# US 2014/0190530 A1 · Substrate cleaning apparatus and polishing apparatus

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2014/0190530 A1
- Document ID: US20140190530A1
- Status: Published application
- Kind: A1
- Application number: 14/043,419
- Filed: 2013-10-01
- Published: 2014-07-10
- Earliest claimed: 2012-10-03
- Assignees: Ebara Corporation
- Applicants: Ebara Corporation
- Inventors: Koji Maeda; Hiroshi Shimomoto; Hisajiro Nakano
- Web page: https://patentgrep.com/patent/US20140190530A1

## CPC

- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A substrate cleaning apparatus capable of preventing a cleaning vessel from being corroded by a chemical liquid while constituting the cleaning vessel with a low-price material is provided. The substrate cleaning apparatus includes: a cleaning vessel for holding a substrate therein; a substrate holder arranged in the cleaning vessel; a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel. The inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.

## Claims

### Claim 1

A substrate cleaning apparatus, comprising:
a cleaning vessel for holding a substrate therein;
a substrate holder arranged in the cleaning vessel;
a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder; and
a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel,
the inner surface of the cleaning vessel having been subjected to a hydrophilization treatment.

### Claim 2 (depends on 1)

The substrate cleaning apparatus according to claim 1, wherein the plurality of cleaning liquid nozzles are arranged along an entire circumference of the substrate held by the substrate holder.

### Claim 3 (depends on 1)

The substrate cleaning apparatus according to claim 1, wherein the plurality of cleaning liquid nozzles are located above the substrate held by the substrate holder.

### Claim 4 (depends on 1)

The substrate cleaning apparatus according to claim 1, wherein the plurality of cleaning liquid nozzles are arranged so as to form a film of the cleaning liquid surrounding an entire circumference of the substrate held by the substrate holder.

### Claim 5 (depends on 1)

The substrate cleaning apparatus according to claim 1, further comprising:
an oscillation mechanism for causing the plurality of cleaning liquid nozzles to oscillate.

### Claim 6 (depends on 1)

The substrate cleaning apparatus according to claim 1, wherein the hydrophilization treatment is one or a combination of a surface roughening process, a hydrophilic material coating, and a plasma surface modification.

### Claim 7 (depends on 1)

A polishing apparatus, comprising:
a polishing section for polishing a substrate; and
the substrate cleaning apparatus according to claim 1 for cleaning the polished substrate.

### Claim 8

A substrate cleaning apparatus, comprising:
a cleaning vessel for holding a substrate therein;
a substrate holder arranged in the cleaning vessel;
a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder;
a plurality of cleaning liquid nozzles for supplying a cleaning liquid onto an inner surface of the cleaning vessel; and
an oscillation mechanism for causing the plurality of cleaning liquid nozzles to oscillate.

### Claim 9 (depends on 8)

The substrate cleaning apparatus according to claim 8, wherein the plurality of cleaning liquid nozzles are arranged along an entire circumference of the substrate held by the substrate holder.

### Claim 10 (depends on 8)

The substrate cleaning apparatus according to claim 8, wherein the plurality of cleaning liquid nozzles are located above the substrate held by the substrate holder.

### Claim 11 (depends on 8)

The substrate cleaning apparatus according to claim 8, wherein the plurality of cleaning liquid nozzles are arranged so as to form a film of the cleaning liquid surrounding an entire circumference of the substrate held by the substrate holder.

### Claim 12 (depends on 8)

The substrate cleaning apparatus according to claim 8, wherein the inner surface of the cleaning vessel has been subjected to a hydrophilization treatment.

### Claim 13 (depends on 12)

The substrate cleaning apparatus according to claim 12, wherein the hydrophilization treatment is one or a combination of a surface roughening process, a hydrophilic material coating, and a plasma surface modification.

### Claim 14 (depends on 8)

A polishing apparatus, comprising:
a polishing section for polishing a substrate; and
the substrate cleaning apparatus according to claim 8 for cleaning the polished substrate.