# US 2014/0190634 A1 · Method and Apparatus for Drying a Wafer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190634 A1 - Document ID: US20140190634A1 - Status: Published application - Kind: A1 - Application number: 14/159,647 - Filed: 2014-01-21 - Published: 2014-07-10 - Earliest claimed: 2011-12-22 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company, Ltd. - Inventors: Wei-Chieh Huang; Hung Chang Hsieh - Web page: https://patentgrep.com/patent/US20140190634A1 ## CPC - G03F 7/3021: {from a wafer supported on a rotating chuck} - B05C 9/12: the auxiliary operation being performed after the application (B05C9/14 takes precedence) - B05C 11/023: {Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface (B05C11/021, B05C11/04 take precedence)} - B05C 11/08: Spreading liquid or other fluent material by manipulating the work, e.g. tilting - H10P 72/0402: {Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence)} - H10P 72/0406: {for cleaning followed by drying, rinsing, stripping, blasting or the like} - H10P 72/0408: {for drying} - B05C 11/02: Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface {; Controlling means therefor}(B05C7/00 takes precedence; Hand tools for such purposes B05C17/10); Control of the thickness of a coating {by spreading or distributing liquids or other fluent materials already applied to the coated surface}(controlling supply of liquid or other fluent material B05C11/10) - B05C 13/00: Means for manipulating or holding work, e.g. for separate articles {(B05C1/0821 takes precedence)} - H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated. ## Claims ### Claim 1 An apparatus for fabricating a semiconductor device, comprising: a wafer chuck configured to a wafer such that a first side of the wafer would be facing the wafer chuck when the wafer is held; a nozzle configured to dispense a solution to a second side of the wafer that is opposite the first side; and a mechanical structure configured to rotate the wafer chuck horizontally and raise or lower the wafer chuck vertically, wherein the mechanical structure is configured to lower the wafer chuck at a greater speed than when it raises the wafer chuck. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the mechanical structure is configured to lower the wafer chuck while the wafer chuck is being rotated horizontally. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the mechanical structure is configured to lower the wafer chuck with a downward acceleration that exceeds an acceleration of gravity. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the mechanical structure is configured to repeat a plurality of cycles, wherein the wafer chuck is raised and lowered by the mechanical structure in each cycle. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the wafer chuck includes an electronic chuck. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the nozzle is configured to dispense a photoresist developer solution as the solution. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the mechanical structure includes a motor configured to rotate the wafer chuck. ### Claim 8 (depends on 1) The apparatus of claim 1, wherein: the nozzle is configured to dispense the solution during a developing stage of a photolithography process; and the mechanical structure is configured to rotate the wafer chuck during a spin drying stage of the photolithography process. ### Claim 9 (depends on 1) The apparatus of claim 1, further comprising an exhaust component configured to remove the solution dispensed on the wafer through a suction force. ### Claim 10 (depends on 1) The apparatus of claim 1, further comprising a rinsing component configured to dispense a cleaning solution to the second side of the wafer. ### Claim 11 An apparatus for fabricating a semiconductor device, comprising: a wafer stage for securing a wafer; a dispensing mechanism for dispensing a photoresist developer solution on a first surface of the wafer; and a motor coupled to the wafer stage, the motor being configured to simultaneously spin the wafer stage in a horizontal direction and lower the wafer stage in a vertical direction, wherein motor is configured to lower the wafer stage at an acceleration greater than about 9.8 meters/second. ### Claim 12 (depends on 11) The apparatus of claim 11, wherein the motor is further configured to raise the wafer stage vertically while it is being spun. ### Claim 13 (depends on 12) The apparatus of claim 12, wherein a first speed at which the wafer stage is lowered is substantially greater than a second speed at which the wafer stage is raised. ### Claim 14 (depends on 11) The apparatus of claim 11, further comprising an exhaust component for sucking the developer solution from the surface of the wafer. ### Claim 15 (depends on 11) The apparatus of claim 11, further comprising a rinsing component for rinsing a second surface of the wafer that is opposite the first surface. ### Claim 16 An apparatus for fabricating a semiconductor device, comprising: a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto, the wafer having a front surface and a back surface; a dispenser that is operable to dispense a liquid to the front surface of the wafer; and a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated. ### Claim 17 (depends on 16) The apparatus of claim 16, wherein the mechanical structure is operable to move the wafer chuck downwards at an acceleration faster than an acceleration of gravity. ### Claim 18 (depends on 16) The apparatus of claim 16, wherein the mechanical structure is operable to move the wafer chuck upwards vertically while the wafer chuck is being rotated. ### Claim 19 (depends on 16) The apparatus of claim 16, wherein: the wafer chuck includes an electronic chuck; the mechanical structure includes a motor; and the dispenser is operable to dispense a photoresist developer solution as the liquid. ### Claim 20 (depends on 16) The apparatus of claim 16, further comprising an exhaust device disposed proximate to the wafer, the exhaust device being operable to suck the liquid on the wafer into the exhaust device.