# US 2014/0190621 A1 · Method of manufacturing display device

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- Number: US 2014/0190621 A1
- Document ID: US20140190621A1
- Status: Published application
- Kind: A1
- Application number: 14/139,997
- Filed: 2013-12-24
- Published: 2014-07-10
- Earliest claimed: 2013-01-08
- Assignees: Japan Display Inc.
- Applicants: Japan Display Inc.
- Inventors: Yasushi KAWATA; Akio Murayama
- Web page: https://patentgrep.com/patent/US20140190621A1

## CPC

- G02F 1/133351: {Manufacturing of individual cells out of a plurality of cells, e.g. by dicing}
- B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)}
- B23K 26/18: using absorbing layers on the workpiece, e.g. for marking or protecting purposes
- B23K 26/40: taking account of the properties of the material involved
- B23K 26/57: the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
- B32B 27/281: {comprising polyimides}
- B32B 38/10: Removing layers, or parts of layers, mechanically or chemically
- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- B23K 2103/172: {wherein at least one of the layers is non-metallic}
- B32B 2457/206: Organic displays, e.g. OLED
- G02F 1/1333: Constructional arrangements; {Manufacturing methods}(G02F1/135, G02F1/136 take precedence)
- G02F 1/13613: {the semiconductor element being formed on a first substrate and thereafter transferred to the final cell substrate}
- G02F 1/1368: in which the switching element is a three-electrode device {(G02F1/136277 takes precedence)}
- G02F 2201/121: common or background
- G02F 2201/123: pixel
- H10K 59/1201: {Manufacture or treatment}
- H10K 59/126: Shielding, e.g. light-blocking means over the TFTs
- H10K 59/38: comprising colour filters or colour changing media [CCM]
- H10K 59/8792: {comprising light absorbing layers, e.g. black layers}
- H10K 71/80: using temporary substrates
- H10K 71/851: {Division of substrate}
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

According to one embodiment, a method of manufacturing a display device, includes preparing a first substrate in which a first display element part, a first extension part, a second display element part, and a second extension part, are formed, preparing a second substrate in which a first peeling auxiliary layer, a second peeling auxiliary layer, a sacrifice layer, a first color filter layer, and a second color filter layer, are formed, attaching the first substrate and the second substrate, and radiating a laser beam on the second substrate, and peeling a second support substrate from the first peeling auxiliary layer and the second peeling auxiliary layer while blocking the laser beam by the sacrifice layer.

## Claims

### Claim 1

A method of manufacturing a display device, comprising:
preparing a first substrate in which a first display element part including a first display element, a first extension part including a first mounting portion, a second display element part including a second display element, and a second extension part including a second mounting portion are formed, the first display element part and the first extension part being located in a first region above a first support substrate, and the second display element part and the second extension part being located in a second region neighboring the first region above the first support substrate;
preparing a second substrate in which a first peeling auxiliary layer opposed to the first display element part, a second peeling auxiliary layer opposed to the second display element part and spaced apart from the first peeling auxiliary layer, a sacrifice layer opposed to the first extension part and the second extension part, a first color filter layer located above the first peeling auxiliary layer, and a second color filter layer located above the second peeling auxiliary layer, are formed, the first peeling auxiliary layer, the second peeling auxiliary layer, the sacrifice layer, the first color filter layer, and the second color filter layer being located above a second support substrate;
attaching the first substrate and the second substrate in a state in which the first extension part and the second extension part are opposed to the sacrifice layer, the first display element part being attached to the first color filter layer, and the second display element part being attached to the second color filter layer; and
radiating a laser beam on the second substrate, and peeling the second support substrate from the first peeling auxiliary layer and the second peeling auxiliary layer while blocking the laser beam by the sacrifice layer.

### Claim 2 (depends on 1)

The method of claim 1, wherein the first peeling auxiliary layer and the second peeling auxiliary layer are formed of a material consisting mainly of polyimide, and the sacrifice layer is formed of a material which consists mainly of polyimide and in which a coloring material having a higher energy absorption efficiency of the laser beam than the first peeling auxiliary layer and the second peeling auxiliary layer is dispersed.

### Claim 3 (depends on 1)

The method of claim 1, wherein each of the first color filter layer and the second color filter layer includes a red color filter, a green color filter, a blue color filter and a black matrix, and the sacrifice layer is formed of the same material, and at the same time, as the black matrix.

### Claim 4 (depends on 1)

The method of claim 1, wherein a thickness of the sacrifice layer is less than a thickness of each of the first peeling auxiliary layer and the second peeling auxiliary layer.

### Claim 5 (depends on 1)

The method of claim 1, wherein in a step of preparing the first substrate, a third peeling auxiliary layer, which continuously extends over the first region and the second region above the first support substrate, is formed, and then the first display element part and the first extension part are formed in the first region above the third peeling auxiliary layer, and the second display element part and the second extension part are formed in the second region above the third peeling auxiliary layer.

### Claim 6 (depends on 5)

The method of claim 5, further comprising:
cutting the first substrate between the first region and the second region, after peeling the second support substrate; and
radiating a laser beam on the first substrate in each of the first region and the second region which are cut, and peeling the first support substrate from the third peeling auxiliary layer.

### Claim 7 (depends on 1)

The method of claim 1, wherein in a step of preparing the first substrate, a third peeling auxiliary layer and a fourth peeling auxiliary layer, which is spaced apart from the third peeling auxiliary layer, are formed above the first support substrate, and then the first display element part and the first mounting portion are formed above the third peeling auxiliary layer, and the second display element part and the second mounting portion are formed above the fourth peeling auxiliary layer.

### Claim 8 (depends on 7)

The method of claim 7, further comprising peeling the first support substrate from the third peeling auxiliary layer and the fourth peeling auxiliary layer by radiating a laser beam on the first substrate.

### Claim 9 (depends on 1)

The method of claim 1, wherein the sacrifice layer is formed of a metallic material.

### Claim 10 (depends on 9)

The method of claim 9, wherein a thickness of the sacrifice layer is 50 nm to 500 nm.

### Claim 11 (depends on 1)

The method of claim 1, wherein the sacrifice layer is formed of the same material, and at the same time, as a first peripheral light-shield layer covering an end face of the first peeling auxiliary layer and a second peripheral light-shield layer covering an end face of the second peeling auxiliary layer, and the sacrifice layer is continuous with each of the first peripheral light-shield layer and the second peripheral light-shield layer.