# US 2014/0190513 A1 · Apparatus and method for treating substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2014/0190513 A1 - Document ID: US20140190513A1 - Status: Published application - Kind: A1 - Application number: 14/146,314 - Filed: 2014-01-02 - Published: 2014-07-10 - Earliest claimed: 2013-01-04 - Assignees: Psk Inc. - Applicants: Psk Inc. - Inventors: Jongjin Lee; Bum Joon Park; Tae Hoon Kim; Chang Weon Lee; Sunwoong Yim; Han Kyu Lee - Web page: https://patentgrep.com/patent/US20140190513A1 ## CPC - H10P 70/12: {by dry cleaning only (H10P70/52 takes precedence)} - H01J 37/32192: {Microwave generated discharge (H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence)} - H01J 37/32779: {of batches of workpieces} - H10P 70/30: {Cleaning after the substrates have been singulated} - H10P 72/1921: {characterised by substrate supports} - H10P 72/3402: {Mechanical parts of transfer devices} - H10P 72/74: {using temporarily an auxiliary support} - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance} - H10P 72/7416: {used during dicing or grinding} - H10P 72/7422: {used to protect an active side of a device or wafer} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract Provided is a substrate treatment apparatus. The substrate treatment apparatus includes a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed, a plasma treatment unit supplying plasma to treat a top surface of the wafer, and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit. ## Claims ### Claim 1 A substrate treatment apparatus comprising: a load port on which a carrier accommodating a plurality of substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed; a plasma treatment unit supplying plasma to treat a top surface of the wafer; and a substrate transfer unit transferring the substrate between the carrier and the plasma treatment unit. ### Claim 2 (depends on 1) The substrate treatment apparatus of claim 1, wherein the plasma treatment unit comprises: a process chamber having an inner space; a susceptor disposed within the process chamber to support each of the substrates; a plasma supply part supplying plasma into the process chamber; and a blocking member covering the mounting tape to prevent the mounting tape from being exposed to the plasma. ### Claim 3 (depends on 2) The substrate treatment apparatus of claim 2, wherein the blocking member comprises: a blocking ring covering a region between the wafer and the frame ring, the blocking ring non-contacting the mounting tape; and an elevation member elevating the blocking ring. ### Claim 4 (depends on 3) The substrate treatment apparatus of claim 3, wherein the blocking ring comprises: a body having a ring shape to face the mounting tape; an inner portion extending downward from the inside of the body, the inner portion having an end contacting an edge of the wafer; and an outer portion extending downward from the outside of the body, the outer portion having an end contacting the frame ring. ### Claim 5 (depends on 3) The substrate treatment apparatus of claim 3, wherein the blocking ring comprises: a body having a ring shape to face the mounting tape; an inner portion extending downward from the inside of the body, the inner portion being spaced a predetermined distance from the top surface of the wafer; and an outer portion extending downward from the outside of the body, the outer portion having an end contacting the frame ring. ### Claim 6 (depends on 4) The substrate treatment apparatus of claim 4, wherein the blocking ring has a width that covers a region from the edge of the wafer to an outer edge of the frame ring. ### Claim 7 (depends on 3) The substrate treatment apparatus of claim 3, wherein the blocking ring is formed of a ceramic material. ### Claim 8 (depends on 3) The substrate treatment apparatus of claim 3, wherein the elevation member comprises: a first rod supporting the blocking ring; a second rod disposed on a lower portion of the first rod to support the first rod, the second rod having an inner space in which the first rod is elevatable; a third rod disposed on a lower portion of the second rod to support the second rod, the third rod having an inner space in which the second rod is elevatable; and a driver individually driving the first and second rods, wherein a support piece for seating the substrate on the susceptor in a state where the support piece supports the frame ring is disposed on the second rod, and an accommodation space in which the support piece is vertically movable is defined in an edge of the susceptor. ### Claim 9 (depends on 8) The substrate treatment apparatus of claim 8, wherein the accommodation space is defined inward from an outer surface of the susceptor up to a point at which an edge of the wafer is disposed. ### Claim 10 (depends on 1) The substrate treatment apparatus of claim 1, wherein the substrate transfer unit comprises a transfer robot comprising a hand part for grasping a portion of the frame ring in a tong manner, the transfer robot transferring the substrate. ### Claim 11 (depends on 10) The substrate treatment apparatus of claim 10, wherein the hand part comprises: a lower hand on which a portion of the frame ring is placed; an upper hand disposed above the lower hand, the upper hand pressing the frame ring placed on the lower hand to fix the frame ring; and a driver moving the upper hand so that the upper hand is spread or folded with respect to the lower hand. ### Claim 12 (depends on 11) The substrate treatment apparatus of claim 11, wherein a front end of the lower hand has an arc shape having the same curvature as the frame ring. ### Claim 13 A substrate treatment apparatus comprising: a process chamber having an inner space; a susceptor disposed within the process chamber and on which a substrate to which a back-ground wafer is attached to a mounting tape fixed to a frame ring is placed; a plasma supply part supplying a plasma gas into the process chamber; a blocking ring covering the mounting tape exposed to the outside in a region of the substrate placed on the susceptor; and an elevation member elevating the blocking ring. ### Claim 14 (depends on 13) The substrate treatment apparatus of claim 13, wherein the blocking ring covers a region between the wafer and the frame ring in the region of the substrate and non-contacts mounting tape. ### Claim 15 (depends on 14) The substrate treatment apparatus of claim 14, wherein the blocking ring has a width that covers a region from an edge of the wafer to an outer edge of the frame ring. ### Claim 16 (depends on 14) The substrate treatment apparatus of claim 14, wherein the blocking ring has an inner end contacting a top surface of the wafer and an outer end contacting a top surface of the frame ring. ### Claim 17 (depends on 14) The substrate treatment apparatus of claim 14, wherein the blocking ring has an inner end spaced a predetermined distance from a top surface of the wafer and an outer end contacting a top surface of the frame ring. ### Claim 18 (depends on 13) The substrate treatment apparatus of claim 13, wherein the elevation member comprises: a moving rod, an upper end of the moving rod coupled to the blocking ring; and a driver elevating the moving rod, wherein a support piece supporting the frame ring and descending together with the moving rod to seat the substrate on the susceptor is coupled to the moving rod, and an accommodation space in which the support piece is elevatable is defined in an edge of the susceptor. ### Claim 19 A substrate treatment method comprising: transferring a substrate, to which a back-ground wafer is attached to a mounting tape fixed to a frame ring, into a process chamber; seating the substrate on a susceptor disposed within the process chamber; and supplying plasma into the process chamber to treat a top surface of the wafer. ### Claim 20 (depends on 19) The substrate treatment method of claim 19, wherein the substrate placed on the susceptor is covered by a blocking ring to prevent the mounting tape from being exposed to the plasma. ### Claim 21 (depends on 20) The substrate treatment method of claim 20, wherein the blocking ring has a ring shape to cover a region between the wafer and the frame ring. ### Claim 22 (depends on 21) The substrate treatment method of claim 21, wherein the blocking ring covers a region from an edge of the wafer to an outer edge of the frame ring. ### Claim 23 (depends on 20) The substrate treatment method of claim 20, wherein the blocking ring has an inner end contacting the wafer. ### Claim 24 (depends on 20) The substrate treatment method of claim 20, wherein the blocking ring has an inner end spaced a predetermined distance from the wafer. ### Claim 25 (depends on 19) The substrate treatment method of claim 19, wherein the seating of the substrate on the susceptor comprises falling a support piece down as a moving rod descends in a state where the frame ring is placed on the support piece coupled to the moving rode elevating the blocking ring. ### Claim 26 (depends on 19) The substrate treatment method of claim 19, wherein the transfer robot transfers the substrate in a state where a hand part grasps a portion of the frame ring in a tong manner. ### Claim 27 An apparatus for treating a substrate to which a back-ground wafer is attached to a mounting tape fixed to a frame ring, the apparatus comprising: a transfer robot comprising a hand part grasping a portion of the frame ring in a tong manner, the transfer robot transferring the substrate. ### Claim 28 A method for treating substrates to which a back-ground wafer is attached to a mounting tape fixed to a frame ring, the method comprising: allowing a hand part of a transfer robot to pick-up one of the substrates from a carrier in which the substrates are stacked, wherein the hand part grasps a portion of the frame ring in a tong manner to pick-up the substrates.