# US 2014/0190565 A1 · Polymer/inorganic multi-layer encapsulation film

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- Number: US 2014/0190565 A1
- Document ID: US20140190565A1
- Status: Published application
- Kind: A1
- Application number: 14/149,852
- Filed: 2014-01-08
- Published: 2014-07-10
- Earliest claimed: 2013-01-09
- Assignees: Research & Business Foundation Sungkyunkwan University
- Applicants: Research & Business Foundation Sungkyunkwan University
- Inventors: Dong Geun JUNG; Heeyeop CHAE; Min Woo PARK; Hoon Bae KIM; Chae Min LEE
- Web page: https://patentgrep.com/patent/US20140190565A1

## CPC

- H10K 10/88: Passivation; Containers; Encapsulations
- H10K 30/88: Passivation; Containers; Encapsulations
- H10K 77/111: {Flexible substrates}
- H10K 59/8731: {multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers}
- H10K 2102/311: {Flexible OLED}
- Y02E 10/549: Organic PV cells
- Y10T 428/269: including synthetic resin or polymer layer or component
- Y10T 428/31507: Of polycarbonate
- Y10T 428/31663: As siloxane, silicone or silane
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

This invention relates to a polymer/inorganic multi-layer encapsulation film, and more particularly, to a multi-layer encapsulation film, which includes a plasma polymer thin film layer formed using a cross-shaped precursor having Si—O bonding and an inorganic thin film layer, and ensures flexibility and has improved encapsulation.

## Claims

### Claim 1

A multi-layer encapsulation film, comprising:
a plasma polymer thin film layer formed by using a precursor represented by Chemical Formula 1 below; and
an inorganic thin film layer:
wherein R1 to R12 are each independently H or C1-C5 alkyl.

### Claim 2 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the precursor is tetrakis(trimethylsilyloxy)silane.

### Claim 3 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the inorganic thin film layer is stacked on either or both surfaces of the plasma polymer thin film layer.

### Claim 4 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the plasma polymer thin film layer is stacked between inorganic thin film layers.

### Claim 5 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the plasma polymer thin film layer is formed by plasma enhanced chemical vapor deposition (PECVD).

### Claim 6 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the inorganic thin film layer is formed by atomic layer deposition.

### Claim 7 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the inorganic thin film layer comprises Al2O3, SiO2, TiO2, ZnO or combinations thereof.

### Claim 8 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the plasma polymer thin film layer has a thickness of 10-200 nm.

### Claim 9 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the inorganic thin film layer has a thickness of 1-50 nm.

### Claim 10 (depends on 1)

The multi-layer encapsulation film of claim 1, wherein the multi-layer encapsulation film is stacked on a flexible polymer substrate.

### Claim 11

A method of manufacturing a multi-layer encapsulation film, comprising:
1) depositing a plasma polymer thin film layer using a precursor represented by Chemical Formula 1 below; and
2) depositing an inorganic thin film layer using an inorganic precursor:
wherein R1 to R12 are each independently H or C1-C5 alkyl.

### Claim 12 (depends on 1)

An organic electronic device, comprising a substrate and an organic electronic device layer formed thereon, wherein an organic layer(s) is encapsulated by the multi-layer encapsulation film of claim 1.

### Claim 13 (depends on 12)

The organic electronic device of claim 12, wherein the organic electronic device layer includes a transparent conductive oxide, an organic layer and a metal electrode.

### Claim 14 (depends on 12)

The organic electronic device of claim 12, wherein the substrate is
any one flexible polymer substrate selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene (PE), polyethersulfone (PES), polycarbonate (PC), polyarylate (PAR) and polyimide (PI),
any one metal substrate selected from the group consisting of SUS (steel use stainless), aluminum, steel and copper, or
a glass substrate.

### Claim 15 (depends on 12)

The organic electronic device of claim 12, wherein the organic electronic device is an organic light emitting diode, an organic solar cell or an organic thin film transistor.