherein the at least one communication hole includes a plurality of communication holes for the object, and the plurality of communication holes are arranged in the first flow direction. ### Claim 18 (depends on 13) The electronic apparatus according to claim 13, wherein the at least one communication hole is provided so as to correspond to the position of a hot spot having a large amount of heat generation of the object or is provided on an upstream side of the position of the hot spot. ### Claim 19 (depends on 13) The electronic apparatus according to claim 13, further comprising, a first flow channel member in which the first refrigerant flow channel is formed; and a second flow channel member in which the second refrigerant flow channel is formed so as to form a stacked structure. ### Claim 20 (depends on 13) The electronic apparatus according to claim 13, wherein the refrigerant in the second refrigerant flow channel is merged with the refrigerant flowing through the first refrigerant flow channel at a communication position with the first refrigerant flow channel and flows to the downstream side.