# US 2014/0190633 A1 · Substrate cleaning apparatus and polishing apparatus

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- Number: US 2014/0190633 A1
- Document ID: US20140190633A1
- Status: Published application
- Kind: A1
- Application number: 14/043,379
- Filed: 2013-10-01
- Published: 2014-07-10
- Earliest claimed: 2012-10-02
- Assignees: Ebara Corporation
- Applicants: Ebara Corporation
- Inventors: Koji Maeda; Hiroshi Shimomoto; Hisajiro Nakano; Masayoshi Imai; Yoichi Shiokawa
- Web page: https://patentgrep.com/patent/US20140190633A1

## CPC

- H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting}
- B24B 37/04: designed for working plane surfaces
- B24B 37/34: Accessories
- H10P 50/00: Etching of wafers, substrates or parts of devices
- H10P 72/0404: {for general liquid treatment, e.g. etching followed by cleaning}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0472: {comprising at least one polishing chamber}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS

## Abstract

A substrate cleaning apparatus capable of efficiently cleaning a substrate, such as a wafer, is provided. The substrate cleaning apparatus includes: a substrate holder for holding and rotating a substrate; a chemical liquid nozzle for supplying a chemical liquid onto the substrate; a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate. The chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.

## Claims

### Claim 1

A substrate cleaning apparatus, comprising:
a substrate holder for holding and rotating a substrate;
a chemical liquid nozzle for supplying a chemical liquid onto the substrate;
a two-fluid nozzle for supplying a two-fluid jet onto the substrate; and
a moving mechanism for moving the chemical liquid nozzle and the two-fluid nozzle together from a center to a periphery of the substrate,
wherein the chemical liquid nozzle and the two-fluid nozzle are adjacent to each other with a predetermined distance therebetween, and
the chemical liquid nozzle is located forward of the two-fluid nozzle with respect to a movement direction of the chemical liquid nozzle and the two-fluid nozzle.

### Claim 2 (depends on 1)

The substrate cleaning apparatus according to claim 1, wherein the moving mechanism includes:
an arm for holding the chemical liquid nozzle and the two-fluid nozzle; and
an arm rotating device for causing the arm to pivot.

### Claim 3 (depends on 1)

The substrate cleaning apparatus according to claim 1, wherein a movement speed of the chemical liquid nozzle and the two-fluid nozzle is lowered gradually as the chemical liquid nozzle and the two-fluid nozzle approach the periphery of the substrate.

### Claim 4 (depends on 1)

A polishing apparatus, comprising:
a polishing section for polishing a substrate; and
the substrate cleaning apparatus according to claim 1 for cleaning the polished substrate.